Infineon appears at ELEXCON 2022 to showcase three major application solutions of "automotive, Internet of Things, and energy"

Infineon was formerly the semiconductor division of Siemens. It became independent in 1999 and went public the following year. Since its establishment, Infineon has streamlined its business many times and spun off DRAM, wireless solutions and other departments. While continuing to streamline its business, Infineon is also constantly strengthening the depth of its layout. In 2015, Infineon completed the acquisition of the American International Rectifier Company (IR), strengthening its market position in power semiconductors. In 2019, Infineon announced that it would acquire the American semiconductor giant Cypress for US$8.7 billion, improving its technical strength and market share in MCUs, power management chips, sensors and other fields. In the field of market segments, Infineon not only continues to maintain its global leadership in power semiconductors and safety controllers, but also becomes the world's number one automotive semiconductor supplier.

In 2020, with the completion of integration, Infineon has become one of the top ten semiconductor companies in the world and divided its business into four major departments, namely automotive (Automotive, ATV), industrial power control (Industrial Power Control, IPC), Power & Sensor Systems (PSS) and Connected Security Systems (CSS). Infineon's annual report for fiscal year 2021 (ending September 30 of the calendar year) shows that its automotive chips account for 13.2% of the global market, ranking first in the world.

On November 6, 2022, Infineon demonstrated a number of its important products at the Elexcon Shenzhen International Electronics Exhibition, setting up three different exhibition areas according to different application markets, namely "Future Mobility", "Internet of Everything" and "Energy" Efficiency" respectively corresponds to the three major application fields of "automobile, Internet of Things, and energy".

Among them, the products displayed in the "Future Mobility" exhibition area include discrete device welding solution samples, BMS battery management systems, Bluetooth car keys, automotive-grade silicon microphones, 12.3-inch digital LCD instruments based on Traveo™ II microcontrollers, hydrogen sensor samples, angle sensor demos, Wide range, high reliability current sensor demo.

Several products worth focusing on include the automotive-grade silicon microphone demonstrated by Infineon, which can extract sounds around the vehicle, resulting in some new application scenarios, including Tesla's addition of audio and visual perception systems. Although smart driving assistance is equipped with cameras, radar, and even lidar, it is likely that it will not be able to detect surrounding blind spots. At this time, hearing assistance is needed to identify the surrounding environment. This solution adds XENSIV™ MEMS microphones to existing sensor systems, allowing the vehicle to “see” around corners and alert the vehicle to moving objects hidden in blind spots. This new sensing solution is based on XENSIV™ MEMS microphones. It combines the algorithms of AURIX™ microcontroller (MCU) and RealityAI to form the AutomotiveSee-With-Sound (car audio and video) system. The automotive-compliant microphone IM67D130A has an operating temperature range of -40°C to +105°C, making it suitable for various application scenarios in harsh automotive environments.

Another product is a hydrogen sensor. Hydrogen energy vehicles are inseparable from hydrogen in all aspects from the initial hydrogen production, hydrogen transportation, hydrogenation to hydrogen use. Therefore, this sensor can be applied to the entire industrial chain and can detect whether there is hydrogen leakage in the process. In addition to hydrogen energy vehicles, another application is the detection of thermal runaway in the battery telecommunications of today's pure electric vehicles. The hydrogen sensor detects the amount of hydrogen decomposed in the battery core and can provide an alarm.

The third product is Infineon's 12.3-inch digital LCD instrument based on the TraveoTMII microcontroller. Infineon has two families of microcontrollers: the AURIX family and the Traveo family. The Traveo MCU product line actually comes from the acquired Cypress. This exhibition displays graphic products, mainly display screens. The product has a resolution up to 2880*1080, built-in hardware 2.5D graphics acceleration engine and surface correction engine, supports LVDS/RGB/MIPI multiple video format input and output, 4chCAN-FD and 1ch Ethernet, built-in Security engine supports HSMfull , compliant with functional safety ASIL-B level. Compared with competing SoC solutions, the advantages of the Traveo solution include low cost, fast startup speed, and the ability to "boot up within seconds."

The fourth product is Infineon's angle sensor Demo, which can detect the angle of a broken shaft. After fetching the information through the MCU, the rotation speed can be calculated by using GMR and AMR to sample angle information.

The fifth product is the Infineon current sensor Demo, which is mainly used in motors to detect current. Its principle is mainly to detect the size of the current based on the strength of the magnetic field.

In addition to reducing the loss of automobile power through discrete devices, Infineon is also working hard on automobile batteries. The overall solution for the battery management system launched by Infineon this time supports ASIL-D functional safety, TLE9012DQU12 independent ADC sampling, built-in low-pass filter, reducing the number of peripheral devices, and two-way daisy chain communication to ensure the consistency of battery core attenuation. According to Infineon technical personnel, “A daisy chain communication method is used between analog front ends, and isolated communication is carried out through capacitors or transformers. Another feature is that it supports loop communication, that is, from the main node through each sub-node and back again. Communication to the main node. The advantage of this is that if any node in the middle is disconnected, the entire communication will not be affected and communication can be carried out through the other side. "

Infineon also exhibited a Bluetooth car key solution. When Bluetooth is required to open/lock, the user uses a mobile terminal with an APP installed and clicks to unlock/lock within a certain range of the car, and the door will automatically open/close. Lock. The entire key unlocking and locking process is carried out through the server for key transfer and authentication, so its security can be guaranteed. This subsystem includes: the smallest system with TC275 microcontroller as the core; SLI97 series security chips; external modules (BLE module and Wifi module), etc.

Products displayed in the "Internet of Everything" exhibition area include Jiyin XPRINT photo printer, 3DToF-based face recognition + driver monitoring system, and 3DToF-based passenger monitoring system.

Jiyin XPRINT photo printer is a portable dye-sublimation photo printer that integrates Wi-Fi and Bluetooth functions. It can support 2.4G and 5G dual-band, avoid the crowded 2.4G, and realize one-click connection with mobile phones, so you can shoot and print anytime, anywhere. Infineon's Bluetooth products also have relatively good compatibility and radio frequency performance in the industry. They have low standby power consumption.

Infineon's two 3DToF products, face recognition + driver monitoring system and passenger monitoring system, are the world's first high-resolution automotive 3D image sensors that comply with ISO26262 standards. Its resolution is FoV50*41VGA, and the SDK simultaneously outputs IR, depth, point cloud and other information; working distance is 0.2-1.2 meters, accuracy is less than 1%; 940nm optical band, with internal circuit human eye and skin safety protection; DMS, Faceid recognition and personalized cockpit, adaptive AR-HUD.

Products displayed in the "Energy Efficiency" exhibition area include B&W Zeppelin Zeppelin speaker disassembly display, 1200W three-phase motor drive with PFC evaluation board, and HybridSiC ANPCEasy3B module reference design for 1500V 300kWESS application.

Products worthy of introduction in the "Energy" exhibition area include B&W Zeppelin speakers, high-performance MerusClass D amplifiers using Infineon's multi-level technology, 240W high-power audio output, extremely low distortion and HI-RES lossless music playback. The ultimate listening enjoyment. Infineon told the author that the multi-level modulation technology itself has three technical characteristics. First, compared to the traditional ClassD power amplifier, the frequency of the modulated output signal at the same switching frequency can be the original traditional ClassD modulation frequency. twice or four times, so the modulation frequency can be higher and closer to the original sound; the second feature is multi-level, so five levels of modulation can be achieved, which means that compared to the traditional ClassD The two levels can be closer to the audio signal, allowing the sound to be restored better; the third feature is multi-level modulation, so the working voltage of the switching tube is only half of the original traditional working voltage. If the working voltage of the switching tube is relatively low , the switching noise generated will also be smaller. The smaller the noise, the smaller the impact on the speaker inside the speaker, and the better the sound quality will be.

Infineon also held the 20th anniversary celebration of the PSoC series at this exhibition. At present, Infineon's two more mainstream series are PSoC4 and PSoC6. The PSoC product series also comes from the acquired Cypress, mainly targeting the IOT market. The PSoCTM4MAX Pioneer R&D Board and PSoCTM6WiFi-BT Pioneer R&D Board were displayed at this booth.

Among them, PSoC4 is a single core, and its performance is closer to some small applications, such as human-computer interaction or small motor control. PSoc is dual-core, using an M4 MCU and an M0 MCU. PSoC6 has stronger performance and can be used for some Internet of Things applications. It also supports CapsenseTM's unique comparative advantage touch technology, which can achieve a better HMI experience. In addition, applications such as fingerprint recognition and voice decoding can be done with PSoC6. For example, the smart door lock solution using PSoC6 integrates digital and analog buttons, fingerprint algorithms, and switch locks into one chip.