AZ23C30 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> diode> AZ23C30

AZ23C30: DescriptionZener Diode, 30V V(Z), 5%, 0.3W; CategoryDiscrete semiconductor diode; File Size532KB，2 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Parametric View All

AZ23C30 Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	AZ23C30	-	-	View	Buy Now

AZ23C30 Overview

Zener Diode, 30V V(Z), 5%, 0.3W

AZ23C30 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	JCET
Reach Compliance Code	unknown
ECCN code	EAR99
Diode type	ZENER DIODE
Maximum dynamic impedance	80 Ω
Maximum operating temperature	150 °C
Maximum power dissipation	0.3 W
Nominal reference voltage	30 V
surface mount	YES
Maximum voltage tolerance	5%
Working test current	5 mA

AZ23C30 Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

SOT-23 Plastic-Encapsulate Diode

FEATURES

AZ23C2V7-AZ23C39

ZENER DIODE

∙

Dual zeners in common anode configuration.

300mW power dissipation rating.

Ideally suited for automatic insertion.

△Vz

for both diodes in one case is ≤5%.

Common cathode style available see DZ series.

Also available in lead free version.

SOT-23

∙

Maximum Ratings(T

= 25℃ unless otherwise specified)

Characteristic

Forward Voltage

Power Dissipation

Thermal Resistance

from

Junction to Ambient

Junction

Temperature

Storage Temperature Range

@ I

= 10mA

Symbol

θJA

STG

Value

0.9

300

417

150

-55~+150

Unit

℃

B,Oct,2013

Recommended Resources

This application circuit of LM135-235-335

Electromechanical Control Regulated Power Supply Circuit with Simple Control Circuit

80W power factor pre-converter circuit

Simple light-controlled pulse counter circuit

Optocoupler linear isolation amplifier 3650

875p computer motherboard circuit diagram_062

Share: TI headphone amplifier positive and negative voltage design: [i=s]This post was last edited by qwqwqw2088 on 2019-4-13 22:02[/i] [font=Arial, PingFang SC, Hiragino Sans GB, Microsoft YaHei, WenQuanYi Micro Hei, sans-serif][size=4][color=#333333]Share a Hi-Fi he...; qwqwqw2088 Analogue and Mixed Signal

EEWORLD University Hall ---- Digital Image Processing Tianjin University of Technology: Digital Image Processing Tianjin University of Technology : https://training.eeworld.com.cn/course/5044Introduces various digital image processing algorithm analysis and programming implementation tec...; 老白菜 DIY/Open Source Hardware

Share CC2541 Bluetooth clock settings: CC2541 has four oscillators, namely:32MHz external crystal 16MHz internal RC oscillator 32kHz external crystal 32kHz internal RC oscillatorFrom this we can see that CC2541 has its own oscillator, that...; fish001 Wireless Connectivity

Analysis of the structure and working principle of single chip microcomputer serial communication: Serial communication is a method of data transmission. This method is simple to operate, has few connections, and has a long transmission distance. Therefore, it has been widely used in information tr...; Jacktang Microcontroller MCU

Basic functions of linear charger: Charger requirements continue to evolve with the emergence of innovative applications, emerging technologies and new battery chemistries. For example, new applications in the wearables space, such as ...; qwqwqw2088 Analogue and Mixed Signal

A place that I don't understand: [font="][size=36.0pt][img=402,311]file:///C:/Users/MC/AppData/Local/Temp/msohtml1/01/clip_image002.jpg[/img][/size][ /font]...; msddw Analog electronics

Popular Components