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XQBAWT-02-0000-00000B0F6

Description
High Power LEDs - White White, 30.6lm
CategoryLED optoelectronic/LED   
File Size999KB,11 Pages
ManufacturerCree
Websitehttp://www.cree.com/
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High Power LEDs - White White, 30.6lm

XQBAWT-02-0000-00000B0F6 Parametric

Parameter NameAttribute value
Product CategoryHigh Power LEDs - White
ManufacturerCree
RoHSDetails
Package / CaseSMD-2
Illumination ColorWhite (Neutral White)
Wavelength/Color Temperature3750 K
Luminous Intensity-
Luminous Flux/Radiant Flux30.6 lm
Color Rendering Index - CRI70
Viewing Angle140 deg
Lens Color/StyleDiffused
If - Forward Current80 mA
Vf - Forward Voltage3 V
Power Rating1.03 W
Mounting StyleSMD/SMT
Length1.6 mm
Width1.6 mm
Height1.44 mm
Maximum Operating Temperature-
Minimum Operating Temperature-
PackagingReel
PackagingMouseReel
PackagingCut Tape
Color Temperature3750 K
Features-
LED Size1.6 mm x 1.6 mm x 1.44 mm
Lens Dimensions1.41 mm x 1.41 mm
Lens ShapeSquare
Factory Pack Quantity250
TypeCree XLamp XQ-B LEDs
Vr - Reverse Voltage5 V
Unit Weight0.001764 oz
CLD-DS57 Rev 3I
Product family data sheet
Cree
®
XLamp
®
XQ-B LED
PRODUCT DESCRIPTION
Cree XLamp
®
XQ-B LeDs revolutionize
mid-power LeDs by delivering lighting-
class reliability and a wider spread of
light than typical plastic packages. The
XQ-B’s innovative wide light emission
enables a smooth look in replacement
tubes and panel lights while reducing
system cost by using fewer LeDs.
Using Cree’s newest generation of
silicon carbide-based LeD chips, XQ-B is
optimized to dramatically lower system
cost in non-directional and outdoor area
lighting applications.
FEATURES
Cree’s smallest lighting class LeD:
1.6 X 1.6 X 1.6 mm
Available in white, 80-minimum CRI
white and 70-minimum CRI cool
white
• 300 mA maximum drive current
• Low thermal resistance: 17 °C/W
• Wide viewing angle: 140°
• Reflow solderable - JEDEC
J-STD-020C compatible
• Unlimited floor life at ≤ 30 °C/85% RH
• RoHS and REACh compliant
UL
®
recognized component
(E349212)
TABLE OF CONTENTS
Characteristics .......................................
2
Flux Characteristics
...............................
2
Relative Spectral Power Distribution .... 3
Relative Flux vs. Junction
Temperature ........................................... 3
electrical Characteristics .......................
4
Relative Flux vs. Current
........................
4
Typical Spatial Distribution.................... 5
Thermal Design ...................................... 5
Reflow Soldering Characteristics
.......... 6
Notes ...................................................... 7
Mechanical Dimensions ........................
9
Tape and Reel ....................................... 10
Packaging ............................................. 11
www.CRee.Com/XLAmp
Copyright © 2014-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
and XLamp
®
are
registered trademarks and the Cree logo is a trademark of Cree, Inc. UL
®
and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300

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