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XBDAWT-02-0000-00000BF50

Description
High Power LEDs - White White 6200K 122lm, 350mA
CategoryLED optoelectronic/LED   
File Size1MB,19 Pages
ManufacturerCree
Websitehttp://www.cree.com/
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High Power LEDs - White White 6200K 122lm, 350mA

XBDAWT-02-0000-00000BF50 Parametric

Parameter NameAttribute value
Product CategoryHigh Power LEDs - White
ManufacturerCree
RoHSDetails
Package / CaseSMD-2
Illumination ColorWhite (Cool White)
Wavelength/Color Temperature6200 K
Luminous Intensity-
Luminous Flux/Radiant Flux122 lm
Color Rendering Index - CRI70
Viewing Angle115 deg
Lens Color/StyleWater Clear
If - Forward Current350 mA
Vf - Forward Voltage2.9 V
Power Rating3 W
Mounting StyleSMD/SMT
Length2.45 mm
Width2.45 mm
Height1.84 mm
Maximum Operating Temperature-
Minimum Operating Temperature-
PackagingReel
PackagingMouseReel
PackagingCut Tape
Color Temperature6200 K
Features-
LED Size2.45 mm x 2.45 mm x 1.84 mm
Lens Dimensions2.17 mm
Lens ShapeDome
Factory Pack Quantity250
TypeXLamp XB-D LEDs
Vr - Reverse Voltage5 V
CLD-DS45 Rev 10H
Product family data sheet
Cree
®
XLamp
®
XB-D LEDs
PRODUCT DESCRIPTION
The
XLamp
®
XB-D
LeD
brings
next-generation performance, price and
size to all LeD lighting applications. The
XB-D’s footprint enables smaller designs
with densely packed arrays for better
light mixing and concentration.
FEATURES
Cree’s smallest lighting class LeD:
2.45 X 2.45 mm
XB-D white binned @ 85 °C; XB-D
color binned @ 25 °C
Up to 136 lm/W in cool white
(@ 85 °C, 350 mA)
Available in white, 80-minimum CRI
white, and 70-minimum CRI cool
white, royal blue, blue, green, amber,
red-orange & red
1 A maximum drive current
Wide viewing angle: from 115°
(white) to 140° (red)
Reflow solderable - JEDEC
J-STD-020C compatible
Unlimited floor life at
≤ 30 °C/85% RH
electrically neutral thermal path
RoHS and REACh compliant
UL
®
recognized component
(E349212)
TABLE OF CONTENTS
Characteristics ....................................... 2
Flux Characteristics ............................... 3
Relative Spectral Power Distribution
.... 6
Relative Flux vs. Junction
Temperature ........................................... 7
electrical Characteristics ....................... 8
Relative Flux vs. Current
........................ 9
Relative Chromaticity vs. Current
........ 10
Relative Chromaticity vs.
Temperature ......................................... 11
Typical Spatial Distribution.................. 11
Thermal Design .................................... 12
Reflow Soldering Characteristics
........ 13
Notes .................................................... 14
Mechanical Dimensions ...................... 16
Tape and Reel ....................................... 18
Packaging
............................................. 19
The XB-D shares common footprint and
uniform package design across all white
and color configurations, simplifying
board and optical designs for many
LeD systems. The XB-D is optimized to
dramatically lower system cost in any
illumination application, from indoor
and outdoor lighting to architectural and
transportation lighting.
www.CRee.Com/XLAmp
Copyright © 2011-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
and XLamp
®
are
registered trademarks and the Cree logo is a trademark of Cree, Inc UL
®
and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300

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