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Development Trends and Challenges of High-Power Semiconductor Laser Packaging Technology

  • 2013-12-06
  • 650.83KB
  • Points it Requires : 1

        This paper reviews the existing packaging technologies of high-power semiconductor lasers (including single-emitter cavity, bar, horizontal array and vertical stack), and discusses their development trends. It also analyzes the problems and challenges faced by semiconductor laser packaging technology, and provides methods and strategies to solve the problems and meet the challenges.

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