42R33-1222-200 datasheet, PDF - EEWORLD Datasheet

42R33-1222-200: DescriptionMains Power Connector, 10A, 250VAC, Male, Solder Terminal; CategoryThe connector The connector; File Size152KB，1 Pages; ManufacturerPower Dynamics, Inc.; Websitehttp://www.powerdynamics.com/

Download Datasheet Parametric View All

42R33-1222-200 Overview

Mains Power Connector, 10A, 250VAC, Male, Solder Terminal

Parameter Name	Attribute value
Reach Compliance Code	compliant
Other features	STANDARDS: CSA, UL 94V-0, VDE
Connector type	MAINS POWER CONNECTOR
Contact to complete cooperation	TIN
Contact completed and terminated	TIN
Contact point gender	MALE
Coupling type	SNAP
JESD-609 code	e3
Power Connector Ratings	10A, 250VAC
Installation type	PANEL
Shell material	POLYCARBONATE
Termination type	SOLDER
Total number of contacts	3
Base Number Matches	1

[Mil MYC-J1028X development board trial] Unboxing post: Because I have used the Mir MYD-YT507 and felt it was very good, I also applied for the Mir MYC-J1028X development board this time. After the application was approved, the delivery was very fast and I...; HonestQiao NXP MCU

Design of high voltage motor protection system based on DSP: High-voltage motors refer to motors with a rated voltage of more than 1000V. Motor protection equipment is the main guarantee for the reliable operation of motors. It can not only enable the motor to ...; fish001 DSP and ARM Processors

[Free trial of Pingtouge Bluetooth Mesh Gateway Development Kit] + nRF Mesh and light and switch experiment (Part 3): [i=s]This post was last edited by damiaa on 2021-11-1 10:43[/i][Free trial of Pingtouge Bluetooth Mesh Gateway Development Kit] + nRF Mesh and light and switch experiment (Part 3) [Free trial of Pingt...; damiaa RF/Wirelessly

【BLE 5.3 wireless MCU CH582】8. ADC sampling (internal bat, internal temperature, external input): Series of articles: 【BLE 5.3 wireless MCU CH582】1. Getting to know the CH582 development board (unboxing) 【BLE 5.3 wireless MCU CH582】2. MounRiver IDE first experience 【BLE 5.3 wireless MCU CH582】3. N...; freeelectron Domestic Chip Exchange

Integrated power devices simplify FPGA and SoC design: [align=left][color=rgb(85, 85, 85)][font="][size=4] The development trend of industrial electronic products is smaller circuit board size, more fashionable appearance and more cost-effective Due to th...; Jacktang DSP and ARM Processors

PCB SMD component package pad design size standard: [size=4] When drawing component packages on PCB, we often encounter the problem of not being able to grasp the size of the pads, because the information we consult gives the size of the components the...; qwqwqw2088 PCB Design

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components