AS5050A
Low Power 10-Bit Magnetic Position
Sensor
General Description
The AS5050A is a single-chip on-axis magnetic rotary position
sensor with low voltage and low power features.
It includes an integrated Hall element array, a high resolution
ADC and a smart power management controller.
The angle position, alarm bits and magnetic field information
are transmitted over a 3-wire or 4-wire SPI interface to the
microcontroller.
The AS5050A is available in a compact QFN 16-pin 4x4x0.85 mm
package and specified over an operating temperature of -40ºC
to 85ºC.
Ordering Information
and
Content Guide
appear at end of
datasheet.
Key Benefits & Features
The benefits and features of AS5050A, Low Power 10-Bit
Magnetic Position Sensor are listed below:
Figure 1:
Added Value of Using AS5050A
Benefits
Precise and reliable absolute angle measurement
Very low power consumption
High reliability sensing
Synchronization between microcontroller and sensor
Ideal for small and compact designs
Industry-standard interface
Features
10-Bit absolute angle position indication
3μA current consumption in low power mode
Immune to external magnetic stray fields
Interrupt pin displays availability of new data
QFN-16 4x4 package
3- or 4-wire SPI interface
ams Datasheet
[v2-06] 2014-Oct-14
Page 1
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AS5050A −
General Description
Applications
This sensor is optimized for a broad range of demanding
applications including:
• Servo motor control
• Battery operated systems
• Robotics
Block Diagram
The functional blocks of this sensor are
shown below:
Figure 2:
AS5050A Block Diagram
VDD
VDDp WM
AS5050A
SPI
Low Power Management
SS/
SCK
MISO
MOSI
EN_INT/
Hall Sensors
Analog
Front-End
ATAN
(CORDIC)
ADC
INT/
AGC
VSS
Test
Page 2
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ams Datasheet
[v2-06] 2014-Oct-14
AS5050A −
Pin Assignment
Pin Assignment
The AS5050A pin assignments are shown below.
Figure 3:
Pin Diagram
Pin Assignments (Top View):
Package drawing is not to scale.
VSS
13
12
11
INT/
15
16
MOSI
MISO
SCK
SS/
WM
14
NC
1
2
VDD
VDDp
EN_INT/
Test
Epad
3
4
5
6
7
8
10
9
NC
NC
Figure 4:
Pin Description
Pin Number
1
2
3
4
5
6
7
8
9
10
Name
MOSI
MISO
SCK
SS/
NC
NC
Type
Digital input
Digital output, tri-state buffer
Digital input Schmitt trigger
Digital input
SPI bus data input
SPI bus data output
SPI clock
SPI Slave Select, active low
-
NC
NC
Test
EN_INT/
Analog
Digital input
Leave unconnected
Test pin, connect to VSS
Enable interrupt, active low
ams Datasheet
[v2-06] 2014-Oct-14
NC
Description
NC
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AS5050A −
Pin Assignment
Pin Number
11
12
13
14
15
16
Epad
Name
VDDp
VDD
VSS
WM
INT/
NC
-
Type
Description
Peripheral power supply, 1.8V to VDD
Supply
Analog and digital power supply, 3.0V to
3.6V
Ground
Digital I/O
Digital output, tri-state buffer
-
-
Low:
3-wire mode
High:
4-wire mode
Interrupt output. Active LOW, when
conversion is finished
Leave unconnected
Exposed pad, leave unconnected
Page 4
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ams Datasheet
[v2-06] 2014-Oct-14
AS5050A −
Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed in
“Absolute Maximum Ratings” on
page 5
may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at
these or any other conditions beyond those indicated in
“Electrical Characteristics” on page 6
is not implied. Exposure
to absolute maximum rating conditions for periods may affect
device reliability.
Figure 5:
Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Comments
Electrical Parameters
VDD
VDDp
V
IN
I
scr
DC supply voltage
Peripheral supply voltage
Input pin voltage
Input current (latchup
immunity)
-0.3
-0.3
-0.3
-100
5.0
VDD+0.3
5.0
100
V
V
V
mA
Norm: JEDEC 78
Electrostatic Discharge
ESD
Electrostatic discharge
±1
-
kV
Norm: MIL-STD-883 E method
3015
Continuous Power Dissipation
Θ
JA
P
t
Package thermal resistance
Total power dissipation
-
33.5
36
°C/W
mW
Velocity=0, Multi Layer PCB;
JEDEC Standard Testboard
Temperature Ranges and Storage Conditions
T
strg
Storage temperature
-55
125
°C
The reflow peak soldering
temperature (body temperature)
specified is in accordance with
IPC/JEDEC J-STD-020
“Moisture/Reflow Sensitivity
Classification for Non-Hermetic
Solid State Surface Mount
Devices”.
The lead finish for Pb-free leaded
packages is matte tin (100% Sn).
T
BODY
Package body temperature
260
°C
Humidity non-condensing
MSL
Moisture Sensitive Level
5
3
85
%
Represents a maximum floor life
time of 168h
ams Datasheet
[v2-06] 2014-Oct-14
Page 5
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