XMOS announces partnership with DSP Concepts

Artificial intelligence and chipset supplier XMOS has announced a partnership with embedded audio software specialist DSP Concepts.

The partnership agreement will allow audio developers to combine XMOS’ highly deterministic, low-latency xcore.ai platform with DSP Concepts’ Audio Weaver software, which enables users to graphically design and debug audio and voice solutions leveraging multiple cores.

Integrating edge AI, DSP, control and IO in a single device, xcore.ai is a high-performance, multi-purpose processor designed for the intelligent IoT. It is fully configurable in software and, according to XMOS, provides a cost-effective, versatile platform for fast time-to-market IoT products.

DSP's Audio Weaver provides a one-stop solution for audio product development from R&D to production. It combines sophisticated graphical design tools with more than 500 pre-built models, which means designers can build audio processing pipelines graphically while almost completely eliminating the need for complex manual code.

Audio Weaver makes the encoding process a drag-and-drop operation, while xcore.ai enables full customizability through software alone, and the two solutions combined will be able to provide a new level of flexibility and accessibility when designing audio and voice products, while reducing BOM costs and accelerating time to market.

Engineers can take advantage of this combination through XMOS’ xcore.ai multi-channel audio evaluation board and a fully productized, customer-driven software development kit (SDK).

It also brings together the strong support networks and engineering communities of both platforms.

“Audio innovation needs to be made easier so that audio engineers can focus on differentiating the products they are making,” said Chin Beckmann, CEO of DSP Concepts. “Audio Weaver is designed to simplify the design process, and its visual approach, multiple deployment options, and deep integration with silicon partners all help focus on the product rather than the frustrating development process. The adaptability of XMOS will enhance this advantage.”

Aneet Chopra, Executive Vice President of Marketing and Product Management at XMOS, added: “With so many market opportunities in the IoT space, versatility has always been a priority for XMOS – designers and engineers need to be able to change their designs and explore new ideas without being held back. The collaboration with DSP Concepts is the latest milestone in this journey, giving designers even more tools to improve their designs and bring new, impactful applications to market quickly.”