Thermo Fisher Scientific's Helios 5 EXL dual-beam transmission electron microscope accelerates time to volume production through automated sample preparation
Accelerating TEM sample preparation using machine learning
April 20, 2021, Shanghai - Thermo Fisher Scientific, a world leader in serving science, announced the launch of the Helios 5 EXL wafer dual-beam transmission electron microscope, designed to meet the increasing sample volume and corresponding analysis needs of semiconductor manufacturers as they scale up their operations. This product has machine learning and advanced automation capabilities to provide precise sample preparation to support sub-5nm node technology and all-around gate semiconductor processes and yield improvements.
As semiconductor processes move toward smaller and more complex processes, semiconductor manufacturers require more reproducible, high-volume transmission electron microscopy (TEM) analysis results. The growing demand for atomic-level data poses scalability challenges for busy laboratories to use advanced instrumentation to obtain ideal results. Advances in all-around gate technology have increased the demand for more interfaces, thin films, and measurable cross-sections with sub-nanometer resolution, which has also increased the difficulty of upgrading high-volume TEM analysis.
Through machine learning and closed-loop feedback for extreme configuration, Helios 5 EXL provides precise cutting, allowing operators to maintain high-quality output even when performing difficult sample preparation. Compared with existing solutions, improved automation technology optimizes the ratio of machine and manual operation, aiming to maximize sample output and technical resource productivity.
“Semiconductor labs are under tremendous pressure to deliver TEM analysis data faster to support process monitoring and improve learning curves without increasing costs,” said Glyn Davies, vice president of the Semiconductor Division at Thermo Fisher Scientific. “The Helios 5 EXL meets this challenge with scalable, reproducible and high-precision TEM sample preparation.”
Helios 5 EXL maintains the integrity of the wafer structure, helping semiconductor manufacturers extract more data from each wafer than existing solutions to improve the success rate of TEM analysis.
Previous article:Typical Fault Troubleshooting of Switching Power Supplies for Several Digital Satellite Receivers
Next article:Methods for detecting IGBT modules
- Popular Resources
- Popular amplifiers
- Keysight Technologies Helps Samsung Electronics Successfully Validate FiRa® 2.0 Safe Distance Measurement Test Case
- From probes to power supplies, Tektronix is leading the way in comprehensive innovation in power electronics testing
- Seizing the Opportunities in the Chinese Application Market: NI's Challenges and Answers
- Tektronix Launches Breakthrough Power Measurement Tools to Accelerate Innovation as Global Electrification Accelerates
- Not all oscilloscopes are created equal: Why ADCs and low noise floor matter
- Enable TekHSI high-speed interface function to accelerate the remote transmission of waveform data
- How to measure the quality of soft start thyristor
- How to use a multimeter to judge whether a soft starter is good or bad
- What are the advantages and disadvantages of non-contact temperature sensors?
- Innolux's intelligent steer-by-wire solution makes cars smarter and safer
- 8051 MCU - Parity Check
- How to efficiently balance the sensitivity of tactile sensing interfaces
- What should I do if the servo motor shakes? What causes the servo motor to shake quickly?
- 【Brushless Motor】Analysis of three-phase BLDC motor and sharing of two popular development boards
- Midea Industrial Technology's subsidiaries Clou Electronics and Hekang New Energy jointly appeared at the Munich Battery Energy Storage Exhibition and Solar Energy Exhibition
- Guoxin Sichen | Application of ferroelectric memory PB85RS2MC in power battery management, with a capacity of 2M
- Analysis of common faults of frequency converter
- In a head-on competition with Qualcomm, what kind of cockpit products has Intel come up with?
- Dalian Rongke's all-vanadium liquid flow battery energy storage equipment industrialization project has entered the sprint stage before production
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions at Electronica 2024
- Car key in the left hand, liveness detection radar in the right hand, UWB is imperative for cars!
- After a decade of rapid development, domestic CIS has entered the market
- Aegis Dagger Battery + Thor EM-i Super Hybrid, Geely New Energy has thrown out two "king bombs"
- A brief discussion on functional safety - fault, error, and failure
- In the smart car 2.0 cycle, these core industry chains are facing major opportunities!
- The United States and Japan are developing new batteries. CATL faces challenges? How should China's new energy battery industry respond?
- Murata launches high-precision 6-axis inertial sensor for automobiles
- Ford patents pre-charge alarm to help save costs and respond to emergencies
- New real-time microcontroller system from Texas Instruments enables smarter processing in automotive and industrial applications
- Hongmeng Development Board Neptune - The Cheapest Hongmeng Development Board: Unboxing
- A factory in Shenzhen closed down, and got a batch of WIFI air conditioner microcontrollers. Students who like research can tinker with them.
- Teach you how to port RT-Thread to domestic MCU
- Operating Systems: The Essence and Design Principles (8th Edition)
- python zen song
- This is the best neural network I have ever seen.
- Wireless temperature transmitter based on ZigBee
- [Live broadcast tomorrow] Keysight metrology experts will give a lecture: Electronic instrument metrology calibration knowledge and calibration cycle
- STM32F429 uses freemodbus to communicate with the computer and shows a write communication error
- Font software