|
EDD1216AASE-7A-E |
EDD1216AASE-6B-E |
EDD1216AASE |
Description |
128M bits DDR SDRAM (8M words x 16 bits) |
128M bits DDR SDRAM (8M words x 16 bits) |
128M bits DDR SDRAM (8M words x 16 bits) |
Is it Rohs certified? |
conform to |
conform to |
- |
Maker |
ELPIDA |
ELPIDA |
- |
Parts packaging code |
BGA |
BGA |
- |
package instruction |
TBGA, |
TBGA, |
- |
Contacts |
60 |
60 |
- |
Reach Compliance Code |
unknow |
unknow |
- |
ECCN code |
EAR99 |
EAR99 |
- |
access mode |
FOUR BANK PAGE BURST |
FOUR BANK PAGE BURST |
- |
Maximum access time |
0.75 ns |
0.7 ns |
- |
Other features |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
- |
JESD-30 code |
R-PBGA-B60 |
R-PBGA-B60 |
- |
length |
13 mm |
13 mm |
- |
memory density |
134217728 bi |
134217728 bi |
- |
Memory IC Type |
DDR DRAM |
DDR DRAM |
- |
memory width |
16 |
16 |
- |
Number of functions |
1 |
1 |
- |
Number of ports |
1 |
1 |
- |
Number of terminals |
60 |
60 |
- |
word count |
8388608 words |
8388608 words |
- |
character code |
8000000 |
8000000 |
- |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
- |
Maximum operating temperature |
70 °C |
70 °C |
- |
organize |
8MX16 |
8MX16 |
- |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
encapsulated code |
TBGA |
TBGA |
- |
Package shape |
RECTANGULAR |
RECTANGULAR |
- |
Package form |
GRID ARRAY |
GRID ARRAY |
- |
Peak Reflow Temperature (Celsius) |
260 |
260 |
- |
Certification status |
Not Qualified |
Not Qualified |
- |
Maximum seat height |
1.14 mm |
1.14 mm |
- |
self refresh |
YES |
YES |
- |
Maximum supply voltage (Vsup) |
2.7 V |
2.7 V |
- |
Minimum supply voltage (Vsup) |
2.3 V |
2.3 V |
- |
Nominal supply voltage (Vsup) |
2.5 V |
2.5 V |
- |
surface mount |
YES |
YES |
- |
technology |
CMOS |
CMOS |
- |
Temperature level |
COMMERCIAL |
COMMERCIAL |
- |
Terminal form |
BALL |
BALL |
- |
Terminal pitch |
1 mm |
1 mm |
- |
Terminal location |
BOTTOM |
BOTTOM |
- |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
- |
width |
8 mm |
8 mm |
- |