The above is the difference between immersion gold board and gold-plated board. Now the price of gold is expensive in the market. In order to save costs, many manufacturers are unwilling to produce gold-plated boards, and only make immersion gold boards with nickel gold on the pads, which are indeed much cheaper in price. I hope this introduction can provide reference and help for everyone. 1. Immersion gold PCB and chemical gold PCB are the same kind of products, and electroplated gold PCB and flash gold PCB are also the same kind of products. In fact, they are just different names used by different people in the PCB industry. Immersion gold PCB and electroplated gold PCB are more commonly used by mainland counterparts, while chemical gold PCB and flash gold PCB are more commonly used by Taiwanese counterparts. 2. The more formal name of immersion gold board/chemical gold board is chemical nickel gold board or chemical nickel immersion gold board. The growth of nickel/gold layer is plated by chemical deposition; the more formal name of electroplated gold board/flash gold board is electroplated nickel gold board or flash gold board. The growth of nickel/gold layer is plated by direct current electroplating. 3. The difference between the mechanism of chemical nickel gold board (immersion gold) and electroplated nickel gold board (gold plating) is shown in the following table: 387566 387567 387567 Why is "spray tin" generally not used? With the increasing integration of ICs, IC pins are becoming more and more numerous and dense. However, it is difficult to flatten the thin pads using the vertical tin spraying process, which makes SMT mounting difficult; in addition, the shelf life of the tin spraying board is very short. The gold-plated board just solves these problems:
1. For surface mount technology, especially for 0603 and 0402 ultra-small surface mount, because the flatness of the pad is directly related to the quality of the solder paste printing process, it has a decisive influence on the quality of the subsequent reflow soldering. Therefore, gold plating of the entire board is often seen in high-density and ultra-small surface mount processes.
2In the trial production stage, due to factors such as component procurement, it is often not possible to solder the board immediately after it arrives, but it often takes several weeks or even months to use it. The shelf life of the gold-plated board is many times longer than that of the lead-tin alloy, so everyone is happy to use it. In addition, the cost of gold-plated PCB in the sample stage is almost the same as that of the lead-tin alloy board. However, as the wiring becomes more and more dense, the line width and spacing have reached 3-4MIL. This caused the problem of short circuit of gold wire:
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As the frequency of the signal increases, the skin effect causes the signal to be transmitted in multiple layers, which has a more obvious impact on the signal quality:
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Skin effect means that for high frequency alternating current, the current tends to flow on the surface of the conductor. According to calculations, the skin depth is related to the frequency:
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[size= 17px]Other disadvantages of gold-plated boards are listed in the table of differences between immersion gold boards and gold-plated boards. =left]Why choose immersion gold PCB instead of gold-plated PCB?
To solve the above problems of gold-plated plates The main features of PCBs using immersion gold are as follows: 1. Because the crystal structure formed by immersion gold and gold plating is different, immersion gold Gold will be golden yellow, which is yellower than gold plating, and customers are more satisfied. Gold and gold plating have different crystal structures. Immersion gold is easier to weld than gold plating, and will not cause poor welding and cause customer complaints. , 15, 15)]
3. Since the immersion gold board only has nickel gold on the pad, the signal transmission in the skin effect is in the copper layer and will not affect the signal. =rgb(16, 15, 15)]
4. Because the crystal structure of immersion gold is denser than that of gold plating, it is not easy to Oxidation occurs. , 15)]5. Because the immersion gold board only has nickel gold on the pad, it will not produce gold wires and cause micro shorts.
6. Because the immersion gold board only has nickel gold on the pad, the solder mask on the circuit is more firmly bonded to the copper layer. , 15, 15)]7. The project will not affect the spacing when making compensation.
[ 8. Because the crystal structure formed by immersion gold and gold plating is different, the stress of the immersion gold board is easier to control, which is more suitable for products with bonding. At the same time, because immersion gold is softer than gold plating, the immersion gold plate is not wear-resistant for gold fingers. 9. Flatness and service life of immersion gold plate As good as gold plate.: "]
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As the frequency of the signal gets higher and higher, the influence of the signal transmission in multiple plating layers due to the skin effect on the signal quality becomes more obvious:
[font=-apple-system-font, BlinkMacSystemFont, Skin effect means that for high-frequency alternating current, the current will tend to concentrate on the surface of the wire and flow. According to calculations, the skin depth is related to frequency:
Other disadvantages of gold-plated boards are listed in the table of differences between immersion gold boards and gold-plated boards.
Why choose immersion gold boards instead of gold-plated boards?
To solve the above problems of gold-plated boards, PCBs using immersion gold boards have the following main features:
1. Because the crystal structure formed by immersion gold and gold plating is different, immersion gold will be more golden than gold plating, which will make customers more satisfied.
2. Because the crystal structure formed by immersion gold and gold plating is different, immersion gold is easier to weld than gold plating, and will not cause poor welding and cause customer complaints.
15)]3. Because the immersion gold board only has nickel gold on the pad, the signal transmission in the skin effect is in the copper layer and will not affect the signal.
4. Because the crystal structure of immersion gold is denser than that of gold plating, it is not easy to oxidize.
5. Because the immersion gold board only has nickel gold on the pad, it will not produce gold wires and cause micro shorts.
6. Because the immersion gold board only has nickel gold on the pad, the solder mask on the circuit is more firmly combined with the copper layer.
7. The engineering will not affect the spacing when making compensation.
8. Because the crystal structure formed by immersion gold and gold plating is different, the stress of the immersion gold board is easier to control, which is more conducive to the bonding process for products with bonding. At the same time, because immersion gold is softer than gold plating, the immersion gold board is not wear-resistant for gold fingers. 9. The flatness and service life of the immersion gold board are as good as those of the gold-plated board.: "]
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As the frequency of the signal gets higher and higher, the influence of the signal transmission in multiple plating layers due to the skin effect on the signal quality becomes more obvious:
[font=-apple-system-font, BlinkMacSystemFont, Skin effect means that for high-frequency alternating current, the current will tend to concentrate on the surface of the wire and flow. According to calculations, the skin depth is related to frequency:
Other disadvantages of gold-plated boards are listed in the table of differences between immersion gold boards and gold-plated boards.
Why choose immersion gold boards instead of gold-plated boards?
To solve the above problems of gold-plated boards, PCBs using immersion gold boards have the following main features:
1. Because the crystal structure formed by immersion gold and gold plating is different, immersion gold will be more golden than gold plating, which will make customers more satisfied.
2. Because the crystal structure formed by immersion gold and gold plating is different, immersion gold is easier to weld than gold plating, and will not cause poor welding and cause customer complaints.
15)]3. Because the immersion gold board only has nickel gold on the pad, the signal transmission in the skin effect is in the copper layer and will not affect the signal.
4. Because the crystal structure of immersion gold is denser than that of gold plating, it is not easy to oxidize.
5. Because the immersion gold board only has nickel gold on the pad, it will not produce gold wires and cause micro shorts.
6. Because the immersion gold board only has nickel gold on the pad, the solder mask on the circuit is more firmly combined with the copper layer.
7. The engineering will not affect the spacing when making compensation.
8. Because the crystal structure formed by immersion gold and gold plating is different, the stress of the immersion gold board is easier to control, which is more conducive to the bonding process for products with bonding. At the same time, because immersion gold is softer than gold plating, the immersion gold board is not wear-resistant for gold fingers. 9. The flatness and service life of the immersion gold board are as good as those of the gold-plated board., 51, 51)]
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Skin effect means that for high-frequency alternating current, the current tends to flow concentrated on the surface of the wire. According to calculations, the skin depth is related to frequency:
Other disadvantages of gold-plated boards are listed in the table of differences between immersion gold boards and gold-plated boards.
Why choose immersion gold boards instead of gold-plated boards?
To solve the above problems of gold-plated boards, PCBs using immersion gold boards have the following main features:
1. Because the crystal structure formed by immersion gold and gold plating is different, immersion gold will be more golden than gold plating, which will make customers more satisfied.
2. Because the crystal structure formed by immersion gold and gold plating is different, immersion gold is easier to weld than gold plating, and will not cause poor welding and cause customer complaints.
15)]3. Because the immersion gold board only has nickel gold on the pad, the signal transmission in the skin effect is in the copper layer and will not affect the signal.
4. Because the crystal structure of immersion gold is denser than that of gold plating, it is not easy to oxidize.
5. Because the immersion gold board only has nickel gold on the pad, it will not produce gold wires and cause micro shorts.
6. Because the immersion gold board only has nickel gold on the pad, the solder mask on the circuit is more firmly combined with the copper layer.
7. The engineering will not affect the spacing when making compensation.
8. Because the crystal structure formed by immersion gold and gold plating is different, the stress of the immersion gold board is easier to control, which is more conducive to the bonding process for products with bonding. At the same time, because immersion gold is softer than gold plating, the immersion gold board is not wear-resistant for gold fingers. 9. The flatness and service life of the immersion gold board are as good as those of the gold-plated board., 51)]
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Skin effect means that for high-frequency alternating current, the current tends to flow concentrated on the surface of the wire. According to calculations, the skin depth is related to frequency:
Other disadvantages of gold-plated boards are listed in the table of differences between immersion gold boards and gold-plated boards.
Why choose immersion gold boards instead of gold-plated boards?
To solve the above problems of gold-plated boards, PCBs using immersion gold boards have the following main features:
1. Because the crystal structure formed by immersion gold and gold plating is different, immersion gold will be more golden than gold plating, which will make customers more satisfied.
2. Because the crystal structure formed by immersion gold and gold plating is different, immersion gold is easier to weld than gold plating, and will not cause poor welding and cause customer complaints.
15)]3. Because the immersion gold board only has nickel gold on the pad, the signal transmission in the skin effect is in the copper layer and will not affect the signal.
4. Because the crystal structure of immersion gold is denser than that of gold plating, it is not easy to oxidize.
5. Because the immersion gold board only has nickel gold on the pad, it will not produce gold wires and cause micro shorts.
6. Because the immersion gold board only has nickel gold on the pad, the solder mask on the circuit is more firmly combined with the copper layer.
7. The engineering will not affect the spacing when making compensation.
8. Because the crystal structure formed by immersion gold and gold plating is different, the stress of the immersion gold board is easier to control, which is more conducive to the bonding process for products with bonding. At the same time, because immersion gold is softer than gold plating, the immersion gold board is not wear-resistant for gold fingers. 9. The flatness and service life of the immersion gold board are as good as those of the gold-plated board., 51, 51)]
(, downloads: 0)
Why choose immersion gold PCB instead of gold-plated PCB?
To solve the above problems of gold-plated boards, PCBs using immersion gold boards have the following main features:
1. Because the crystal structure formed by immersion gold and gold plating is different, immersion gold will be more golden than gold plating, which will make customers more satisfied.
2. Because the crystal structure formed by immersion gold and gold plating is different, immersion gold is easier to weld than gold plating, and will not cause poor welding and cause customer complaints.
15)]3. Because the immersion gold board only has nickel gold on the pad, the signal transmission in the skin effect is in the copper layer and will not affect the signal.
4. Because the crystal structure of immersion gold is denser than that of gold plating, it is not easy to oxidize.
5. Because the immersion gold board only has nickel gold on the pad, it will not produce gold wires and cause micro shorts.
6. Because the immersion gold board only has nickel gold on the pad, the solder mask on the circuit is more firmly combined with the copper layer.
7. The engineering will not affect the spacing when making compensation.
8. Because the crystal structure formed by immersion gold and gold plating is different, the stress of the immersion gold board is easier to control, which is more conducive to the bonding process for products with bonding. At the same time, because immersion gold is softer than gold plating, the immersion gold board is not wear-resistant for gold fingers. 9. The flatness and service life of the immersion gold board are as good as those of the gold-plated board., 51, 51)]
(, downloads: 0)
Why choose immersion gold PCB instead of gold-plated PCB?
To solve the above problems of gold-plated boards, PCBs using immersion gold boards have the following main features:
1. Because the crystal structure formed by immersion gold and gold plating is different, immersion gold will be more golden than gold plating, which will make customers more satisfied.
2. Because the crystal structure formed by immersion gold and gold plating is different, immersion gold is easier to weld than gold plating, and will not cause poor welding and cause customer complaints.
15)]3. Because the immersion gold board only has nickel gold on the pad, the signal transmission in the skin effect is in the copper layer and will not affect the signal.
4. Because the crystal structure of immersion gold is denser than that of gold plating, it is not easy to oxidize.
5. Because the immersion gold board only has nickel gold on the pad, it will not produce gold wires and cause micro shorts.
6. Because the immersion gold board only has nickel gold on the pad, the solder mask on the circuit is more firmly combined with the copper layer.
7. The project will not affect the spacing when making compensation.
8. Because the crystal structure formed by immersion gold and gold plating is different, the stress of the immersion gold board is easier to control, which is more conducive to the bonding process for products with bonding. At the same time, because immersion gold is softer than gold plating, the immersion gold board is not wear-resistant for gold fingers. 9. The flatness and service life of the immersion gold board are as good as those of the gold-plated board.Because the immersion gold board only has nickel gold on the pad, it will not produce gold wires to cause micro shorts.
6. Because the immersion gold board only has nickel gold on the pad, the solder mask on the circuit is more firmly combined with the copper layer.
7. The project will not affect the spacing when making compensation.
8. Because the crystal structure formed by immersion gold and gold plating is different, the stress of the immersion gold board is easier to control, which is more conducive to the bonding process for products with bonding. At the same time, because immersion gold is softer than gold plating, the gold finger of immersion gold board is not wear-resistant.
9. The flatness and service life of immersion gold board are as good as those of gold-plated board.
Because the immersion gold board only has nickel gold on the pad, it will not produce gold wires to cause micro shorts. 
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