RF circuit layout principles

JasonYoo

RF circuit layout principles [Copy link]

1.Sirf reference typical four or six layer board, standard FR4 material
2.All components should be surface mounted as much as possible
3.When placing the connector, try to avoid introducing noise into the RF circuit, try to use small connectors, and properly ground
4.All RF devices should be placed closely to make the connection shortest and the crossover minimum (critical)
5.All pins should be strictly in accordance with reference schematic. All IC power pins should have 0.01uf decoupling capacitors,
as close to the pins as possible, and must be connected to the ground and power layers through holes.
6. Reserve shielding space for the RF circuit and baseband part. The shielding should be continuously connected on the board and should be connected to the ground layer
every 100mil (minimum) vias
. 7. The RF circuit and the digital part should be separated on the board.
8. The RF ground should be directly connected to the ground layer with special vias and the shortest wire.
9. TCXO crystal oscillator and crystal oscillator related circuits should be strictly isolated from high slew-rate digital signals.
10. Appropriate test points should be added to the development board.
11. Use the same device for the version in the development process
. 12. Isolate the RTC part from the digital and RF circuit parts. The RTC circuit should be placed on the ground layer as much as possible.