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The use of solderless technology limits the gold removal process before soldering [Copy link]

The use of solderless technology limits the gold removal process before soldering, thereby improving the reliability of interconnections, as gold in the solder can crack during thermal cycling.

IMP_Handout_WEB_2022-05-16.pdf (1.08 MB, downloads: 0)
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#This post is really great! It is rich in content and has clear views. It is very beneficial. Thank you for sharing! Reply#  Details Published on 2023-11-26 21:14
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#This post is really great! It is rich in content and has clear views. It is very beneficial. Thank you for sharing! Reply#
This post is from RF/Wirelessly
 
 

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