MLX90393SLW-ABA-014-SP datasheet, PDF

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MLX90393SLW-ABA-014-SP: DescriptionHall Effect Sensor X, Y, Z Axis 16-QFN (3x3); CategoryThe sensor MagneticSensor; File Size707KB，43 Pages; ManufacturerMelexis; Websitehttps://www.melexis.com/zh

MLX90393SLW-ABA-014-SP Overview

Melexis magnetic nodes offer the highest flexibility in the smallest package components in the three-axis product portfolio. In addition, the node is designed for micro power applications and features a programmable duty cycle from 0.1% to 100%, allowing power consumption to be configured based on system requirements. The magnetic field sensor can be reprogrammed on the fly to different modes and different settings to fine-tune performance and power consumption. Simple and robust magnetic design Micro form factor for small components Optional SPI and I2C bus protocols Wide dynamic range with dynamic programmable gain On-board filter settings External and internal acquisition trigger modes External interrupt pin on field change On-board Temperature Sensor

MLX90393SLW-ABA-014-SP Parametric

Parameter Name	Attribute value
category	The sensor;MagneticSensor
Maker	Melexis
series	Automotive, AEC-Q100, Triaxis®
Package	Bulk
technology	Hall Effect
axis	X，Y，Z
Output type	I²C，SPI
Sensing range	-
Voltage - Power supply	2.2V ~ 3.6V
Current - Power Supply (Maximum)	-
Current - Output (maximum)	-
resolution	-
bandwidth	-
Operating temperature	-20°C ~ 85°C（TA）
characteristic	-
Supplier device packaging	16-QFN（3x3）
Installation type	surface mount type
Package/casing	16-VFQFN Exposed Pad
Basic product number	MLX90393

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MLX90393 Triaxis® Magnetic Node

Datasheet

1. Features and Benefits



Absolute Position Sensor IC featuring

Triaxis® Hall Technology

Simple & Robust Magnetic Design

Miniature size for tiny assemblies

Selectable SPI and I

C bus protocols

Wide dynamic range (5-50mT) with on-the-

fly programmable gain

2.2V-3.6V supply for battery powered

applications, down to 1.8V IO voltage

On board filter settings

On the fly programmable operating modes

and sleep times for micro-power use

External and internal acquisition triggering

modes

External interrupt pin when the field

changes

On board temperature sensor

3. Description

The MLX90393 brings the highest flexibility in the

Triaxis portfolio's smallest packaged assembly.

Additionally, the MLX90393 is designed for

micropower applications, with programmable

duty cycles in the range of 0.1% to 100% allowing

for configurable power consumption based on

system requirements.

The MLX90393 magnetic field sensor can be

reprogrammed to different modes and with

different settings at run-time to fine-tune the

performance and power consumed. The sensor

offers a 16-bit output proportional to the

magnetic flux density sensed along the X, Y, and Z

axes using the Melexis proprietary Triaxis

technology and offers a 16-bit temperature

output signal. These digital values are available via

C and SPI, where the MLX90393 is a slave on the

bus. Multiple sensors can be connected to the

same bus, by A

and A

hardwired connection (4x)

but also through ordering codes with different SW

address (4x).

By selecting which axes are to be measured, the

raw data can be used as input for further post-

processing, such as for joystick applications,

rotary knobs, and more complex 3D position

sensing applications. Unparalleled performance is

achieved with this sensor, which is primarily

targeting industrial and consumer applications.

2. Application Examples



Non-contacting HMI applications with

push-pull functionality



Rotary knobs & dials

(Long stroke) Linear motion in one or

two axes for levers & sliding switches

Joystick (gimbal or ball & socket)

Temp Sensor

Bias

DD_IO

State Machine

RAM

EEPROM

SDA/ MOSI

SCL/ SCLK

MISO

MS/ CS

Interrupt

Trigger

MUX

Tria xis

ADC

Control

SPI/ I2C

Interface

Temp Compensation

Oscillator

Low Power

Oscillator

Wake-Up

Home Security 3D closure detection

Accurate liquid level sensing

Factory automation position sensing

Magnetic fingerprint detection

Figure 1: General Block Diagram

REVISION 007 – JAN 14, 2021

3901090393

MLX90393 Triaxis® Magnetic Node

Datasheet

Contents

1. Features and Benefits ............................................................................................................................... 1

2. Application Examples................................................................................................................................ 1

3. Description ............................................................................................................................................... 1

4. Ordering Information ............................................................................................................................... 5

5. Functional Diagram .................................................................................................................................. 6

5.1. QFN-16 Block Diagram ..................................................................................................................... 6

5.2. UTDFN-8 Block Diagram................................................................................................................... 6

6. Glossary of Terms ..................................................................................................................................... 7

7. QFN-16 Pinout .......................................................................................................................................... 8

8. UTDFN-8 Pinout ........................................................................................................................................ 9

9. Absolute Maximum Ratings .................................................................................................................... 10

10. General Electrical Specifications........................................................................................................... 11

11. Thermal Specification ........................................................................................................................... 12

12. Timing Specification ............................................................................................................................. 13

13. Magnetic Specification ......................................................................................................................... 14

13.1. Noise vs Conversion Time ............................................................................................................ 16

14. Mode Selection..................................................................................................................................... 17

14.1. Burst mode ................................................................................................................................... 18

14.2. Single Measurement mode ......................................................................................................... 18

14.3. Wake-Up on Change mode.......................................................................................................... 19

15. Digital Specification .............................................................................................................................. 19

15.1. Command List .............................................................................................................................. 20

15.2. Status Byte ................................................................................................................................... 21

15.3. SPI Communication ...................................................................................................................... 22

15.3.1. Command implementation.................................................................................................... 22

15.3.2. SPI Timing Specification ......................................................................................................... 24

15.4. I

C Communication ...................................................................................................................... 24

15.4.1. Command Implementation.................................................................................................... 25

15.4.2. I

C Timing Specification ......................................................................................................... 27

16. Memory Map ........................................................................................................................................ 28

16.1. General Description ..................................................................................................................... 28

REVISION 007 – JAN 14, 2021

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MLX90393 Triaxis® Magnetic Node

Datasheet

16.2. Parameter Description ................................................................................................................. 30

16.2.1. ANA_RESERVED_LOW............................................................................................................ 31

16.2.2. BIST ......................................................................................................................................... 31

16.2.3. Z_Series .................................................................................................................................. 31

16.2.4. GAIN_SEL[2:0] ........................................................................................................................ 32

16.2.5. HALLCONF[3:0]....................................................................................................................... 33

16.2.6. TRIG_INT_SEL ......................................................................................................................... 33

16.2.7. COMM_MODE[1:0] ................................................................................................................ 33

16.2.8. WOC_DIFF .............................................................................................................................. 33

16.2.9. EXT_TRIG ................................................................................................................................ 34

16.2.10. TCMP_EN ............................................................................................................................. 34

16.2.11. BURST_SEL[3:0] .................................................................................................................... 34

16.2.12. OSR2[1:0] ............................................................................................................................. 34

16.2.13. RES_XYZ[5:0] ........................................................................................................................ 34

16.2.14. DIG_FILT[1:0] ....................................................................................................................... 34

16.2.15. OSR[1:0] ............................................................................................................................... 34

16.2.16. SENS_TC_HT[7:0] ................................................................................................................. 34

16.2.17. SENS_TC_LT[7:0] .................................................................................................................. 35

16.2.18. OFFSET_i[15:0] ..................................................................................................................... 35

16.2.19. WOi_THRESHOLD[15:0] ....................................................................................................... 35

17. Recommended Application Diagram .................................................................................................... 36

1.1 I

C .................................................................................................................................................... 36

1.2 SPI .................................................................................................................................................... 36

18. Packaging Specification ........................................................................................................................ 37

18.1. QFN-16 ......................................................................................................................................... 37

18.1.1. Package dimensions and sensitive spot location .................................................................. 37

18.1.2. QFN-16 - Pinout and Marking ................................................................................................ 38

18.2. UDTFN-8 package......................................................................................................................... 39

18.2.1. Package dimensions and sensitive spot location .................................................................. 39

18.2.2. UTDFN-8 - Pinout and Marking.............................................................................................. 40

19. Standard Information ........................................................................................................................... 40

20. ESD Precautions.................................................................................................................................... 40

21. Revision History .................................................................................................................................... 41

REVISION 007 – JAN 14, 2021

3901090393

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