Principle and Application of Single Chip Microcomputer

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Principle and Application of Single Chip Microcomputer [Copy link]

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Bai Tongyun's Advanced Training on "EMC Electromagnetic Compatibility Design" Organizer: Beijing Angxun Technology Co., Ltd. Training time: October 13-14, 2006 (two days) Training location: Beijing Tsinghua Park Hotel Contact number: 010-62247628 010-62254817 Website: www.angxun.com.cn Contact person: Liu Fang Lecturer profile: Bai Tongyun resume: Graduated from the Department of Electronic Engineering of Tsinghua University in 1960, has been engaged in teaching and scientific research in the fields of electromagnetic field theory, microwave technology, microwave metrology, and electromagnetic compatibility in colleges and universities for a long time. Many scientific research results have won awards and a patent has been obtained. Published works include "Electromagnetic Interference and Compatibility", "Information Technology Dictionary", "How to Achieve Electromagnetic Compatibility", "Electromagnetic Compatibility Design", etc., and published more than 60 papers. In May 2000, at the "National Electromagnetic Compatibility Standard and Quality Certification Seminar", the "Layered and Integrated Design Method", a new method of electromagnetic compatibility design, was proposed. Since 2000, nearly 100 special reports and trainings have been made for various research institutes, universities, troops and enterprises to promote this method. At the R&D site, various practical problems have been answered and solved, and "Product Electromagnetic Compatibility Design Specifications" have been formulated to help various units get out of the "vicious circle" of the "test modification method" and take the initiative to carry out electromagnetic compatibility design at the beginning of product design, which not only reduces costs, but also shortens the R&D time, allowing products to be put on the market in advance; it also further enriches and improves the "Layered and Integrated Design Method", and has made contributions to my country's electromagnetic compatibility cause. Bai Tongyun is currently a member of the Electronic Industry Strategy Research Branch of the China Electronics Society, a member of the Electromagnetic Compatibility Committee of the China Communications Society, a CE certification expert of the EU designated agency CCQS.UK.Ltd. CE Conformity Assessment Center, a consultant of Shanghai Apomark Technology Co., Ltd., a part-time professor of the Department of Engineering Physics of Tsinghua University, a part-time professor of Beijing Jiaotong University, and an EMC lecturer of Beijing Angxun Technology Co., Ltd. He has taught for the Institute of Electronics of the Chinese Academy of Sciences, Beijing Institute of Technology, Beijing University of Posts and Telecommunications, various institutes of the Ministry of Information Industry, the 57th Institute of the General Staff, Huawei, Lenovo, ZTE, Putian and other units, and has published many books. Beijing Angxun Technology: We focus on EMC electromagnetic compatibility design, electronic product reliability design, lead-free welding, safety engineering practice in the electronics industry, and serve the civilian and military products of enterprises. Training targets: laboratories in the electronics industry nationwide, military scientific research institutions, heads of development departments, EMC engineers, hardware development engineers, test engineers, PCB LAYOUT engineers, quality control engineers, system engineers, and structural design engineers. Training course outline: This training course outline can be taught according to the needs of the trainees. According to the requirements of the trainees, we can modify the teaching outline to meet the requirements of the trainees as much as possible. The following teaching outline is for reference only. If you need more details, please call us for consultation. I. Introduction 1. Challenges of Moore's Law 2. Purpose of EMC design 3. Electromagnetic disturbance and its hazards 4. Electromagnetic compatibility 5. Basis of EMC design 6. EMC standards and specifications 7. Importance of electromagnetic compatibility 8. EMC cost-effectiveness - the relationship between EMC intervention time and cost 9. The difference between EMC design and anti-electromagnetic disturbance 10. Theoretical basis of EMC design 11. Electromagnetic compatibility management 12. Electromagnetic compatibility certification in my country 13. What is EMC design for integrated circuits II. Methods for suppressing disturbance sources and cutting off coupling paths III. Motherboard design IV. Ground wire design V. Three basic skills of shielding design VI. Filtering design VII. Suppression of transient disturbance VIII. EMC/EMI issues in layout design 1. Layout design 2. Layout example: DI noise current/transient load current/DI noise voltage 3. Layout example: differential mode disturbance/common mode disturbance 4. Layout example: conducted disturbance coupling 5. Layout example: common impedance disturbance coupling 6. Layout example: common power supply impedance coupling 7. Layout example: inductive disturbance coupling/crosstalk 8. Layout example: radiated disturbance coupling/non-closed current-carrying circuit/closed current-carrying circuit 9. Layout example: sensitivity characteristics/coupling path IX. Layout EMC design 1. Reduce the impedance of the layout interconnection line routing 2. Layout layout and wiring principles: low-frequency wiring takes the shortest distance (minimum resistance); high-frequency wiring takes the minimum loop area (minimum impedance); layout and incompatible segmentation 3. Design principles for power grid/ground grid, power bus/signal bus and grounding in the layout 4. Hierarchical structure and multi-metal layer design and application/metal distance and density 1), stacking design, selection of layer number and size 2), 2W principle 3), transmission delay and characteristic impedance and impedance matching 4), the meaning of signal integrity 5), signal integrity issues 6), crosstalk in IC design 5. ESD circuit analysis X. Shielding design 1. Selection of shielding material and thickness and calculation of shielding effectiveness 2. Shielding in IC XI. Successful layout example 1. Source voltage detection circuit layout design 2. Using CADENCE IC Craftsman automatic layout and routing 3. Layout optimization of SuperV chip 4. Ledit layout design software 5. Hierarchical physical design of million-gate ASIC 12. Integrated circuit design software 1. Cadence RF design kits 2. CADENCE: mainstreaming of SiP IC design 4. Calibre verification for RFIC design 5. LCoS (Liquid-Crystal-On-Silicon) display chip 6. CMOS device layout DUMMY graphics 13. Master IC packaging characteristics to suppress EMI 1. DIP 2. Chip carrier packaging 3. Quad Flat Package 4. BGA packaging 5. CSP packaging 6. Bare chip assembly 7. Flip Chip (FC) 8. Multi-chip module 9. System on chip (SOC) 14. Integrated circuit EMC standards and tests 1. Integrated circuit electromagnetic compatibility test standards 2. IEC62132 standard: integrated circuit electromagnetic immunity 3. IEC61967 standard: integrated circuit electromagnetic emission In addition: Zhuang Yiqi "Reliability Technology of Electronic Components Application" Gu Aiyun's "Practical Lead-free Soldering Technology" is now open for registration!

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