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JasonYoo

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[eNet Silicon Valley News] Metalink, an Israeli company that designs chipsets for VDSL and is a well-known manufacturer in the industry, has successfully developed the RF chip MtW8150 that complies with the IEEE802.11n draft standard for high-speed wireless LANs that is currently being formulated. Samples are now available.

　　This product has two pairs of transceiver circuits and uses the spatial multiplexing technology MIMO (Multiple Input Multiple Output) to achieve a transmission speed of more than 200Mbit/s at the physical layer for the first time. Following FTTH and VDSL, the company hopes to provide a broadband environment for the last 10m. It has entered the high-speed wireless LAN market and plans to start mass production of MtW8150 in the third quarter of 2005. In addition to the MtW8150 this time, a passive component group as an antenna interface and a baseband chip are required to form a transceiver module. The company is developing the baseband chip MtW8170 using CMOS technology and plans to start supplying samples in the third quarter of 2005.

　　This product uses two sets of 20MHz channels at the same time, and when two antennas are used at the transmitting end and three antennas are used at the receiving end, the physical layer transmission speed is up to 200Mbit/s at a communication distance of 10m. When two antennas are used at the transmitting and receiving ends, the data transmission is exactly doubled. Even the actual data transmission speed is said to be more than 150Mbit/s. Compared with the MIMO chipset of Airgo Networks that does not support Channel bonding, the speed is about twice as fast. Metalink claims that only it and Airgo have realized true MIMO, and the beamforming functions and various antenna diversity technologies claimed by other wireless LAN manufacturers are not MIMO.