M95256-RMC6TG datasheet, PDF - EEWORLD Datasheet

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M95256-RMC6TG: Description256 Kbit SPI bus EEPROM with high-speed clock; Categorystorage storage; File Size751KB，57 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M95256-RMC6TG Overview

256 Kbit SPI bus EEPROM with high-speed clock

M95256-RMC6TG Parametric

Parameter Name	Attribute value
Brand Name	STMicroelectronics
Objectid	1085156238
package instruction	HVSON, SOLCC8,.11,20
Reach Compliance Code	compliant
Country Of Origin	Philippines
Samacsys Description	256 Kbit SPI bus EEPROM with high-speed clock
Samacsys Manufacturer	STMicroelectronics
Samacsys Modified On	2022-09-14 06:26:03
YTEOL	7.08
Maximum access time	80 ns
Maximum clock frequency (fCLK)	20 MHz
Data retention time - minimum	200
Durability	4000000 Write/Erase Cycles
JESD-30 code	R-PDSO-N8
JESD-609 code	e4
length	3 mm
memory density	262144 bit
Memory IC Type	EEPROM
memory width	8
Humidity sensitivity level	1
Number of functions	1
Number of terminals	8
word count	32768 words
character code	32000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	32KX8
Package body material	PLASTIC/EPOXY
encapsulated code	HVSON
Encapsulate equivalent code	SOLCC8,.11,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
power supply	2/5 V
Certification status	Not Qualified
Maximum seat height	0.6 mm
Serial bus type	SPI
Maximum standby current	0.000003 A
Maximum slew rate	0.003 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	2 mm
Maximum write cycle time (tWC)	5 ms
write protect	HARDWARE/SOFTWARE

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M95256-W M95256-R

M95256-DF

256-Kbit serial SPI bus EEPROM with high-speed clock

Datasheet

production data

Features

•

Compatible with the Serial Peripheral Interface

(SPI) bus

SO8 (MN)

150 mil width

•

Memory array

– 256 Kb (32 Kbytes) of EEPROM

– Page size: 64 bytes

•

Write

– Byte Write within 5 ms

– Page Write within 5 ms

•

Additional Write lockable page (Identification

page)

•

Write Protect: quarter, half or whole memory

array

•

High-speed clock: 20 MHz

•

Single supply voltage:

– 2.5 V to 5.5 V for M95256-W

– 1.8 V to 5.5 V for M95256-R

– 1.7 V to 5.5 V for M95256-DF

•

Operating temperature range: from -40 °C up

to +85 °C

•

Enhanced ESD protection

•

More than 4 million Write cycles

•

More than 200-year data retention

•

Packages:

– SO8 (ECOPACK2

)

– TSSOP8 (ECOPACK2

)

– UFDFPN8 (ECOPACK2

)

– WLCSP (ECOPACK2

)

TSSOP8 (DW)

169 mil width

UFDFPN8 (MC)

2 x 3 mm

WLCSP (CS)

March 2017

This is information on a product in full production.

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www.st.com

Contents

M95256-W M95256-R M95256-DF

Contents

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

Serial Data Output (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Serial Data Input (D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Serial Clock (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Chip Select (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Hold (HOLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Write Protect (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Connecting to the SPI bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4.1

SPI modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Operating features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.1

Supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.1.1

5.1.2

5.1.3

5.1.4

Operating supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

5.2

5.3

5.4

5.5

Active Power and Standby Power modes . . . . . . . . . . . . . . . . . . . . . . . . 14

Hold condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Data protection and protocol control . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6.1

6.2

6.3

Write Enable (WREN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Write Disable (WRDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Read Status Register (RDSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

6.3.1

WIP bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

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6.3.2

6.3.3

6.3.4

Contents

WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

BP1, BP0 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

SRWD bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

6.4

6.5

6.6

6.7

6.8

6.9

6.10

Write Status Register (WRSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Read from Memory Array (READ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Write to Memory Array (WRITE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

6.6.1

Cycling with Error Correction Code (ECC) . . . . . . . . . . . . . . . . . . . . . . 26

Read Identification Page (available only in M95256-D devices) . . . . . . . 27

Write Identification Page (available only in M95256-D devices) . . . . . . . 28

Read Lock Status (available only in M95256-D devices) . . . . . . . . . . . . . 29

Lock ID (available only in M95256-D devices) . . . . . . . . . . . . . . . . . . . . . 30

Power-up and delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

7.1

7.2

Power-up state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

10.1

10.2

10.3

10.4

SO8N package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

TSSOP8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

UFDFN8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

WLCSP package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

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List of tables

M95256-W M95256-R M95256-DF

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Table 24.

Table 25.

Table 26.

Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Write-protected block size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Instruction set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Significant bits within the two address bytes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Status Register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Protection modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Operating conditions (M95256-W, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Operating conditions (M95256-R, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Operating conditions (M95256-DF, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Cycling performance by groups of four bytes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Memory cell data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

DC characteristics (M95256-W, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

DC characteristics (M95256-R, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

DC characteristics (M95256-DF, device grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

AC characteristics (M95256-W, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

AC characteristics (M95256-R, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

AC characteristics (M95256-DF, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

SO8N – 8-lead plastic small outline, 150 mils body width,

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

TSSOP8 – 8-lead thin shrink small outline, 3 x 4.4 mm, 0.65 mm pitch,

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

UFDFN8 - 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile fine pitch

dual flat package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

WLCSP - 8-bump, 1.289 x 1.376 mm, 0.4 mm pitch wafer level chip scale

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

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List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Figure 17.

Figure 18.

Figure 19.

Figure 20.

Figure 21.

Figure 22.

Figure 23.

Figure 24.

Figure 25.

Figure 26.

Figure 27.

Figure 28.

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8-pin package connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

WLCSP connections (top view, marking side, with bumps on the underside) . . . . . . . . . . . 7

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Bus master and memory devices on the SPI bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

SPI modes supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Hold condition activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Write Enable (WREN) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Write Disable (WRDI) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Read Status Register (RDSR) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Write Status Register (WRSR) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Read from Memory Array (READ) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Byte Write (WRITE) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Page Write (WRITE) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Read Identification Page sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Write identification page sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Read Lock Status sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Lock ID sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Serial input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Hold timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Serial output timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

SO8N – 8-lead plastic small outline, 150 mils body width, package outline . . . . . . . . . . . . 42

SO8N – 8-lead plastic small outline, 150 mils body width,

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

TSSOP8 – 8-lead thin shrink small outline, 3 x 4.4 mm, 0.65 mm pitch,

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

UFDFN8 - 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile fine pitch

dual flat package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

WLCSP - 8-bump, 1.289 x 1.376 mm, 0.4 mm pitch wafer level chip scale

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

WLCSP - 8-bump, 1.289 x 1.376 mm, 0.4 mm pitch wafer level chip scale

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

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M95256-RMC6TG Related Products

	M95256-RMC6TG	M95256-WMW6TG	M95256-DFMN6TP	M95256-RMN6P	M95256-RCS6TP-A	M95256-WMW6G
Description	256 Kbit SPI bus EEPROM with high-speed clock	EEPROM 2.5 V to 5.5V 256k	Buffers u0026 Line Drivers Trancvr Driver/Recvr	EEPROM 256 Kbit Serial Bus EEPROM	EEPROM 256 Kbit SPI EEPROM 20 MHz High Speed	EEPROM 2.5 V to 5.5V 256k
Brand Name	STMicroelectronics	STMicroelectronics	-	STMicroelectronics	-	STMicroelectronics
package instruction	HVSON, SOLCC8,.11,20	SOP, SOP8,.3	-	SOP-8	-	SOP, SOP8,.3
Reach Compliance Code	compliant	unknown	-	compliant	-	unknown
Maximum clock frequency (fCLK)	20 MHz	5 MHz	-	2 MHz	-	5 MHz
Data retention time - minimum	200	40	-	40	-	40
Durability	4000000 Write/Erase Cycles	1000000 Write/Erase Cycles	-	1000000 Write/Erase Cycles	-	1000000 Write/Erase Cycles
JESD-30 code	R-PDSO-N8	R-PDSO-G8	-	R-PDSO-G8	-	R-PDSO-G8
JESD-609 code	e4	e3	-	e4	-	e3
length	3 mm	5.62 mm	-	4.9 mm	-	5.62 mm
memory density	262144 bit	262144 bit	-	262144 bit	-	262144 bit
Memory IC Type	EEPROM	EEPROM	-	EEPROM	-	EEPROM
memory width	8	8	-	8	-	8
Humidity sensitivity level	1	1	-	1	-	1
Number of functions	1	1	-	1	-	1
Number of terminals	8	8	-	8	-	8
word count	32768 words	32768 words	-	32768 words	-	32768 words
character code	32000	32000	-	32000	-	32000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	-	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	-	85 °C	-	85 °C
Minimum operating temperature	-40 °C	-40 °C	-	-40 °C	-	-40 °C
organize	32KX8	32KX8	-	32KX8	-	32KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	HVSON	SOP	-	SOP	-	SOP
Encapsulate equivalent code	SOLCC8,.11,20	SOP8,.3	-	SOP8,.25	-	SOP8,.3
Package shape	RECTANGULAR	SQUARE	-	RECTANGULAR	-	SQUARE
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	-	SMALL OUTLINE	-	SMALL OUTLINE
Parallel/Serial	SERIAL	SERIAL	-	SERIAL	-	SERIAL
Peak Reflow Temperature (Celsius)	260	260	-	260	-	260
power supply	2/5 V	3/5 V	-	2/5 V	-	3/5 V
Certification status	Not Qualified	Not Qualified	-	Not Qualified	-	Not Qualified
Maximum seat height	0.6 mm	2.5 mm	-	1.75 mm	-	2.5 mm
Serial bus type	SPI	SPI	-	SPI	-	SPI
Maximum standby current	0.000003 A	0.000005 A	-	0.000003 A	-	0.000005 A
Maximum slew rate	0.003 mA	0.005 mA	-	0.003 mA	-	0.005 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	-	5.5 V	-	5.5 V
Minimum supply voltage (Vsup)	1.8 V	2.5 V	-	1.8 V	-	2.5 V
Nominal supply voltage (Vsup)	5 V	5 V	-	2.5 V	-	5 V
surface mount	YES	YES	-	YES	-	YES
technology	CMOS	CMOS	-	CMOS	-	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	-	INDUSTRIAL
Terminal surface	NICKEL PALLADIUM GOLD	Matte Tin (Sn) - annealed	-	Nickel/Palladium/Gold (Ni/Pd/Au)	-	Matte Tin (Sn) - annealed
Terminal form	NO LEAD	GULL WING	-	GULL WING	-	GULL WING
Terminal pitch	0.5 mm	1.27 mm	-	1.27 mm	-	1.27 mm
Terminal location	DUAL	DUAL	-	DUAL	-	DUAL
Maximum time at peak reflow temperature	30	30	-	30	-	30
width	2 mm	5.62 mm	-	3.9 mm	-	5.62 mm
Maximum write cycle time (tWC)	5 ms	5 ms	-	5 ms	-	5 ms
write protect	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	-	HARDWARE/SOFTWARE	-	HARDWARE/SOFTWARE

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