7SB3257
Mux / Demux Bus Switch
The 7SB3257 Mux / Demux Bus Switch is an advanced high−speed
line switch in ultra−small footprint.
Features
•
•
•
•
•
High Speed: t
PD
= 0.25 ns (Max) @ V
CC
= 4.5 V
3
W
Switch Connection Between 2 Ports
Power Down Protection Provided on Inputs
Ultra−Small Packages
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
•
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
B1
A
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MARKING
DIAGRAMS
6
1
SOT−363/SC70−6/SC−88
DF SUFFIX
CASE 419B
6
AK MG
G
1
6
6
1
TSOP−6
DT SUFFIX
CASE 318G
1
K
ULLGA6
1.0 x 1.0
CASE 613AD
AG MG
G
B0
1
S
M
G
Figure 1. Logic Diagram
1
B1
GND
B0
1
2
3
6
5
4
S
V
CC
A
B1
GND
B0
1
2
3
6
5
4
S
V
CC
A
1
Figure 2. TSOP−6/SC−88
(Top View)
Function Table
Input S
L
H
Figure 3. ULLGA6/UDFN6
(Top View)
UDFN6
1.0 x 1.0
CASE 517BX
1
UDFN6
1.2 x 1.0
CASE 517AA
Function
A = B0
A = B1
1
UDFN6
1.45 x 1.0
CASE 517AQ
1
AK, AG, K, D, L = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
XM
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
©
Semiconductor Components Industries, LLC, 2014
1
September, 2014 − Rev. 4
Publication Order Number:
7SB3257/D
D
ULLGA6
1.45 x 1.0
CASE 613AF
D
L
ULLGA6
1.2 x 1.0
CASE 613AE
M
G
M
G
XM
M
G
7SB3257
Table 1. MAXIMUM RATINGS
Symbol
V
CC
V
IN
V
I/O
I
IK
I
OK
I
O
DC Supply Voltage
Control Pin Input Voltage
Switch Input / Output Voltage
Control Pin DC Input Diode Current
Switch I/O Port DC Diode Current
On−State Switch Current
Continuous Current Through V
CC
or GND
I
CC
I
GND
T
STG
T
L
T
J
q
JA
P
D
MSL
F
R
V
ESD
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance
Power Dissipation in Still Air at 85°C
Moisture Sensitivity
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 28 to 34
Human Body Mode (Note 2)
Machine Mode (Note 3)
Charged Device Mode (Note 4)
SC−88 / TSOP−6 (Note 1)
ULLGA6/UDFN6
SC−88 / TSOP−6 (Note 1)
ULLGA6/UDFN6
V
IN
< GND
V
I/O
< GND
Parameter
Value
−0.5 to +7.0
−0.5 to +7.0
−0.5 to +7.0
−50
−50
±128
±150
±150
±150
−65 to +150
260
150
333
496
200
252
Level 1
UL 94 V−0 @ 0.125 in
>2000
>200
N/A
±100
V
Unit
V
V
V
mA
mA
mA
mA
mA
mA
°C
°C
°C
°C/W
mW
I
LATCHUP
Latchup Performance Above V
CC
and Below GND at 85°C (Note 5)
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA/ JESD22−A114−A
3. Tested to EIA/ JESD22−A115−A
4. Tested to JESD22−C101−A
5. Tested to EIA / JESD78.
Table 2. RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
I
V
I/O
T
A
Dt
/
DV
Positive DC Supply Voltage
Control Pin Input Voltage
Switch Input / Output Voltage
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
Control Input
Switch I/O
Parameter
Min
4.0
0
0
−55
0
0
Max
5.5
5.5
5.5
+125
5
DC
Unit
V
V
V
°C
nS/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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2
7SB3257
Table 3. DC ELECTRICAL CHARACTERISTICS
T
A
= 255C
Symbol
V
IK
V
IH
V
IL
I
IN
I
OFF
I
CC
DI
CC
Parameter
Clamp Diode Voltage
High−Level Input Voltage
(Control)
Low−Level Input Voltage
(Control)
Input Leakage Current
Power Off Leakage Current
Quiescent Supply Current
Increase in Supply Current
(Control Pin)
Switch ON Resistance
0
≤
V
IN
≤
5.5 V
V
I/O
= 0 to 5.5 V
I
O
= 0, V
IN
=
V
CC
or 0 V
One input at 3.4
V; Other inputs
at V
CC
or GND
V
I/O
= 0,
I
I/O
= 64 mA
I
I/O
= 30 mA
V
I/O
= 2.4,
I
I/O
= 15 mA
V
I/O
= 2.4,
I
I/O
= 15 mA
Conditions
I
IN
= −18 mA
V
CC
(V)
4.5
4.0 to 5.5
4.0 to 5.5
5.5
0
5.5
5.5
2.0
0.8
±0.1
±0.1
±0.1
Min
Typ
Max
−1.2
2.0
0.8
±1.0
±1.0
±1.0
2.5
T
A
= −555C to +1255C
Min
Max
−1.2
Unit
V
V
V
mA
mA
mA
mA
R
ON
4.5
3
3
4.5
6
4.0
10
20
20
15
15
7
7
7
7
W
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Table 4. AC ELECTRICAL CHARACTERISTICS
T
A
= 255C
Symbol
t
PD
Parameter
Propagation Delay,
A to B or B to A
Output Enable Time
V
CC
(V)
4.0 to 5.5
Test Condition
See Figure 4
Min
Typ
Max
0.25
T
A
= −555C
to +1255C
Min
Max
0.25
Unit
ns
t
EN
4.5 to 5.5
4.0
0.8
0.8
0.8
0.8
V
IN
= 3 V or 0
Switch ON
Switch OFF
2.5
3.0
3.1
2.9
2.0
10
3.5
4.2
4.6
4.8
4.4
0.8
0.8
0.8
0.8
4.2
4.6
4.8
4.4
ns
t
DIS
Output Disable Time
4.5 to 5.5
4.0
ns
C
IN
C
IO(ON)
C
IO(OFF)
Control Input Capacitance
Switch On Capacitance
Switch Off Capacitance
5.0
5.0
5.0
pF
pF
pF
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3
7SB3257
AC Loading and Waveforms
7V
From Output
Under Test
C
L
= 50 pF
(see Note A)
500
W
S1
Open
GND
500
W
TEST
t
PD
t
PLZ
/t
PZL
t
PHZ
/t
PZH
S1
Open
7V
GND
LOAD CIRCUIT
Output
Control
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
t
PZL
3V
1.5 V
1.5 V
0V
t
PLZ
3.5 V
1.5 V
t
PZH
1.5 V
V
OL
+ 0.3 V
t
PHZ
V
OH
− 0.3 V
V
OH
0V
V
OL
3V
Input
t
PHL
1.5 V
1.5 V
1.5 V
0V
t
PLH
V
OH
Output
1.5 V
V
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
A. C
L
includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR
≤
10 MHz, Z
O
= 50
W,
t
r
≤
2.5 ns, t
f
≤
2.5 ns.
D. The output is measured with one input transition per measurement.
E. t
PLZ
and t
PHZ
are the same as t
dis
.
F. t
PZL
and t
PZH
are the same as t
en
.
G. t
PLH
and t
PHL
are the same as t
pd
.
Figure 4. Load Circuit and Voltage Waveforms
DEVICE ORDERING INFORMATION
Device
7SB3257DTT1G
NLV7SB3257DTT1G*
7SB3257DTT2G
7SB3257DFT2G
7SB3257AMX1TCG
7SB3257BMX1TCG
7SB3257CMX1TCG
7SB3257MU1TCG
7SB3257MUTCG
7SB3257MU3TCG
SC−88
(Pb−Free)
ULLGA6 − 1.45 x 1.0, 0.5P
(Pb−Free)
ULLGA6 − 1.2 x 1.0, 0.4P
(Pb−Free)
ULLGA6 − 1.0 x 1.0, 0.35P
(Pb−Free)
UDFN6 − 1.45 x 1.0, 0.5P
(Pb−Free)
UDFN6 − 1.2 x 1.0, 0.4P
(Pb−Free)
UDFN6 − 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
TSOP−6
(Pb−Free)
3000 / Tape & Reel
Package
Shipping
†
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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4
7SB3257
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE U
D
H
6
5
4
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
DIM
A
A1
b
c
D
E
E1
e
L
L2
M
MIN
0.90
0.01
0.25
0.10
2.90
2.50
1.30
0.85
0.20
0°
MILLIMETERS
NOM
MAX
1.00
1.10
0.06
0.10
0.38
0.50
0.18
0.26
3.00
3.10
2.75
3.00
1.50
1.70
0.95
1.05
0.40
0.60
0.25 BSC
10°
−
L2
E
GAUGE
PLANE
NOTE 5
0.05
A1
ÉÉÉ
ÉÉÉ
1
2
E1
3
L
b
M
DETAIL Z
C
SEATING
PLANE
e
A
c
DETAIL Z
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
3.20
6X
0.95
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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Talking
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