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Thermal design and heat dissipation calculation of power devices

  • 2013-12-06
  • 275.62KB
  • Points it Requires : 2

        At present, the main failure mode of electronic equipment is thermal failure. According to statistics, 55% of the failure of electronic equipment is caused by the temperature exceeding the specified value. As the temperature increases, the failure rate of electronic equipment increases exponentially. Therefore, the thermal design of power devices is an important link in the structural design of electronic equipment. It directly determines the success of the product. Good thermal design is the basis for ensuring stable and reliable operation of the equipment.

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