What is the drilling process in the Siliton ceramic substrate PCB?

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What is the drilling process in the Siliton ceramic substrate PCB? [Copy link]

PCB drilling is a process of PCB plate making, and it is also a very important step. It is mainly to punch holes in the board. For routing needs, a via is needed. For structural needs, a hole is drilled for positioning or something like that. The drilling of multi-layer boards is not completed at one time. Some holes are buried in the circuit board, and some are drilled on the board, so there will be one drill and two drills. Drilling is to connect the outer layer circuit with the inner layer circuit, and the outer layer circuit with the outer layer circuit. Ceramic substrate PCB is drilled for the connection of circuits between layers. In the subsequent electroplating process, copper is plated in the hole to connect the circuits of each layer. There are also some drilled holes for screw holes, positioning holes, row holes, etc., each with different uses. Drilling is to drill the required vias on the copper clad board. Siliton ceramic substrate PCB believes that through-hole vias mainly provide electrical connections and are used to fix or position devices. PCB vias are divided into a. Plated holes (PTH), also called metalized holes b. Non-plated holes (NPTH): also called non-metalized holes. According to the process, they are divided into a. Blind holes (multi-layer boards) b. Buried holes (multi-layer boards)

月下良缘

Thanks for sharing!

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The techniques of ceramic drilling will be used more in life.

xyzgc001

Laser drilling of ceramic boards is basically used for positioning. At most, double-sided circuits can be made with vias. Hard ceramics cannot be used to make multi-layer boards.