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Three-dimensional morphology prediction of solder joints of surface-mount components in microelectronic assembly

  • 2013-09-18
  • 242.44KB
  • Points it Requires : 2

In the process of microelectronic assembly, the solder joint morphology directly affects the quality and reliability of the solder joint. The prediction of solder joint morphology is the basis of solder joint quality control and reliability analysis. This paper adopts the finite element method and combines the energy minimization principle to realize the prediction of the three-dimensional morphology of solder joints. By establishing a finite element model, performing boundary and volume constraints, gravitational potential energy and surface potential energy constraints, the three-dimensional morphology prediction of the solder joint of the surface mount resistor is completed, and the grid distortion in the morphology prediction is corrected. The experiment verifies that the solder joint morphology prediction is accurate, which lays the foundation for the quality and reliability analysis of the solder joint.

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