Actel to begin shipping FPGA samples with mixed analog circuits and flash memory[Copy link]
Actel Corporation of the United States recently announced the first four products of the FPGA series "Fusion" that mix analog circuits and flash memory, and will start shipping samples of one of them. As the selling points of Fusion, the company mentioned small package area, short development cycle and low component cost. This is because the circuit composed of multiple chips such as microcontrollers, analog ICs and external memory can be packaged on a single chip. The company estimated the effect of reducing component costs, which is $31.75 when the number of peripheral components is reduced. In terms of the application fields of the chip, it is envisioned to be used for power management, temperature management, motor control and storage. "In addition to existing FPGA users, we also plan to gradually expand the supply to embedded device developers who are microcontroller users" (Actel). In addition, the company introduced the outline of Fusion in its technical announcement in July 2005.
In terms of the main circuit of Fusion, in addition to the FPGA module for packaging logic circuits and soft CPU cores, it also includes analog circuits such as AD converters and input and output circuits, flash memory for storing data, and oscillators for generating clock signals. The circuit scale and capacity of the four products to be launched are different. For example, the number of system gates of FPGA is 90K gates to 1500K gates, the flash memory capacity is 256KB to 1024KB, and the number of analog signal input channels is 5 to 30. The product
that will be supplied this time is "AFS600". In addition, Actel will also provide Fusion users with a group of development tools. Specifically, it includes "CoreConsole" used when selecting and configuring IP cores packaged on FPGA, and "SmartGen" for specifying analog peripheral circuits and flash memory reconstruction. In addition, the company will start supplying a starter kit (Starter Kit) containing a design environment, evaluation board, and debugger in the near future.
The Fusion series FPGA module is developed based on the company's FPGA "ProASIC3" (see this site report ). All products this time are produced using 130nm process flash memory mixed CMOS technology. (Reporter: Horikiri Kinfumi)