RF front-end chip GC1101 replaces RFX2401C for 2.4G wireless wall-mounted speakers-EEWORLD

Collect

Wireless wall-mounted speakers are commonly used in school classrooms for wireless teaching, conference training, shopping malls, supermarkets, store restaurants, etc. The device has a reliable pairing method, super anti-interference ability, low power consumption, etc. The wall-mounted speaker is composed of a sound source input device, a signal amplifier (power amplifier) and a wall-mounted speaker. It is a complete sound system. The commonly used working frequency band is the ISM2.4GHz free frequency band. This article recommends using the GC1101 of Dixin Technology for the 2.4G wireless wall-mounted speaker RF front end.

GC1101 is a single-chip RF front-end with fully integrated RF functions for IEEE 802.15.4/Zigbee, Bluetooth wireless sensor networks and other 2.4GHz ISM band wireless systems. It is a single-chip device implemented in CMOS technology, which integrates RF power amplifier, low noise amplifier and chip transceiver switch control circuit.

The conventional applications of GC1101 mainly include industrial control automation, smart home and RF systems that comply with the RF4CE protocol. Due to the excellent performance, high sensitivity and efficiency, low noise, small size and low cost of the chip, GC1101 is a perfect solution for narrowband applications within the ISM frequency bandwidth. The CMOS function control logic circuit of GC1101 is very simple, low power consumption, and only a small number of peripheral devices are used, which can facilitate the overall integrated design of the system.

GC1101 pinout.png

Performance advantages of Dixin Technology GC1101:

•2.4GHz high power single chip RF front end integrated chip

• Input and output ports matched to 50-Ohm

• Integrated +22.5dBm output power power amplifier

• Integrated 2.9dB noise figure low noise amplifier

• Transmit/receive switch circuit

• ESD protection circuits for all ports

•Integrated full on-chip matching circuitry

• Using market-proven CMOS technology

• Using QFN-16 (3x3x0.75m)

Reference address：RF front-end chip GC1101 replaces RFX2401C for 2.4G wireless wall-mounted speakers

Previous article：DK1203 Dongke flyback secondary feedback switching power supply control chip AC-DC switching power supply
Next article：Application and solution of IGBT in induction cooker

Recommended ReadingLatest update time:2024-11-16 09:57

Learn ARM development (2)

It was Sunday, and I was just resting at home. It was a good time to learn ARM. I got up very early in the morning because I was always anxious about how to set up the ARM development environment. I couldn't sleep well. I immediately turned on the computer. In order to speed up, I turned on both computers at hom

[Microcontroller]

Huawei executives responded that Exynos 980 has a downlink rate of up to 2.55Gbps

Earlier, Huawei's vice president of mobile phone product line Li Xiaolong talked about the Exynos 980 released by Samsung: "Today I saw that a manufacturer also released a 980 chip. One of the parameters published in it, "supporting the maximum download rate of 2.55Gbps in the Sub6GHz frequency band of the 5G network"

[Mobile phone portable]

Huawei executives responded that Exynos 980 has a downlink rate of up to 2.55Gbps

Samsung Electronics announces that its first backside power supply process node SF2Z will be launched in 2027

On June 13, Samsung Electronics announced at the Samsung Foundry Forum 2024 North America held in the early hours of Beijing time today that its first process node SF2Z using BSPDN (back side power delivery network) will be launched in 2027. BSPDN technology transfers the chip's power supply network to the back

[Semiconductor design/manufacturing]

Samsung Electronics announces that its first backside power supply process node SF2Z will be launched in 2027

Huawei WATCH GT2 Pro disassembly: In addition to the luxurious appearance, what other upgrades are there inside?

As Huawei's new smartwatch, Huawei WATCH GT2 Pro has undergone a lot of upgrades compared to the previous generation Huawei WATCH GT2. In addition to the visible ceramic back cover and wireless charging, what are the changes inside? eWiseTech's disassembly of Huawei WATCH GT2 has been online for a long time, and today

[Embedded]

Huawei WATCH GT2 Pro disassembly: In addition to the luxurious appearance, what other upgrades are there inside?

Samsung Galaxy Fold 2 new news: comprehensive upgrade

Recently, Korean media exposed the upgraded changes of Samsung's second-generation folding screen flagship product, Samsung Galaxy Fold 2, and made a detailed comparison with the first-generation product. 　　Specifically, the inner and outer screens of Galaxy Fold 2 have been greatly upgraded. The inner screen is

[Mobile phone portable]

STM32 ADC_2 (DMA example)

Example analysis: (using DMA mode) mian function: extern __IO u16 ADC_ConvertedValue; //The voltage value converted by ADC is defined in the context of ADC1_Init() float ADC_ConvertedValueLocal; //Used to save the converted voltage value int main(void) { USART1_Config(); //Serial port configuration ADC1_Init()

[Microcontroller]

STC8 Series MCU Hardware I2C Usage Tutorial (Part 2)

1. I2C related registers STC8 series MCU hardware I2C usage tutorial (I) 2. Registers related to I2C interrupt ① I2C interrupt source ② I2C interrupt enable bit ③ I2C interrupt flag 3. Programming ① Registers and related macro definitions sfr P_SW2 = 0xBA; //Peripheral port switch register 2 #define I2CCF

[Microcontroller]

STC8 Series MCU Hardware I2C Usage Tutorial (Part 2)

Conflict between FSMC and hardware I2C in STM32

The errata table on the ST official website states that FSMC and I2C cannot be enabled at the same time. The solution is: 1. Map I2C to PB9, PB8. 2: Use simulated I2C. I/O remapping steps: (Take the serial port as an example) 1. Turn on the remapped clock and the remapped I/O port pin clock of USART, RCC_APB2Periph

[Microcontroller]