The tactile intelligent SOM3588S Hongmeng core board is now available. Rockchip RK3588S has eight cores, 6T ultra-high computing power, rich audio and video...

Industio_触觉智能

The tactile intelligent SOM3588S Hongmeng core board is now available. Rockchip RK3588S has eight cores, 6T ultra-high computing power, rich audio and video... [Copy link]

Shenzhen Touch Intelligence's SOM3588S Hongmeng core board is now on the market. It is equipped with Rockchip's RK3588S flagship chip. It is a high-performance core board with high computing power, low power consumption, and rich multimedia interfaces.

The SOM3588S Hongmeng core board integrates quad-core Cortex-A76 and quad-core Cortex-A55 CPUs, 6T ultra-high computing power NPU, and G610 MP4 GPU; it has powerful video image processing performance with 8K video encoding and decoding and 48-megapixel ISP; it supports multiple audio and video interfaces such as HDMI2.1/eDP1.3, DP1.4, MIPI DSI, as well as high-speed communication interfaces such as SATA3.0/PCIe2.1/USB3.1/Gigabit Ethernet, making product development easy.

The module logic block diagram is shown below:

Domestic flagship chip

The SOM3588S Hongmeng core board uses Rockchip's latest flagship SoC chip RK3588S. RK3588S is a general-purpose SoC based on a 64-bit ARM architecture, integrating quad-core Cortex-A76 and quad-core Cortex-A55 octa-core processors, 6T ultra-high computing power NPU, and Mali-G610 high-performance quad-core GPU, which can run and process multiple applications smoothly.

Meticulously crafted and excellent workmanship

The SOM3588S Hongmeng core board has undergone strict power integrity and signal integrity simulation design, and has passed various tests such as electromagnetic compatibility, temperature shock, high temperature and high humidity aging, and long-term storage pressure. It is stable and reliable and is available in batches. It adopts stamp hole + LGA packaging design and 10-layer blind buried hole immersion gold process. The overall size is only 4.5*5cm and the board thickness is 1.1mm.

Powerful AI performance
Built-in AI accelerator, NPU computing power up to 6Tops, supports INT4/INT8/INT16/FP16 mixed operations, has strong compatibility to easily convert a series of framework models such as TensorFlow/MXNet/PyTorch/Caffe, and meets the computing power requirements of most industry artificial intelligence models.

System Support

The SOM3588S Hongmeng core board has undergone strict power integrity and signal integrity simulation design, and has passed various tests such as electromagnetic compatibility, temperature shock, high temperature and high humidity aging, and long-term storage pressure. It is stable and reliable and is available in batches. It adopts stamp hole + LGA packaging design, 10-layer blind buried hole immersion gold process, the size is only 4.5*5cm, and the board thickness is 1.1mm.

Video Performance

The SOM3588S Hongmeng core board supports 8K@60FPS H.265/VP9/AVS2 video decoding and 8K@30FPS H.264/H.265 video encoding.

In terms of interface, it supports HDMI2.1/eDP1.3, 2×MIPI DSI, DP1.4 video output interface and MIPI CSI, MIPI DPHY, DVP video input.

Empowering multiple industry applications

As a module equipped with Rockchip RK3588S flagship chip, SOM3588S Hongmeng core board adopts ultra-small stamp hole + LGA package and 10-layer blind buried hole immersion gold process. Compared with the connector core board on the market, the overall stability performance and size have significant advantages! In addition, with the rich system support of open source Hongmeng OpenHarmoney, Android, and Linux (Debian/Ubuntu), it can better help meet the needs of different industries and markets, and is widely used in edge computing, artificial intelligence, cloud computing, virtual/augmented reality, smart security, smart medical care, self-service terminals, smart retail and other scenarios.