This article focuses on the main problems of welding defects, insulation failure (CAF and ECM) and solder joint fatigue failure in military electronic components, and introduces the commonly used failure analysis methods and means for military electronic components, including metallographic section analysis, acoustic scanning analysis, scanning electron microscope and energy spectrum, thermal analysis and Fourier transform infrared spectroscopy analysis. Then, combined with typical failure analysis cases of military electronic components, the application of these analysis techniques in actual cases is introduced. The acquisition of PCBA failure mechanism and cause will be beneficial to the quality control of PCBA in the future to avoid the recurrence of similar problems.
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