It is reported that recently, Hangshun's automotive-grade SoCHK32AUTO39A family has once again passed the AEC-Q100 certification and has been widely used in the original equipment market of major brands of automobiles. The signing ceremony of Hangshun Chip's 2022 ISO26262 ASIL D automotive functional safety process certification was successfully held.
Hangshun's automotive-grade SoC HK32AUTO39A family has passed AEC-Q100 certification again
Hangshun Chip launched the automotive-grade MCU project in 2018, strictly following the ISO26262 safety function process and the entire process of safety function products from product definition, design, manufacturing, packaging and testing to quality control and logistics, and released the mass production of China's first automotive-grade MCU in 2019.
At the beginning of 2022, Hangshun's automotive-grade SoCHK32AUTO39A family once again successfully passed the AEC-Q100 automotive test certification of the International Automotive Electronics Council and strictly implemented the ISO26262 full-process standard.
AEC-Q100 qualified
Hangshun's automotive-grade SoC HK32AUTO39A family adopts high-performance ARMCotex-M3/M0 core, supports floating-point processing coprocessor, and has strong data processing capabilities. This automotive-grade SoC family adopts the latest process standards to greatly improve the performance of various chips. The HK32AUTO39A family automotive-grade SoC has a main frequency of up to 120M, built-in 527KBFLASH, 97KB SRAM large storage, and rich peripheral interfaces, including 2 high-speed CAN2.0, 2 high-speed I2C, 3 high-speed SPI, and 6 high-speed USART, 1 full-speed USB2.0, to meet most automotive electronic applications. The series also has 3 high-precision ADC modules, 2-way DAC interfaces, and supports special applications such as digital camera interface and TFT driver, and has the characteristics of low power consumption and high stability. At present, this automotive-grade SoC family is widely used in automotive central control navigation, air conditioning, vehicle-mounted, car windows, entertainment systems and other vehicle domain controls.
After mass production, Hangshun's automotive-grade SoC HK32AUTO39A family has received widespread attention and recognition from the market, and has been put into development and mass adoption in projects of major automobile manufacturers. The manufacturing rigid requirements for automotive-grade SoCs are much higher than those for general commercial-grade and industrial-grade chips. There are strict requirements for the service life, stability, working temperature resistance, PPM, etc. of automotive-grade SoCs.
Hangshun's automotive-grade SoC HK32ATUO39A family has been delivered in batches to major automobile manufacturers and Tier 1 solution providers:
Hangshun Chip's 2022 ISO26262 Automotive Functional Safety ASIL D Process Certification Signing Ceremony was Successfully Held
On March 17, 2022, the signing ceremony of Hangshun Chip's 2022 ISO26262 Automotive Functional Safety ASIL D Process Certification was held at the Chengdu Branch. Hangshun Chip CTO Wang Xiang and the company's ISO26262 certification working group members attended the event with Bao Yan, senior manager of SGS Automotive Service Department in South China, and witnessed the launch of Hangshun Chip's 2022 ISO26262 Automotive Functional Safety ASIL D Process Certification. The ISO26262 Automotive Functional Safety ASIL D process will provide a solid foundation and stable support for the implementation of Hangshun's dual strategy of "automotive SoC + high-end MCU supermarket".
Hangshun Chip CTO Wang Xiang and SGS Automotive Service Department South China Senior Manager Bao Yan signed a cooperation agreement
Wang Xiang, CTO of Hangshun Chip, said in his speech on the spot that driven by downstream application scenarios such as consumer electronics, industrial control, and automotive electronics, the global MCU market size will reach US$23.9 billion in 2022. In 2022, my country's market size is expected to exceed 70.9 billion yuan, of which European and American manufacturers account for more than 90%, and domestic manufacturers account for only about 2%-3%. Because the industry is booming, the trend of domestic substitution is obvious. Hangshun Chip has leading technical advantages, production capacity and process advantages. In three years, it has mass-produced more than 300 MCU products from 29 major families and firmly stood in the first echelon in China.
Hangshun Chip takes "automotive SoC + high-end MCU supermarket" as its strategy; while continuing to build a wider and deeper high-end MCU supermarket, it focuses on the research and development, production and sales of automotive SoC chips. The support behind it is the domestic independence, electronic systematization and huge demand for chips (especially MCU/SoC main control chips) in the automotive industry. At the same time, the domestic automotive industry policy standards are gradually tightening, and the quality and safety of automobiles are facing strict tests. As the core components in automotive electronic systems, the research and development design, product production release and operation and maintenance of MCU/SoC chips for functional safety (FuSa) have become necessary conditions for ensuring the safe driving of domestic cars. Traditional chip research and development focuses on the optimal realization of required functions and performance, while functional safety (FuSa) focuses on the safe operation design after chip failure. When the hardware fails randomly or the system fails, how can the MCU/SoC chip enter a safe state through safety redundancy design to ensure the safety of the ECU system? This question is the main question that needs to be answered when traditional chips evolve to automotive chips. To this end, Hangshun Chip has joined hands with SGS to jointly build the ASILD highest level automotive functional safety process defined by the ISO26262 standard; and based on Hangshun's ISO9001 quality management system, it has developed automotive-specific SoCs through the ISO26262 automotive functional safety ASILD process.
Hangshun Chip is determined to work together with car manufacturers, automotive system suppliers, and automotive parts suppliers to make China-made safe cars famous around the world.
Bao Yan, senior manager of SGS Automotive Service Department in South China, delivered a speech on the spot. As a leading domestic chip company, Hangshun Chip chose to cooperate with SGS in functional safety projects, which is a recognition and support for us in the field of functional safety training and certification.
As a semiconductor industry cluster in western China, Chengdu has gathered many outstanding companies, high-quality talents and superior products. SGS has been operating in the west for a long time and has a good customer base and cooperation cases. Through this cooperation, the influence of SGS functional safety services in the west will be further expanded. Following the cooperation with manufacturers of communication products, RTOS products and traditional control system products, Hangshun Chip is the first automotive-grade high-end MCU chip manufacturer that SGS has welcomed in the west. We will actively assist Hangshun Chip in the smooth implementation of the dual strategy of "automotive-grade SoC + high-end MCU supermarket" through cooperation in functional safety projects.
SGS held a discussion meeting with Hangshun Chip's ISO26262 Automotive Functional Safety ASIL D Process Certification 2022 Working Group members
ASILD's automotive functional safety process certification indicates that Hangshun Chip is gradually building a product development and process system that meets the ISO26262 standard. The supporting R&D and management capabilities have also been verified and improved. We strive to bring the safety and reliability of Hangshun's automotive-grade SoC products to the highest standards, in line with international advanced levels, and lay a solid foundation for Chinese automotive chips to enter the international automotive supply system and participate in international competition.
About the Automotive Electronics Council (AEC)
As automotive verification standards, including AEC-Q100 (integrated circuit IC), AEC-Q101 (discrete devices), AEC-Q102 (optoelectronic devices), AEC-Q103 (MEMS devices), AEC-Q104 (MCM multi-chip components), AEC-Q200 (passive devices), its test conditions are more stringent than consumer/industrial control chip specifications, and stipulates the test items and conditions that various automotive components should complete, which is used to verify whether electronic components can meet AEC-Q requirements. Among them, automotive electronics has relatively wide requirements for the operating temperature of components, and has different requirements according to different installation locations, but generally higher than the requirements of civilian products, such as engine compartment: -40℃-150℃; body control: -40℃-125℃; driving control system: -40℃-105℃, while consumer products only need to reach: 0℃-70℃.
The AEC Parts Technical Committee is a standardization body that establishes reliable, high-quality electronic component standards. Components that meet these standards can meet the minimum requirements of the automotive environment without the need for additional component-level qualification testing. Therefore, to enter the automotive field and enter the supply chain of Tier 1 automotive electronics manufacturers, you must obtain the AEC-Q certification ticket.
About ISO26262 Standard
The ISO26262 standard is a globally recognized automotive functional safety standard that covers the entire product life cycle, including functional safety management, concept stage development, system stage development, hardware stage development, software stage development, support processes, safety analysis, product release and other aspects.
Previous article:Auto-Drive Technology and Ambarella reach in-depth cooperation in the field of intelligent cockpit visual perception
Next article:Andes Technology and IAR Systems Join Forces to Help Leading Automotive Chip Designers Accelerate Time-to-Market
- Popular Resources
- Popular amplifiers
- Car key in the left hand, liveness detection radar in the right hand, UWB is imperative for cars!
- After a decade of rapid development, domestic CIS has entered the market
- Aegis Dagger Battery + Thor EM-i Super Hybrid, Geely New Energy has thrown out two "king bombs"
- A brief discussion on functional safety - fault, error, and failure
- In the smart car 2.0 cycle, these core industry chains are facing major opportunities!
- The United States and Japan are developing new batteries. CATL faces challenges? How should China's new energy battery industry respond?
- Murata launches high-precision 6-axis inertial sensor for automobiles
- Ford patents pre-charge alarm to help save costs and respond to emergencies
- New real-time microcontroller system from Texas Instruments enables smarter processing in automotive and industrial applications
- Innolux's intelligent steer-by-wire solution makes cars smarter and safer
- 8051 MCU - Parity Check
- How to efficiently balance the sensitivity of tactile sensing interfaces
- What should I do if the servo motor shakes? What causes the servo motor to shake quickly?
- 【Brushless Motor】Analysis of three-phase BLDC motor and sharing of two popular development boards
- Midea Industrial Technology's subsidiaries Clou Electronics and Hekang New Energy jointly appeared at the Munich Battery Energy Storage Exhibition and Solar Energy Exhibition
- Guoxin Sichen | Application of ferroelectric memory PB85RS2MC in power battery management, with a capacity of 2M
- Analysis of common faults of frequency converter
- In a head-on competition with Qualcomm, what kind of cockpit products has Intel come up with?
- Dalian Rongke's all-vanadium liquid flow battery energy storage equipment industrialization project has entered the sprint stage before production
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions at Electronica 2024
- Car key in the left hand, liveness detection radar in the right hand, UWB is imperative for cars!
- After a decade of rapid development, domestic CIS has entered the market
- Aegis Dagger Battery + Thor EM-i Super Hybrid, Geely New Energy has thrown out two "king bombs"
- A brief discussion on functional safety - fault, error, and failure
- In the smart car 2.0 cycle, these core industry chains are facing major opportunities!
- The United States and Japan are developing new batteries. CATL faces challenges? How should China's new energy battery industry respond?
- Murata launches high-precision 6-axis inertial sensor for automobiles
- Ford patents pre-charge alarm to help save costs and respond to emergencies
- New real-time microcontroller system from Texas Instruments enables smarter processing in automotive and industrial applications
- How to set up the Qt program to start automatically on the Sinlinx A64 development board
- Some time functions in C language (time/sleep/clock)
- National Undergraduate Electronic Design Competition Paper Album
- How to choose the size of the capacitor and resistor when connecting the signal line (clock) in series?
- DSP digital anti-noise module for airborne communication equipment
- Examples of Qorvo solutions for NB-IoT RF front-ends
- Are eMMC 4.0 and 5.0 compatible?
- MCU driver GEC6818 program development record
- How smart stores equipped with multiple sensors make shopping a breeze
- Showing off the products + CSR development board 10 years ago, when the Bluetooth market was just beginning to develop!