Development and Application of Through Silicon Via Interconnection Technology Feng Guoqiang Cai Jian Wang Shuidi (Institute of Microelectronics, Tsinghua University, Beijing 100084, China) Abstract: With the development of three-dimensional stacked packaging, MEMS packaging, vertical integrated sensor arrays, and table MOS power device flip-chip technology, through silicon via interconnection technology is receiving more and more attention and research. This paper describes several through silicon via interconnection manufacturing methods and their applications. Finally, the research status and challenges of several key technologies in through silicon via interconnection are further explained. Keywords: through silicon via interconnection; three-dimensional packaging; MEMS packaging
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