Part Number | Manufacturer | Description |
---|---|---|
TLV2634IN | Rochester Electronics LLC | Basic information of TLV2634IN amplifier:TLV2634IN is an OPERATIONAL AMPLIFIER. Commonly used packag... |
Basic information of TLV2634INE4 amplifier:
TLV2634INE4 is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are PLASTIC, MS-001AA, DIP-14
TLV2634INE4 amplifier core information:
The minimum operating temperature of the TLV2634INE4 is -40 °C and the maximum operating temperature is 125 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum bias current at 25°C is: 0.00005 µA Its maximum average bias current is 0.0002 µA
How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of TLV2634INE4 is 6 V/us. The maximum slew rate of TLV2634INE4 given by the manufacturer is 5.4 mA. Its minimum voltage gain is 12600. When the op amp is used in a closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the TLV2634INE4 gain becomes 0.707 times the low-frequency gain is 9000 kHz.
The nominal supply voltage of the TLV2634INE4 is 5 V. The power supply range is: +-1.35/+-2.75/2.7/5.5 V. The input offset voltage of the TLV2634INE4 is 5200 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of TLV2634INE4:
The width of TLV2634INE4 is: 7.62 mm and the length is 19.305 mm. TLV2634INE4 has 14 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm. Total pins: 14
TLV2634INE4 amplifier additional information:
TLV2634INE4 adopts the VOLTAGE-FEEDBACK architecture. It belongs to the low-bias class of amplifiers. It does not belong to the low offset class of amplifiers. The frequency compensation status of TLV2634INE4 is: YES. Its temperature grade is: AUTOMOTIVE.
TLV2634INE4 is not Rohs certified. The corresponding JESD-30 code is: R-PDIP-T14. The corresponding JESD-609 code is: e4. The packaging code of TLV2634INE4 is: DIP. The materials used for TLV2634INE4 packaging are mostly PLASTIC/EPOXY.
The package shape is RECTANGULAR. The TLV2634INE4 package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE. The maximum seat height is 5.08 mm.
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