[Synopsys IP Resources] TSMC awarded Synopsys multiple "OIP Partner of the Year" awards, recognizing the...

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[Synopsys IP Resources] TSMC awarded Synopsys multiple "OIP Partner of the Year" awards, recognizing the... [Copy link]

MOUNTAIN VIEW, Calif., Nov. 8, 2021 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced that it has been named TSMC Open Innovation Platform Partner of the Year for the 11th consecutive year, highlighting the two companies' long-standing collaboration in advancing next-generation system-on-chip (SoC) and 3DIC design enablement. TSMC recognized Synopsys for its OIP Partner of the Year award in recognition of Synopsys' Interface IP, joint development of N4 design infrastructure, and joint development of 3DFabric design solutions. Synopsys and TSMC's collaboration has accelerated semiconductor development and innovation, including the latest adoption of FinFET technology to achieve best-in-class power, performance, and area (PPA) for TSMC's N3 and N4 processes, as well as advanced 3D system design solutions for TSMC's 3DFabric technologies including CoWoS, InFO, and TSMC-SoIC.

"Congratulations to Synopsys for being recognized as a TSMC 2021 Open Innovation Platform Partner for its IP and EDA solutions that contribute to enabling semiconductor innovation," said Suk Lee, vice president of Design Infrastructure Management Group at TSMC. "TSM looks forward to continued collaboration with Synopsys to meet our customers' needs with Synopsys' certified design solutions and IP based on TSMC's latest technologies to continue driving breakthrough innovation in silicon."

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