Part Number | Manufacturer | Description |
---|---|---|
TLV2231IDBV | Texas Instruments | OP-AMP, 3000uV OFFSET-MAX, 1.9MHz BAND WIDTH, PDSO5, GREEN, SOT-23, 5 PIN |
TLV2731CDBV | Texas Instruments | Single LinCMOS(TM) Rail-To-Rail Low-Power Operational Amplifier 5-SOT-23 |
TLV2231CDBVR | Texas Instruments | Single LinCMOS Rail-To-Rail uPower Operational Amplifier 5-SOT-23 0 to 70 |
TLV2231IDBVR | Texas Instruments | Single LinCMOS Rail-To-Rail uPower Operational Amplifier 5-SOT-23 -40 to 85 |
TLV2731IDBVR | Texas Instruments | Gain bandwidth product (GBP): 2MHz Number of amplifier groups: 1 Op amp type: General Purpose Power consumption of each channel: - Slew rate (SR): 1.6 V/us Power supply voltage: 2.7V ~ 10V, ±1.35V ~ 5V single LinCMOS® Rail-to-Rail Low Power Op Amp |
TLV2231IDBVT | Texas Instruments | Single LinCMOS Rail-To-Rail uPower Operational Amplifier 5-SOT-23 -40 to 85 |
TLV2731CDBVR | Texas Instruments | Single LinCMOS Rail-To-Rail Low-Power Operational Amplifier 5-SOT-23 0 to 70 |
TLV2731IDBVT | Texas Instruments | Single LinCMOS Rail-To-Rail Low-Power Operational Amplifier 5-SOT-23 |
TLV2231CDBVT | Texas Instruments | Single LinCMOS Rail-To-Rail uPower Operational Amplifier 5-SOT-23 0 to 70 |
TLV2231IDBVRG4 | Texas Instruments | Single LinCMOS Rail-To-Rail uPower Operational Amplifier 5-SOT-23 -40 to 85 |
TLV2731IDBVTG4 | Texas Instruments | Single LinCMOS Rail-To-Rail Low-Power Operational Amplifier 5-SOT-23 |
TLV2731CDBVT | Texas Instruments | Single LinCMOS Rail-To-Rail Low-Power Operational Amplifier 5-SOT-23 |
TLV2231IDBVTG4 | Texas Instruments | Single LinCMOS Rail-To-Rail uPower Operational Amplifier 5-SOT-23 -40 to 85 |
TLV2231CDBVRG4 | Texas Instruments | Single LinCMOS Rail-To-Rail uPower Operational Amplifier 5-SOT-23 0 to 70 |
TLV2731CDBVTG4 | Texas Instruments | Single LinCMOS Rail-To-Rail Low-Power Operational Amplifier 5-SOT-23 |
TLV2731CDBVRG4 | Texas Instruments | Single LinCMOS Rail-To-Rail Low-Power Operational Amplifier 5-SOT-23 0 to 70 |
TLV2231CDBVTG4 | Texas Instruments | Single LinCMOS Rail-To-Rail uPower Operational Amplifier 5-SOT-23 0 to 70 |
TLV2731IDBVRG4 | Texas Instruments | Operational Amplifiers - Op Amps Single LinCMOS Rail-To-Rail Lo-Pwr |
Basic information of TLV2231CDBV amplifier:
TLV2231CDBV is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are GREEN, SOT-23, 5 PIN
TLV2231CDBV amplifier core information:
The minimum operating temperature of the TLV2231CDBV is , and the maximum operating temperature is 70 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum average bias current is 0.00015 µA
How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of TLV2231CDBV is 1.25 V/us. The maximum slew rate of the TLV2231CDBV given by the manufacturer is 1.5 mA. Its minimum voltage gain is 1000. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the TLV2231CDBV gain becomes 0.707 times the low-frequency gain is 1900 kHz. The power of TLV2231CDBV is NO. Its programmable power is NO.
The nominal supply voltage of TLV2231CDBV is 3 V, and its corresponding nominal negative supply voltage is. The input offset voltage of the TLV2231CDBV is 3000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of TLV2231CDBV:
The width of TLV2231CDBV is: 1.6 mm and the length is 2.9 mm. TLV2231CDBV has 5 terminals. Its terminal position type is: DUAL. Terminal pitch is 0.95 mm. Total pins: 5
TLV2231CDBV amplifier additional information:
TLV2231CDBV adopts the VOLTAGE-FEEDBACK architecture. It belongs to the low-bias class of amplifiers. It does not belong to the low offset class of amplifiers. The frequency compensation status of TLV2231CDBV is: YES. Its temperature grade is: COMMERCIAL.
It is a micropower amplifier. TLV2231CDBV does not comply with Rohs certification. The corresponding JESD-30 code is: R-PDSO-G5. The packaging code of TLV2231CDBV is: LSSOP. The materials used in the TLV2231CDBV package are mostly PLASTIC/EPOXY.
The package shape is RECTANGULAR. The TLV2231CDBV package pin forms are: SMALL OUTLINE, LOW PROFILE, SHRINK PITCH. Its terminal forms are: GULL WING. The maximum seat height is 1.45 mm.
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