Application and development of FPC flexible circuit boards

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Application and development of FPC flexible circuit boards [Copy link]

1) Technical classification of FPC

Flexible circuit board (FPC board) is a printed circuit made of a flexible insulating substrate. In recent years, the soft circuit structure has become obviously important. Compared with the hard circuit structure, the soft structure has many advantages: 1. Lightweight: In terms of volume and weight, FPC has a great advantage. 2. FPC design flexibility: mainly includes two parts: structure and electrical performance. "]It not only provides excellent electrical performance, but also meets the design needs of smaller and higher density installation.

It has three-dimensional wiring and its appearance can be changed according to the limitations of space. It is suitable for the development of electronic products towards high density, miniaturization and high reliability, so as to achieve the integration of component assembly and wire connection.

[font=-apple-system, BlinkMacSystemFont, 3. Fault tolerance and reliability: In terms of assembly and fault tolerance, many manual errors in wiring harness design can be avoided, and the chances of plugging errors are reduced at the connector level.

4. Cost: From the cost point of view, the cost of FPC itself is not high, and the connection cost is greatly reduced.

2) FPC industry development

As the fastest growing sub-industry in PCB, FPC has an optimistic development momentum. In 2016, the global FPC market size increased to 85.168 billion yuan, and the Chinese market size increased to 31.597 billion yuan; it is estimated that by 2017, the global PCB output value will reach 65.7 billion US dollars, and FPC will account for 23.9% with an output value of 15.7 billion US dollars. Its main customer Apple (the core demander of FPC) is using more and more with the innovation and upgrading of smartphone technology, including 3D cameras, full screens, and accelerated penetration of dual cameras. See the appendix.

The global FPC can be divided into three echelons:

1. High-end FPC represented by Japan Flagship mainly produces high-precision FPC, used in mobile phones and other industries

2. Mid-end FPC is mainly produced by Taiwanese and Korean companies. Although their technical level is lower than that of Japanese companies, their overall export scale has certain competitive advantages

3. China is still mainly engaged in the production of mid- and low-end FPC boards. The production of high-precision FPC and rigid-flexible boards is still in its infancy