PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.
If you want to draw PCB in orcad, you need to understand the concept of class and subclass. The subclass is a bit like the layer in AD and PADS, but it is not exactly the same. For example: Package Ge...
The MAX9814is a low-cost, high-performance microphone amplifier with automatic gain control (AGC) and low-noise microphone bias. The device features a low-noise front-end amplifier, a variable gain am...
A man was concentrating on his computer. His mother pushed the door open and handed him a glass of water. He looked at the glass blankly and asked thoughtfully: "Mom, did you copy it or move it?"...
The development of IoT technology has brought changes to all walks of life, business models and people's life experience. In this seminar, Thundercomm will introduce how to use multi-technological inn...
With the extension and deepening of the human information technology revolution and the increasing popularity of new technologies, semiconductor chips are increasingly widely used in various fields, ...[Details]
Last October, Samsung’s chip factory officially began producing chips using its 7LPP (7nm Low Power Plus) manufacturing process, and it has not slowed down the development of its manufacturing techno...[Details]
The National Bureau of Statistics released the 2022 National Economic and Social Development Statistical Bulletin (hereinafter referred to as the "Statistical Bulletin") on February 28. According t...[Details]
Engineers have achieved a major breakthrough in semiconductor thermal management by discovering a new heat transfer mode using surface plasmon polaritons (SPP). This novel method improves heat dissip...[Details]
Recently, Yole Développement released the Advanced Packaging Technology Report for the first quarter of 2022. Gabriela Pereira, Semiconductor, Memory & Computing Technology & Market Analyst and Packa...[Details]
According to Taiwan media Commercial Times, although the chip length and shortage problems in the electronic product supply chain have caused shipment delays and a cooling of terminal demand, the sup...[Details]
On June 12, Japan's advanced foundry Rapidus announced earlier this month that it will expand its cooperation with IBM in the 2nm process from the front end to the back end to jointly develop chipl...[Details]
Beijing time, April 13 morning news, according to reports, on Monday, after Nvidia plans to produce server CPUs based on ARM technology, Intel's stock price closed down 4.18%. At the same time, Nvidi...[Details]
According to news on September 28, Qualcomm announced in March last year that it had acquired CPU design company Nuvia for US$1.4 billion, and is expected to launch a self-developed mobile phone call...[Details]
Marvell recently announced that it will cooperate in depth with TSMC to jointly launch a 2nm chip platform suitable for data centers and artificial intelligence applications. The launch of this break...[Details]
The Semiconductor Industry and Equipment Association (SEMI) recently released a report predicting that the global semiconductor equipment output value will reach US$95.3 billion this year and will ju...[Details]
Micron Technology Inc, the largest U.S. maker of computer memory chips, said on Tuesday that the growing crisis in Ukraine is further highlighting the complexity and fragility of the semiconductor su...[Details]
On April 8, according to South Korean electronics industry media TheElec, Samsung Electronics successfully won Nvidia's 2.5D packaging order. Sources revealed that Samsung's advanced packaging (AVP...[Details]
New facility in New York, USA, expands Wolfspeed manufacturing capacity to meet surging demand for SiC devices in a variety of applications from automotive to industrial Durham, North Carolina and ...[Details]
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