No. STSE-CC4019A
<Cat.No.040409>
SPECIFICATIONS FOR NICHIA CHIP TYPE
WHITE
LED
MODEL :
NFSW036T
NICHIA CORPORATION
-0-
Nichia STSE-CC4019A
<Cat.No.040409>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Reverse Voltage
Power Dissipation
Operating Temperature
Storage Temperature
Soldering Temperature
Symbol
I
F
I
FP
V
R
P
D
T
opr
T
stg
T
sld
Absolute Maximum Rating
180
350
5
810
-30 ~ + 85
-40 ~ +100
Reflow Soldering : 260°C
Hand Soldering : 350°C
(Tc=25°C)
Unit
mA
mA
V
mW
°C
°C
for 10sec.
for 3sec.
I
FP
Conditions : Pulse Width
<
10msec. and Duty
<
1/10
=
=
(2) Initial Electrical/Optical Characteristics
Item
Symbol Condition
Forward Voltage
V
F
I
F
=150[mA]
Reverse Current
I
R
V
R
= 5[V]
Rank T
Iv
I
F
=150[mA]
Luminous Intensity
Rank S
Iv
I
F
=150[mA]
!
Luminous Intensity Measurement allowance is ± 10%.
Min.
-
-
6.5
4.5
Typ.
4.0
-
-
-
(Tc=25°C)
Max.
Unit
4.5
V
50
µA
9.0
cd
6.5
cd
Color Ranks
x
y
x
y
0.280
0.248
0.296
0.276
Rank a0
0.264
0.283
0.267
0.305
Rank b2
0.287
0.330
0.295
0.339
0.296
0.276
0.330
0.318
x
y
x
y
0.287
0.295
0.330
0.318
(I
F
=150mA,Tc=25°C)
Rank b1
0.283
0.330
0.330
0.305
0.360
0.339
Rank c0
0.330
0.361
0.360
0.385
0.356
0.351
!
Color Coordinates Measurement allowance is ± 0.01.
!
One delivery will include up to two consecutive color ranks and two luminous intensity ranks of the products.
The quantity-ratio of the ranks is decided by Nichia.
2.TYPICAL INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to figure’s page.
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to figure’s page.
Material as follows ; Package
Encapsulating Resin
Electrodes
:
:
:
Ceramics
Silicone Resin (with YAG Phosphor)
Ag Plating
-1-
Nichia STSE-CC4019A
<Cat.No.040409>
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to figure’s page.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT NUMBER
The first six digits number shows
lot number.
The lot number is composed of the following characters;
"#$$$$
-
!%
"
- Year
( 3 for 2003, 4 for 2004 )
#
- Month ( 1 for Jan., 9 for Sep., A for Oct.,
$$$$
- Nichia's Product Number
!
- Ranking by Color Coordinates
%
- Ranking by Luminous Intensity
B for Nov. )
-2-
Nichia STSE-CC4019A
<Cat.No.040409>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Thermal Shock
Temperature Cycle
High Temperature Storage
Temperature Humidity
Storage
Low Temperature Storage
Steady State Operating Life
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Vibration
Standard
Test Method
JEITA ED-4701
300 301
JEITA ED-4701
300 303
JEITA ED-4701
300 307
JEITA ED-4701
100 105
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Tsld=215 ± 5°C, 3sec.
(Lead Solder)
0°C ~ 100°C
15sec. 15sec.
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
Ta=100°C
Ta=60°C, RH=90%
Ta=-40°C
Ta=25°C, I
F
=150mA
Tested with Nichia standard circuit board.
!
Note
2 times
Number of
Damaged
0/50
1 time
over 95%
20 cycles
100 cycles
500 hrs.
500 hrs.
500 hrs.
500 hrs.
500 hrs.
300 hrs.
500 hrs.
48min.
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
Ta=70°C, I
F
=100mA
Tested with Nichia standard circuit board.
!
60°C, RH=90%, I
F
=150mA
Tested with Nichia standard circuit board.
!
Ta=-40°C, I
F
=150mA
Tested with Nichia standard circuit board.
!
JEITA ED-4701
400 403
JEITA ED-4702
JEITA ED-4702
Substrate Bending
Stick
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s
2
3direction, 4cycles
3mm, 5 ± 1 sec.
5N,
10 ± 1 sec.
1 time
1 time
0/50
0/50
!
Thermal resistance of LED with Nichia standard circuit board : Rtθj-a
≒
110°C/W
(2) CRITERIA FOR JUDGING THE DAMAGE
Item
Symbol Test Conditions
Forward Voltage
V
F
I
F
=150mA
-
Initial Level
"
1.1
Reverse Current
I
R
V
R
=5V
-
Initial Level
"
2.0
Luminous Intensity
I
V
I
F
=150mA
Initial Level
"
0.7
-
!
The test is done after the board is cooled down enough at the room temperature.
Criteria for Judgement
Min.
Max.
-3-
Nichia STSE-CC4019A-1
<Cat.No.040517>
7.CAUTIONS
The
LEDs are devices which are materialized by combining Blue LEDs and special phosphors.
Consequently, the color of the LEDs is changed a little by an operating current.
Care should be taken after due consideration when using LEDs.
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage the optical
characteristics of the LEDs.
For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag with a zipper. A package of
a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within
a year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered
within 168 hours (7days) after opening the package.
If unused LEDs remain, they should be
stored in the moisture proof packages, such as sealed containers with packages of moisture
absorbent material (silica gel).
It is also recommended to return the LEDs to the original
moisture proof bag and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following condition.
Baking treatment : more than 24 hours at 65 ± 5°C
· Nichia LED electrode and leadframe are comprised of a silver plated. The silver surface
may be affected by environments which contain corrosive gases and so on. Please avoid conditions
which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration might lower
solderability or might affect on optical characteristics.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
(3) Heat Generation
· Consider the heat generation of LED when designing the circuit.
The thermal resistance* Rtθj-a (LED junction to ambient) is approximately 110°C/W when LED is
mounted on the circuit board with standard heat release approximately Rtθc-a (LED package to
ambient) 45°C/W. It is necessary to avoid intense heat generation.
Do not exceed the maximum ratings of operating temperature.
· The operating current shall be decided under the condition of ambient maximum temperature of LEDs
and designing the heat release.
* The thermal resistance : The temperature rise of LED element when LED is turned on.
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