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Over the past year, global semiconductor production capacity has been tight, and chip manufacturers such as TSMC have also been actively expanding their production capacity. Equipment such as lithogr...[Details]
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The China Semiconductor Industry Association issued a statement stating that on October 7, 2022, the U.S. Department of Commerce announced two new export control regulations on the grounds of safegua...[Details]
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According to Korean media reports, NVIDIA recently publicly confirmed that the next-generation GPU chip code-named "Ampere" will be manufactured by Samsung in South Korea, using its latest 7nm EUV ex...[Details]
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Major semiconductor manufacturers looking to expand in Arizona may be left without water, at least for now, by the Southwest’s unprecedented water shortage. In fact, Intel and TSMC are both planning ...[Details]
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According to Jiangsu news reports, the first physical intellectual property operation platform in the country's semiconductor field, the Semiconductor Industry Intellectual Property Operation Center,...[Details]
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Tektronix joins hands with the Third Generation Semiconductor Industry Technology Innovation Strategic Alliance Standardization Committee (CASAS) Overcoming the challenges of third-generation semic...[Details]
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Beijing time, June 17th morning news, TSMC executives said on Thursday that TSMC will obtain the next generation of more advanced chip manufacturing tools from ASML of the Netherlands in 2024. The...[Details]
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In the early morning of August 10, US President Biden signed an executive order to establish a foreign investment review mechanism to restrict US entities from investing in China's semiconductor and ...[Details]
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On May 14, HBM head Kim Gwi-wook recently claimed in an official announcement that the current industry's HBM technology has reached a new level. Industry demand has prompted SK Hynix to accelerate...[Details]
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According to news on March 4, according to TheElec, Samsung is considering applying molded-in-fill (MUF) technology in its next-generation DRAM. Samsung recently tested an MR MUF process for 3D stack...[Details]
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As early as the beginning of 2020, OPPO announced the self-developed chip "Mariana" plan, which was led by the chip TMG (Technical Committee) established in 2019 and provided a large amount of resear...[Details]
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Hemlock Semiconductor Operations (HSC) has announced the acquisition of DuPont's trichlorosilane (TCS) production line, the primary raw material for ultra-pure polysilicon supplied to the semiconduct...[Details]
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December 14, 2021, Shenzhen, China - OPPO 2021 Future Technology Conference (OPPO INNO DAY 2021) was officially opened in Shenzhen a few days ago. OPPO brought a number of heavyweight scientific and ...[Details]
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STMicroelectronics accelerates the application of edge artificial intelligence to help enterprises transform their products into intelligent products • ST Edge AI Suite is a new edge artificial i...[Details]
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STMicroelectronics (ST) recently announced its Q3 2024 financial report, with total revenue of US$3.25 billion, a year-on-year decrease of 26.6%. Net sales revenue from OEM and agency channels decr...[Details]