32M X 16 FLASH 3V PROM, 35 ns, PDSO48
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | STMicroelectronics |
| Parts packaging code | BGA |
| package instruction | TFBGA, BGA55,8X12,32 |
| Contacts | 55 |
| Reach Compliance Code | _compli |
| ECCN code | 3A991.B.1.A |
| Maximum access time | 35 ns |
| command user interface | YES |
| Data polling | NO |
| JESD-30 code | R-PBGA-B55 |
| JESD-609 code | e0 |
| length | 10 mm |
| memory density | 134217728 bi |
| Memory IC Type | FLASH |
| memory width | 16 |
| Number of functions | 1 |
| Number of departments/size | 1K |
| Number of terminals | 55 |
| word count | 8388608 words |
| character code | 8000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 8MX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TFBGA |
| Encapsulate equivalent code | BGA55,8X12,32 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
| page size | 256 words |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 1.8 V |
| Programming voltage | 1.8 V |
| Certification status | Not Qualified |
| ready/busy | YES |
| Maximum seat height | 1.05 mm |
| Department size | 8K |
| Maximum standby current | 0.00005 A |
| Maximum slew rate | 0.015 mA |
| Maximum supply voltage (Vsup) | 1.95 V |
| Minimum supply voltage (Vsup) | 1.7 V |
| Nominal supply voltage (Vsup) | 1.8 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| switch bit | NO |
| type | SLC NAND TYPE |
| width | 8 mm |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD