68653-110HLF datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The connector> 68653-110HLF

68653-110HLF: DescriptionBoard to Board u0026 Mezzanine Connectors DUBOX .335u0027 VERTICAL; CategoryThe connector; File Size96KB，8 Pages; ManufacturerFCI [First Components International]

Download Datasheet Parametric View All

68653-110HLF Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	68653-110HLF	-	-	View	Buy Now

68653-110HLF Overview

Board to Board u0026 Mezzanine Connectors DUBOX .335u0027 VERTICAL

68653-110HLF Parametric

Parameter Name	Attribute value
Product Category	Headers & Wire Housings
Manufacturer	FCI [First Components International]
RoHS	Details
Product	Headers
Type	Unshrouded
Number of Positions	10 Position
Pitch	2.54 mm
Number of Rows	1 Row
Mounting Style	-
Termination Style	Through Hole
Mounting Angle	Vertical
Contact Gender	Pin (Male)
Contact Plating	Gold
Contact Material	Phosphor Bronze
Current Rating	3 A
Flammability Rating	UL 94 V-0
Housing Gender	-
Housing Material	Thermoplastic
Insulation Resistance	5000 MOhms
Mating Post Length	13.72 mm
Factory Pack Quantity	1000
Termination Post Length	2.41 mm
Voltage Rating	1.5 kV

Preview

Download Datasheet

View All

NUMBER

TYPE

BUS-12-050

PRODUCT SPECIFICATION

TITLE

PAGE

REVISION

1 of 8

BERGSTIK® /BERGSTIK™ Headers

AUTHORIZED BY

DATE

07 JUL 16

M.Zhou

CLASSIFICATION

UNRESTRICTED

1.0

GENERAL

1.1

SCOPE

This specification covers the Bergstik® and Bergstrip™ Headers, designed for use in low-power

applications requiring a printed wiring -board mounted straight or right angle disconnect. The header

provides only the pin half of the interconnection, using any 0.025” square pin mateable receptacle to

complete the connection. This product is Lead Free and meets the requirement of the European

Union Directive of Restrictions for Hazardous Substances (Directive 2002/95/EC). The specification

is composed of the following sections:

Paragraph

1.0

1.1

1.2

2.0

3.0

3.1

3.2

3.3

3.4

3.5

3.6

3.7

4.0

4.1

4.2

4.3

4.4

Title

GENERAL

Scope

Type

APPLICABLE DOCUMENTS

REQUIREMENTS

Qualification

Material

Finish

Design and construction

Electrical Characteristics

Mechanical characteristics

Environmental Conditions

QUALITY ASSURANCE PROVISIONS

Equipment Calibration

Inspection Conditions

Qualification Inspection

Acceptance Inspection

1.2

Working parameter

current rating: 5A

voltage : 110V

operating temperature: -65 o to 105o C - Nylon

-65o to 130o C - PCT,PPS & LCP

This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the

document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI.

Form E-3005

Rev F

PDS: Rev :L

GS-01-001

STATUS:Released

Printed: Jul 21, 2016

NUMBER

TYPE

BUS-12-050

PRODUCT SPECIFICATION

TITLE

PAGE

REVISION

3 of 8

BERGSTIK® /BERGSTIK™ Headers

AUTHORIZED BY

DATE

07 JUL 16

M.Zhou

CLASSIFICATION

UNRESTRICTED

The material for each part shall be specified herein, or equivalent. Substitute material shall meet or

exceed the performance requirements of this specification.

3.2.1

Contact. The contact shall be Phosphor Bronze Alloy UNS C51000 in accordance with

ASTM B-159 or other copper alloy as specified on the product drawing.

3.2.2

Insulator. The insulator shall be glass- or mineral-filled nylon in accordance with ASTM

D-2897, polyphenylene sulfide (PPS) ,PCT or LCP. All plastic material shall be

rated V-0 in accordance with UL-94.

3.3

Finish

The finish of the contact shall be specified herein for the particular type of header under

consideration.

3.3.1

Solder tails. As defined by product drawings, will be plated with the specified thickness of

pure tin for Lead Free. Or 93/7 tin-lead per MIL-P-81728 option. Or gold per MIL-G-45204

Type II, Grade C option. Or palladium alloy per MIL-P-45209 option.

Tin plated “LF” product has 100% tin plating in the interface and has not been tested for

whisker growth in all interconnect environments

Contact Area. As defined by product drawings, will be plated with the specified thickness

of pure tin for Lead Free. Or 93/7 tin-lead per MIL-P-81728 option. Or gold per MIL-G-

45204 Type II, Grade C option. Or palladium alloy per MIL-P-45209 option.

Tin plated “LF” product has 100% tin plating in the interface and has not been tested for

whisker growth in all interconnect environments

All other areas. Will be plated with 50 microinches of nickel per QQ-N-290, Class 2.

3.3.2

3.3.3

3.4

Design and Construction

The header shall be a multi-piece assembly having one or two rows of contacts with solderable tail

ends for installation in .040 inch diameter holes in printed wiring boards of standard thickness. The

Bergstik® header contacts shall be insert molded or post-inserted in the insulator on rectangular

grids of .100, .125, or .150 inches or multiples thereof and shall be available in straight or right angle

configurations. The Bergstrip™ header contacts shall be post-inserted into the insulator on

rectangular grids of .100 inch and shall be available in straight configurations. The contacts shall be

available in various above- and below-board lengths suitable for use as 0.025 inch square male

disconnects or as similarly configured wrapposts for solderless wrapped connections in accordance

with MIL-STD-1130.

This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the

document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI.

Form E-3005

Rev F

PDS: Rev :L

GS-01-001

STATUS:Released

Printed: Jul 21, 2016

NUMBER

TYPE

BUS-12-050

PRODUCT SPECIFICATION

TITLE

PAGE

REVISION

5 of 8

BERGSTIK® /BERGSTIK™ Headers

AUTHORIZED BY

DATE

07 JUL 16

M.Zhou

CLASSIFICATION

UNRESTRICTED

3.6

Mechanical Characteristics

3.6.1

Contact Retention. Individual contacts in an unsoldered header shall withstand a load

applied in either direction, along the contact axis, without dislodgement from the insulator,

of 5.0 pounds in the case of insert molded contacts and 2.0 pounds in the case of post

inserted contacts.

3.7

Environmental Conditions

3.7.1

Thermal Shock. After exposure of an unmated and unsoldered header to alternate

periods of extreme high and low temperature, there shall be no evidence of cracking or

crazing of the insulator（not include open knit line） or other physical damage to the

header. The dielectric withstanding voltage shall be not less than 750 volts RMS 60 HZ

(see Paragraph 3.5.2). The following details shall apply:

a. Test Conditions - B (1 hour cycles).

b. Temperature Range - -65o to 105o C - Nylon

-65o to 130o C - PCT,PPS & LCP

3.7.2

High Temperature Life. After exposure of an unmated and unsoldered header to a high

temperature operating environment, the insulation resistance of the header shall be not

less than 5,000 megohms (see Paragraph 3.5.1). The test shall be in accordance with

MIL-STD-202, Method 108. The following details shall apply:

a. Test Chamber Temperature -105o C ( + 2o)-Nylon;130oC( + 2o) PCT,PPS & LCP

b. Test Condition (Duration) B (250 hours).

c. Operating Conditions - No Current

3.8

Solderability

Plated pins shall be capable of passing BUS-19-002.

3.9

Re-Qualification product

If either of the following conditions occurs, the responsible product engineer shall initiate re-

qualification testing, consisting of all applicable parts of the qualification test matrix, table II

a. A significant design change is made to the existing product. A significant change shall

include, but is not limited to, changes in the contact material composition, contact material

thickness, contact force, contact surface geometry, underlying material composition,

underlying material thickness, insulation design, contact base material or contact lubrication

requirements.

b. A significant change is made to the manufacturing process which impacts the product form,

fit or function.

A significant event occurs during the production or end use requiring corrective action to be

taken relative to the product design or manufacturing process.

This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the

document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI.

Form E-3005

Rev F

PDS: Rev :L

GS-01-001

STATUS:Released

Printed: Jul 21, 2016

Recommended Resources

The first USB-C™ Combo buck-boost battery charger, did you know it?

Circuit diagram of an automatic water level controller

Bilateral current source circuit

IBM PC and MCS-51 multi-machine communication

Fishing alarm circuit diagram that can control multiple fishing rods

Precision Square Wave Clock Oscillator

Vehicle GPS Antenna Installation Location: Several locations for installing vehicle-mounted GPS antennas, for your reference screen.width-550)this.style.width=screen.width-550;" border=0The pictures related to this theme are as follows: screen...; aabbcc Automotive Electronics

MSP430F5529 generates PWM waves with CCS: It is probably to generate a PWM wave of a certain frequency through the clock Using FPGA can get a more perfect waveform, but if only a CLK wave is provided, F5529LP can do it completely. #include ms...; fish001 Microcontroller MCU

FPGA Multiplier: I want to learn about the multiplier part, but I can't find the multiplier part in the routine of the development board. I have opened every routine and still can't find the multiplier. Is there any r...; 1nnocent EE_FPGA Learning Park

Quartus2 simulation can not produce waveform: I use quaratus2 to do waveform simulation. There is no problem with compilation and code, but the waveform cannot be simulated. It prompts the error code: Error: (vsim_3170) Could not find 'work.PPQ_v...; Mr.Sensitive EE_FPGA Learning Park

After the microcontroller is connected to the computer via a USB cable, the problem of "unrecognized USB device" appears: After the microcontroller is connected to the computer via a USB cable, the problem of "unrecognizable USB device" appears. I wanted to imitate Atom's one-click download circuit and make a minimum sys...; 反倒是fdsf stm32/stm8

2. GD32L233C-START environment construction: Let me post a photo first. The board has been soldered with pin headers and sockets. In order to adapt to the Arduino Uno expansion board in my hand, I chose to solder the female socket. By the way, I...; sonicfirr GD32 MCU

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components