PCB Microchip Resin Selection Criteria

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PCB Microchip Resin Selection Criteria [Copy link]

    1. Low peak temperature If the peak temperature is too high, it will cause copper oxidation and affect the observation effect of the slice under the microscope. The powder and liquid will generate heat when mixed. If the temperature is too high, the viscosity will increase, affecting the penetration of micropores. 2. Low shrinkage cold mounting materials will shrink when solidified. At this time, a gap will be generated between the mounting material and the specimen. When the specimen is polished, some abrasives (such as silicon carbide particles on sandpaper) may be embedded in this gap. In the next process, these abrasive particles will be dragged out and produce a deep scratch on the surface of the specimen, affecting the polishing effect. 3. Low viscosity mixed resin has low viscosity, which has good fluidity and helps the resin penetrate into micropores and recessed areas. 4. Transparency The operator needs to see the exact position of the target area of the specimen through the mounting resin. Therefore, the resin is required to have good transparency. 5. Five bubbles After the resin powder and liquid are mixed and solidified, there must be no bubbles. Samples with bubbles are unqualified. Bubbles are black under the microscope and cover the area to be tested. 6. Strength The resin has good strength, which helps demolding and is not easy to crack during operation.