Semiconductor technology boosts the development of China's automotive electronics market
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The year 2004 was a year of profound changes in the Chinese automobile market. Taking the transfer of international automobile engine R&D centers to the Chinese market as an opportunity, it is expected that the localization level and technological innovation level of Chinese automobile parts (especially core parts such as ECU) will be greatly improved, and the internationalization process of China's automotive electronics market will reach a new level. The new changes have prompted us to look at the development level of China's automotive electronics market from a global perspective. At present, Chinese automotive electronics manufacturers are still facing great difficulties in accumulating experience and investing in core technologies. TI experts believe that what China lacks most is automotive electronics engineers who understand the automotive industry and have rich experience in design, application and verification. Therefore, there are still great challenges in the localization of ABS and ECU. Drue Freeman, vice president of global automotive marketing and sales at Philips Semiconductors, said: "Many Chinese automotive electronics companies have a weak foundation and insufficient R&D experience. They still need us to provide training." Zhao Heping, ECU R&D manager of Shanghai Xindai, said that except for the electric power steering system (EPS), China will have no chance in the ECU field within 5 years. According to Mr. Rao of Shenzhen Hangsheng R&D Center, the R&D test costs of ABS and ECU are too expensive and the R&D cycle is too long, which is the key reason why it is difficult for China to enter the automotive electronics industry. Han Daping, senior project manager of TCL's automotive electronics department, agreed with this. He believed that it is easier to gain recognition by using the brand and consumer electronics technology advantages to enter the automotive electronics industry. They will not take on projects that are too difficult for the time being. Figure 1 shows a schematic diagram of the R&D cycle of major automotive projects. As can be seen from the above figure, software development has the shortest cycle and is relatively easy. Therefore, the current practice of Chinese companies in developing automotive electronic systems is to accept commissioned development, and develop software according to user requirements based on hardware system integration or self-developed hardware. Products include: in-vehicle audio-visual equipment (including DVD, MP3, etc.), GPS navigation/electronic maps, security and anti-theft, in-vehicle gateway and computer systems, wired/wireless reversing radar, driving recorder and security monitoring system, electronic compass, tire pressure monitoring (TPMS), electric power/electric doors and windows, etc. Yan Chongguang, technical director/chief product development manager of Shenzhen Qigang Electronics Co., Ltd., believes that among these products, TPMS, car anti-theft system and wireless reversing radar three-in-one system is the development trend in the field of security and anti-theft. In the emerging "green" car field, including fuel cell cars, hybrid electric cars and pure electric cars, China already has more than 200 companies, universities and research institutes, with a total of more than 2,000 scientific and technological personnel developing their own electric car products, thanks to the support of national industrial policies. The 2008 Olympic Games was an opportunity to launch the "green" car market. According to statistics from iSuppli, the mainstream products of China's automotive electronics are CD players, tape players, ABS, airbags, mechanically controlled air conditioners, remote access control systems, and electric doors and windows. As the electronic system configuration of high- and mid-range cars shifts to low- and mid-range cars, the economy car market and below will be the main battlefield for competition in China's automotive electronics market. Yang Fei, director of Freescale's automotive electronics market in Asia Pacific, said: "The demand for improving fuel efficiency and emission standards and body electronic control is the main driving force for the rapid development of China's automotive electronics market." Chris Appleton, Far East marketing manager of Microchip, believes that China's automotive electronics market will continue to develop rapidly in the next 5-7 years. The rapidly developing market has stimulated huge demand for automotive semiconductor devices. iSuppli predicts that the demand for semiconductor devices in China's automotive electronics market before 2007 is shown in Figure 2. China's automotive semiconductor market demand is expected to account for 10% of the world's total, and the market demand for car audio, ECU, ABS, instrument panel, chassis and safety system, body and anti-theft system is expected to increase. This article combines the analysis or forecast of the global automotive electronics market by multiple market research institutions. From five aspects, including in-vehicle infotainment electronic system platform, internal and external interconnection of in-vehicle electronic systems, active vehicle safety, automotive LED lighting and automotive power management, this article takes products and technologies as the main line and combines the views of automotive semiconductor experts to explain the new technologies and hotspots in the field of automotive semiconductors, helping Chinese automotive electronics engineers grasp the fastest growing automotive electronics market and its development opportunities. In-vehicle infotainment electronics market is growing fastest According to market research firm Frost & Sullivan, the expansion of the in-vehicle infotainment electronics market will be accompanied by a shift from a market dominated by audio and entertainment to a market dominated by video and information communication. During the market transition period, competition in the in-vehicle entertainment electronics market will focus on audio players and low-cost entertainment electronic devices, and the market for high-quality analog car radios will continue to exist. The use of DSP and software radio technology, as well as the integration of RF, radio and audio technology, will further improve the auditory quality in the car. Portable MP3 and in-vehicle multi-channel surround sound solutions composed of large-capacity flash memory and HDD are worthy of attention, such as Freescale's Amadeous media processor and Onyx DSP series surround sound solutions. Philips Semiconductor predicts that DSP-based automotive software radio products will account for 50% of the global market by 2007. Its existing electronic single-chip analog car radio solutions enable car radio manufacturers to serve the Asian, European and American markets through a single platform. Currently, Philips has a 20% share of the global market in this field. Philips' Freeman said: "With the reference design provided by EDAL, our partner in China, Chinese car radio companies can quickly enter the international market with top technology levels." Although the market for car audio products will continue to grow, IMS Research analysts believe that the global market size will not exceed 60% of the in-vehicle electronics market. They predict that in-vehicle information systems and driver information systems (DIS) will be the fastest growing markets, and are expected to account for 47.6% and 22.8% of the in-vehicle electronics market respectively by 2010. With the increase in portable navigation devices, embedding portable electronic products directly into cars will become the most popular consumption method. Engineers from Shenzhen Meisida Company believe that portable GPS will have a profound impact on the aftermarket market for in-vehicle GPS navigation systems. Renesas Technology experts believe that there will be a trend of merging navigation systems with automotive information systems in China. At present, the in-vehicle infotainment electronics in the US market mainly include telematics and navigation functions based on electronic maps; in the Japanese market, electronic map navigation functions have become standard features, and they are considering introducing functions with 3D graphics and special visual effects. In the field of 3D navigation applications, Renesas Technology has launched system platform solutions for automotive 3D graphics navigation applications, 3D telematics interfaces, 3D entertainment and similar applications. The difference between the Chinese market and the US, Japan and Europe is that Chinese automotive electronics manufacturers will launch cost-effective in-vehicle infotainment electronic products based on the needs of the high, medium and low-end markets. Market research company ABI Research believes that the current application of GPS in China is mainly in the monitoring and anti-theft of commercial vehicles. However, it is expected that by 2009, as the commercial application environment of navigation satellites and in-vehicle navigation equipment and the maturity of satellite navigation application standards, in-vehicle navigation systems will be more widely accepted by family car owners in China, the market size will expand dramatically, and product prices will also drop significantly. Yan Chongguang of Qigang Electronics said: "GPS+E-Map is very common in foreign countries. In China, it needs to further reduce the retail price and support from telecommunications operators to be popularized." Therefore, we believe that as various technologies such as video players, LCD displays, navigation, information communication and hands-free phones gradually penetrate into the automotive field, the in-vehicle infotainment electronic system platform with GPS navigation function is one of the focuses of competition among international semiconductor solution providers. Philips' Freeman agreed with this, saying: "More and more drivers and passengers are pursuing the same infotainment experience as at home, which is the driving force for the rapid development of the in-vehicle infotainment electronic market." "In-vehicle information entertainment electronics (Telematics/Infotainment) is the fastest growing market," said Yang Fei of Freescale. "The mobileGT platform (MPC5200) is the most widely used platform in the global in-vehicle information entertainment electronic system. It can also support hands-free system, navigation, car entertainment system, driver information system (road condition information, traffic information, etc.), anti-theft system, anti-collision system, alarm system and passenger detection system. GM OnStar's in-vehicle information system is a good success story." At the Beijing AES exhibition, Korean automotive electronics manufacturer Hyundai Autonet said it would use Freescale's PowerPC-based MPC5200 in the next generation NAVI series 3D navigation system. Figure 2 shows a schematic diagram of the growth of global automotive electronics systems predicted by Strategy Analytics. Currently, Freescale and Fujitsu Microelectronics are working together to develop platform solutions for integrated in-vehicle combined navigation systems, infotainment systems, DIS and industrial control applications. Feature-rich, high-end navigation and DIS help promote continued innovation in tracking and positioning technology. In addition, Freescale has also joined hands with Metrowerks to promote the application of Linux in automotive entertainment electronic systems. Its hardware uses Freescale's mobileGT architecture and Total5200 development platform for automotive applications, and optimizes the platform software development environment with Linux support packages (BSP). Metrowerks Linux BSP's expertise lies in creating a variety of connected car products, integrating wireless, graphics, audio and GPS technologies. In addition, ADI's Blackfin platform (CTP) launched to reduce the cost, size and development time of telematics systems by integrating telematics tasks onto a single processing platform in response to the integration needs of telematics systems and in-vehicle entertainment systems. TI's DSP-based open multimedia application platform (OMAP) can be used as an embedded system platform solution for automotive navigation and in-vehicle entertainment electronics. The SoC for car navigation is the inevitable result of the development of advanced microelectronics technology. The SoC for car navigation produced by Toshiba using 90nm DRAM technology is based on the Windows CE operating system, and integrates the CPU core, 3D graphics processing circuit, 32Mbit DRAM for frame buffer, PC bus interface and other external circuits into a single chip. The built-in 3D graphics circuit is designed with the key technology of the microprocessor and graphics chip of the home game console PS2. Experts point out that SoC has high power consumption and faces huge challenges in packaging and heat dissipation. In addition to the above-mentioned semiconductor solutions, Wind River Systems, Inc. of the United States, has initiated the COMET collaboration plan to develop standards for in-vehicle infotainment systems, and has provided integrated embedded system solutions to customers by utilizing the advanced application software provided by each participating company. Telematics market research companies believe that the development potential of in-vehicle entertainment electronics is greater than that of in-vehicle safety and security systems, and in-vehicle video communication services are a natural extension of in-vehicle telematics communication services. In order to save users from having to pile up a large number of DVDs or CDs in their cars, wireless Internet and storage technologies, such as Wi-Fi and HDD technology, can be used to seamlessly download multimedia content to the car, and the rear-seat video entertainment system is expected to enter the wireless and Internet era. The demand for high-density hard disks and storage devices will therefore increase. The key to interconnecting electronic systems is to suppress EMI and control costs As the number of electronic systems in cars increases, the number of interconnected cables will increase exponentially. For example, the cables in high-end cars have reached 2,500 meters, and the number of connectors has exceeded 3,000. Dense cables and contacts may introduce serious EMI (electromagnetic interference) problems, which is an important research and development topic in automotive electronic applications. "Statistics show that more than 90% of the sources of radiated electromagnetic interference are high-power electromechanical products in cars, including ignition, power generation, rectification and small motors. Shielding is the main measure to suppress radiated EMI." Dr. Xia Lei, a senior application engineer at Ansoft, said: "The difficulty faced by Chinese engineers is that they lack initial design experience when solving automotive EMI problems." Sam Yiu, regional manager of Memec in China/Hong Kong, said that with the increase of body electronics and control networks, the market demand for transceivers is huge, but many transceivers are an important source of EMI. There are many ways to control radiated and conducted EMI in automotive electronic systems, including controlling radiation at the chip level, controlling conduction at the cable level, and using wireless interconnection technology, as listed below: - Freescale proposed the intelligent distributed controller (IDC) technology, integrating the MCU with the power control device implemented by SMARTMOS technology to form a multi-chip module (MCM). By reducing the volume of the control module, reducing the contact points and PCB space, EMI is reduced from the overall module. TI controls the LIN bus slew rate according to the LIN 2.0 standard, and adds a filter to the input of its TPIC1021 transceiver to reduce the radio frequency interference caused by the LIN bus, thereby providing the maximum anti-electromagnetic interference capability. Philips Semiconductors uses SOI and A-BCD3 processes to suppress EMI inside the chip through a new design of the CAN bus transceiver, thereby eliminating the need for shielded cables and inductors in complex network architectures, effectively saving costs. Jan Polfliet, product manager of Ammann Semiconductor (AMIS), said that they use high-voltage mixed signal technology to suppress EMI problems caused by automotive electronic modules and integrated circuits.
- In terms of cable connection, how to correctly select connectors and conduction media is crucial to solving the conducted EMI in the design of automotive electronic systems, especially in the integrated design of in-vehicle information, entertainment and communication systems. To this end, TI has launched the TSB81BA3 1394b chip based on copper wire transmission for the interconnection of in-vehicle entertainment electronic devices, and provides semiconductor solutions for IEEE1394a, IEEE1394b and IDB-1394 standards. At present, the industry is concerned about whether the EMI performance of copper wire transmission can meet the standards.
Some companies have proposed using passive optical fiber (POF) as the transmission medium. The IDB-1394 specification proposes the goal of achieving a 100Mbps data rate within a transmission distance of 18 meters using POF or copper wire. Currently, the European ERTICO organization, Japan's EpoC, the Automotive Multimedia Interface Association (AMI-C) and the IDB Forum (Intelligent Data Bus) are working on establishing specifications to encourage automakers and suppliers to consider using new standards in the automotive electronics market. - The use of wireless interconnection technology can reduce the total length of cables, control interconnection costs and reduce EMI problems introduced by cables. STMicroelectronics uses advanced DSP technology to achieve echo cancellation, noise suppression and voice enhancement in the Blue HFCK in-car hands-free Bluetooth design. The key challenge of in-car Bluetooth technology is to establish a stable short-range wireless interface in the car.
ABI Research predicts that the penetration rate of Bluetooth in the automotive field will grow steadily in the next few years, and the global market size will reach 20 billion US dollars by 2011. The driving force for development comes from the application of Bluetooth mobile phones in cars and the demand for hands-free phones and wireless speakers in economy cars. In order to achieve wireless interconnection of electronic devices in the car, SAW filters are essential components in the wireless front-end selection device. In an environment where the temperature in the car is as high as 125°C, for occasions with low power consumption requirements, such as RKE car control systems and TPMS products, Austriamicrosystems' transmitter chip AS3977 has a multi-channel narrowband RF transmitter, high data transmission reliability, support FDMA and TDMA modes, and a transmission distance of one mile. It can be used for short-distance digital radio transmission, remote control products, wireless alarm systems, remote instruments and low-power remote test instruments. Wireless interconnection. - Faced with the increase in the application of Bluetooth wireless interconnection, controller area network (CAN) and universal serial bus interface, it is urgent to solve the conversion problem between multiple interconnection standards. To this end, National Semiconductor launched the CP3000 connection processor, the goal of which is to connect the electronic devices in the car together so that manufacturers can develop telematics systems in the shortest time. Xilinx's FPGA and CPLD for the automotive field provide flexible communication and connection cores and a variety of reference designs. Nicklas Gustafson, an automotive electronics expert at Enea, said that at the software level, the OSE link processor tool is the best tool to connect various media interconnection nodes, including CAN, LIN or MOST.
With the development of intelligent transportation systems, market research firm ABI Research believes that 802.11p is expected to enter the automotive communication infrastructure market, thereby achieving wireless interconnection between cars and between cars and roadside infrastructure networks. Zeng Qiang, deputy general manager of Shenzhen Shiqiang Telecom Co., Ltd., believes that with the rapid increase in China's highway mileage, the market prospects for regionally networked intelligent toll station networks and wireless toll cards based on wireless technology are very broad, which will generate huge demand for RF transceivers. In addition to wireless and high-speed wired interconnection solutions, the LVDS interface uses fewer cables and components in the interconnection of electronic systems, and the cost of interconnection within the system is lower. Maxim provides a large number of mixed-signal solutions for LVDS, CAN and LIN, as well as high-performance audio and video data transmission solutions based on MOST, MOST II, LVDS or other bus protocols for in-vehicle transmission, with extremely low EMI radiation, extremely low heat, noise and circuit complexity. Kent Robinett, executive director of Maxim's automotive division in the United States, said: "As OEMs launch more automotive electronic control units (ECUs), we will be committed to providing matching solutions with extremely low EMI."Various technologies advance into the field of active automotive safety With the development of image acquisition and processing technology, automotive camera systems can be used for road separation warning and guidance, driver drowsiness detection systems, road obstacle sensing equipment, intelligent airbag deployment, blind spot detection cameras (front, rear, side) and general safety and driving safety equipment. At present, China has begun to use image technology to develop active safety systems. Sam Yiu of Memec said: "China has installed such systems on some operating vehicles, and there is great market opportunity and development space in the future." Strategy Analytics predicts that the global automotive camera chip market is expected to reach a market size of 7 million pieces or 40 million US dollars by 2008. From 2005 to 2010, the annual compound growth rate of the automotive camera market will reach 100%. The main driving force for the market doubling is the demand for multi-point image monitoring in active safety systems of high-end cars, especially the demand for driver drowsiness/distraction monitoring systems and blind spot detection. OmniVision Technologies' OV7940 image acquisition solution for automobiles uses its proprietary OmniPixel technology. This product can be used in various driver assistance products, meets the AEC-Q100 standard of the Automotive Electronics Council, and has passed pre-processing, humidity testing, high temperature cycling, mechanical testing, optical and electrical testing. Micron Technology uses its unique TrueSNAP (Shutter Node Active Pixel) spherical shutter technology to design the MT9V022 for the automotive active safety market with a spherical shutter (synchronous total pixel exposure system) and enhanced near-infrared sensitivity, which can be used for low-cost embedded scene processing equipment. In the application of automotive night vision system, OSRAM Opto Semiconductors uses thin film technology for infrared components and develops the first generation of 850nm infrared emitting diodes (IRED). The use of thin film technology enables the top of the chip to emit all the light generated by the device inside. Its light-emitting layer is very thin and close to the surface, so almost no light can escape from the side, which means that its radiation output intensity is proportional to the area of the chip. The wavelength of OSRAM's new IRED is closer to visible light (400 to 780nm) than the conventional IRED with a wavelength of 880nm, so it is suitable for automotive night vision systems, invisible light lighting in the car, parking lot video auxiliary monitoring and traffic flow and speed measurement. In order to meet the needs of multi-point detection and automotive night vision systems, SMaL Camera Technologies provides the world's first ACM100 camera solution dedicated to automotive safety, which uses Autobrite adaptive dynamic range control technology and has excellent near-infrared sensitivity and extremely low light sensitivity. It is worth noting that automotive cameras and their supporting image processing software technology are only one development direction in the field of automotive active safety. Radar, laser, ultrasonic and thermal imaging technologies are also beginning to advance into the field of automotive active safety. Figure 3 shows a list of active safety technologies used in automobiles. Automotive power management devices will use high and low voltage hybrid integration technology The rapid growth of automotive electronic equipment has created a huge demand for power management systems. According to Strategy Analytics, by 2009, the total demand for the global automotive power market will be close to US$22 billion, and its main driving force comes from the rapid development of powertrain, safety system, body control and infotainment electronic systems. In the field of automotive power management, we need to pay attention to the following technical development trends: - Integrate high and low voltage circuits in standard CMOS process
At present, all the circuits related to display, audio and exciter in the automotive system need high voltage power supply. Some integrated circuits may be directly connected to the battery and thus have to withstand voltages up to 40V. The power transistor driver that controls the engine needs to handle even higher voltages. At the same time, the demand for signal processing functions in automobiles is also growing rapidly, but such chips require submicron process technology and work in a low-voltage environment. Therefore, the challenge facing automotive power management is how to integrate high-voltage and low-voltage components in standard CMOS processes. For example, 40V circuits include drivers, load regulators, sensing components and high-performance analog circuits, while low-voltage components include embedded flash memory, microcontrollers and other digital logic circuits. In order to develop dedicated high-voltage devices based on submicron CMOS processes, designing high-voltage transistors using standard process steps is a development direction. In order to integrate analog, discrete, and power MOSFETs, ON Semiconductor has developed an innovative manufacturing technology that combines bipolar CMOS technology with DMOS technology for driver devices. Freescale has developed SMARTMOS technology, which can integrate MCUs, analog devices, and high-power discrete devices. STMicroelectronics' VNH3SP30 dedicated full-bridge motor driver uses VIPower technology, allowing a power field-effect MOS transistor and intelligent signal/protection circuits to be integrated into one chip. - Ultra-Low Current Burst Mode Soft-Start
Automotive anti-theft and entertainment electronic systems usually need to work in burst mode. Regardless of sudden load increase, sudden decrease or cold car start, the quiescent current of the power management system in standby state is required to be kept below 100μA. The 500kHz step-down switching regulator LT1977 connected to the high-voltage power supply of Linear Technology has ultra-low quiescent current, so it can achieve longer battery life. Microchip uses nanoWatt patented technology to provide system designers with extremely low sleep current and fast start oscillators to support low-power system design. Ultra-low current burst mode soft start is a key technology for power management in the application field of automotive anti-theft and entertainment electronic systems. Kent Robinett of Maxim believes that with the growth of body electronic control units (ECUs), the problem of power shortage in automobiles will become more and more serious. Linear regulators can no longer meet the needs of automotive electronics for power systems. Many ECUs will be powered by switching power supplies and maintain extremely low power consumption when parked. He said: "Maxim/Dallas will provide an ideal solution to meet these needs." As high-power control applications such as window lifts, seat adjusters and DC motor controllers become more prevalent in cars, automakers must carefully evaluate the energy consumption of all electronic systems in order to reduce energy consumption. The new low RDS(ON) power MOSFET has low on-state energy consumption, making it a key device for improving power system efficiency. Its applications include entertainment electronics systems and HID systems that provide better road lighting. Fairchild Semiconductor's multi-chip smart switch technology can meet other system constraints such as circuit board space and low power consumption, and meet the application requirements of inductive and resistive load control, internal heating and cooling fans, ignition coils and smart switches, wiper motors, electronic suspension, seat position adjustment, headlights and window lifts. In addition, in the large current control applications of automotive electronics, such as electric power assist system (EPS), 14V integrated starter alternator (ISA) system and advanced alternator rectification, IR has 55V automotive electronics HEXFET power MOSFET-IRF3805S-7P and IRF1405ZS-7P, which can provide continuous current of 160A and 120A respectively. At present, the automotive power supply is still mainly 12V. With the increase of electronic equipment on the car, it is expected that 10% of the cars will use 42V power supply by 2010, and the application of devices such as MOSFET and IGBT will become increasingly popular. High-brightness LEDs are starting to be used in cars LEDs are superior to incandescent lamps in that they have a longer lifespan, faster response, higher energy efficiency and stronger shock resistance. Using high-brightness LEDs as brake lights or turn signals will give nearby drivers more time and a longer distance to respond to flashing signals, thereby reducing the occurrence of accidents and improving the safety of car driving. At present, the application of LED in automobiles is mainly restricted by the cost of supporting driver devices and circuit boards. In comparison, the price advantage of using light bulbs is still very large. In the application of automotive LED lighting, the difficulty faced by Chinese engineers is that the price of automotive-specific LEDs is too high, and there is a bottleneck in the low-cost design of driver solutions. Users are unwilling to increase the cost burden for this. Although the lights of economy cars in the Chinese market are still mainly incandescent lamps, red light LEDs have begun to replace incandescent lamps in high-mounted brake lights and some operating vehicles. LED applications are steadily penetrating into the automotive taillight and high-mounted brake light markets. With the use of more diodes in cars, a huge automotive LED electronic lamp market is expected to form in China, accompanied by a huge demand for the LED driver chip market. At present, a number of companies such as STMicroelectronics, Sanyo Semiconductor, Maxim, National Semiconductor, Linear, TI, and Fairchild Semiconductor provide LED driver chip solutions. In the field of LED, Lumileds and Osram are two semiconductor companies that are engaged in the design of 100-lumen LED lamps. At present, the radiation of Lumileds' new red, orange and amber Luxeon III LEDs has reached 140, 190 and 110 lumens respectively, and the life span is 20,000 hours when working at 200mA, which is far longer than the life span of incandescent lamps. Steve Landau of Lumileds said: "This is a major milestone for the automotive industry, indicating that LED performance has met the requirements of taillight standards." Osram's linear fluorescent lamps designed with high-power white Golden DRAGON series LEDs have a working life of up to 50,000 hours, which helps to improve the service life of the entire headlight. Philips and Lumileds jointly developed a modular automotive LED lighting solution that utilized Philips' automotive lighting power supply design and integration technology. The module will simplify LED lighting design and accelerate the process of automakers adopting LED solid-state lighting solutions. Visteon believes that with the innovation and development of LED lighting technology, automotive LED lighting will be applied to headlights and develop towards interior lighting, thus bringing new comfort to drivers and passengers. As LED manufacturers and semiconductor solution providers work more closely together, Veeco predicts that the application of high-brightness LEDs in the automotive electronics market will start in 2005. According to statistics from iSuppli, automotive applications accounted for 30% of the total high-brightness LED market in 2004. As LED manufacturers continue to improve light output, the demand for high-brightness and ultra-high-brightness LEDs in automotive lighting will continue to grow, as shown in Figure 4. In addition, the medium-power light-emitting diode product Envisium Power surface-mount LED launched by Agilent Technologies and Lumileds is mainly used in automotive exterior lighting such as central high-mounted brake lights, front turn lights, rear combination turn lights, tail lights and brake lights, mirror turn signal indicators, as well as backlighting of instrument panels, central consoles, navigation and audio systems.
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