Glue filling problem after power supply PCB wiring

灞波儿奔

Glue filling problem after power supply PCB wiring [Copy link]

After the power supply is designed, the test is normal. Because according to customer requirements, it needs to be filled with AB glue after being installed in the shell.
After filling with AB glue, the test does not work. Some people say it is a PCB layout problem. What is the reason?
The circuit PCB is as follows. Let's listen to your analysis

maychang

Any potting compound will shrink after solidification. If the shrinkage is strong, it may deform the components or even tear the solder joints apart.

The post said [after injecting AB glue, the test did not work], most likely the welding point was torn apart.

吾妻思萌

How hot is your glue when you pour it? How much does it shrink after cooling? Will it burn or tear off the components?

chunyang

Do not pour glue on the component surface, just pour glue on the bottom to seal it. Saving glue will not cause any problems. If you pour glue all over, you must choose the right glue.

led2015

It is nothing more than a PCB layout design problem, or a short circuit between PCB layers, unqualified PCB dip soldering, uneven glue filling, vibration during glue filling, etc.

misui

chunyang posted on 2023-3-20 15:25 Don't pour glue on the component surface, just pour glue on the bottom to seal it. Saving glue will not cause problems. If you pour glue all over, you have to choose the right glue.

So what glue should be chosen, and what method can solve the problem of PCB components falling off due to glue filling?

chunyang

misui posted on 2023-9-28 20:27 So what kind of glue should be chosen, and what method can solve the problem of PCB components falling off due to glue filling?

Generally it is epoxy resin, which needs to be decided by experimental testing, including high and low temperature experiments.

misui

How many times should the high and low temperature tests be performed?

misui

How to solve this problem completely