First release of new product! Mir STM32MP2 core board is launched, with higher performance MPU, multiple interfaces + edge computing power

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First release of new product! Mir STM32MP2 core board is launched, with higher performance MPU, multiple interfaces + edge computing power [Copy link]

Mir released the MYC-LD25X core board and development board based on the STM32MP257 embedded processor module . The core board is based on the STM32MP2 series, which is the latest generation of industrial-grade 64-bit microprocessors launched by STMicroelectronics. It adopts LGA 252 PIN design, storage configuration 1GB/2GB LPDDR4, 8GB eMMC, and has rich communication interfaces. It is suitable for high-end industrial HMI, edge computing gateways, new energy charging piles, energy storage EMS systems, industrial automation PLCs, motion controllers and other scenarios.

STM32MP2 57 processor, ST's second generation higher performance MPU

The STM32MP257 is equipped with a dual-core Cortex-A35 64-bit core with a maximum frequency of 1.5 GHz. It also integrates a 400 MHz Cortex-M33 core for real-time operation, with a single-precision floating-point unit (FPU), digital signal processing (DSP) instructions, TrustZone security features, and a memory protection unit (MPU). In addition, the processor is also equipped with an NPU accelerator and a 3D GPU with a total computing power of 1.35 TOPS, supporting H.264/VP8 1920*1080@60FPS video codec. The processor also supports a variety of peripheral expansions: 3 Gigabit Ethernet/3 CAN FD/1 1 lane PCIE2.0/1 USB3.0&2.0 OTG/1 USB2.0 HOST/3 SDIO3.0/9 UART interfaces/8 I2C/4 I3/8 SPI/1 16bit FMC, etc. With advanced computing power, rich interfaces and high security, STM32MP2 enables high-performance and highly connected Industrial 4.0 applications.

Machine Vision Advanced Edge AI

The STM32MP25 has a built-in NPU edge AI accelerator with a computing power of up to 1.35 TOPS, supports the MIPI CSI interface with ISP, and can realize a variety of AI applications such as machine vision; the STM32MP25 also has a built-in 3D GPU with a main frequency of 900MHz; developers can flexibly choose to run AI applications on the CPU, GPU, and NPU. The 3D GPU supports up to 1080p resolution and is equipped with a MIPI CSI-2 camera interface with an ISP processor. The STM32MP25 also has built-in full HD video codec and has a rich display interface, supporting RGB, LVDS and DSI output.

Stronger security features, suitable for more industrial scenarios

The STM32MP25 has passed SESIP Level 3 and PSA Level 1 target certification, and has built-in powerful security encryption hardware to protect memory and peripherals to prevent illegal access and control; it has a security encryption accelerator to enhance robustness against physical attacks; it supports runtime code isolation protection and device authenticity verification during the product life cycle.

Rich peripheral interfaces and powerful connectivity

In the wave of Industry 4.0, with the increasing demand for smart manufacturing and automation, MPUs must not only support high-speed, low-latency wired and wireless connections, but also achieve seamless collaboration between devices. To support the expansion of interconnected applications, the STM32MP257 series has enhanced connectivity and rich interfaces: support for TSN (time-sensitive networking), up to 3 Gigabit Ethernet ports (built-in dual-port switch), PCIe Gen2, USB 3.0, 3 CAN-FD interfaces, etc.

LGA innovative design, high reliability

The MYC-LD25X core board adopts a high-density and high-speed circuit board design, integrating STM32MP257x, LPDDR4, eMMC, E2PROM, PMIC and other circuits on a 37mm*39mm board. MYC-LD25X has the most stringent quality standards, ultra-high performance, rich peripheral resources, high cost performance, and long delivery time, and is suitable for the core board requirements required by cost-effective smart devices.

Rich application scenarios

The STM32MP257 has excellent performance, higher integration and diverse application expansion, and is suitable for high-end industrial HMI, edge computing gateways, new energy charging piles, energy storage EMS systems, industrial automation PLCs, motion controllers and other scenarios.