SUP/SUB75N05-07
New Product
Vishay Siliconix
N-Channel 55-V (D-S), 175_C MOSFET
PRODUCT SUMMARY
V
(BR)DSS
(V)
55
r
DS(on)
(W)
0.007 @ V
GS
= 10 V
0.009 @ V
GS
= 4.5 V
I
D
(A)
"75
a
TO-220AB
D
TO-263
G
DRAIN connected to TAB
G
G D S
Top View
SUP75N05-07
D S
S
N-Channel MOSFET
Top View
SUB75N05-07
ABSOLUTE MAXIMUM RATINGS (T
C
= 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
J
= 175_C)
175 C)
Pulsed Drain Current
Avalanche Current
Repetitive Avalanche Energy
b
Maximum Power Dissipation
L = 0.1 mH
T
C
= 25_C (TO-220AB and TO-263)
T
A
= 25_C (TO-263)
d
T
C
= 25_C
T
C
= 125_C
Symbol
V
DS
V
GS
I
D
I
DM
I
AR
E
AR
P
D
T
J
, T
stg
Limit
55
"20
"75
a
"60
"240
"60
180
158
c
3.7
–55 to 175
Unit
V
A
mJ
W
_C
Operating Junction and Storage Temperature Range
THERMAL RESISTANCE RATINGS
Parameter
PCB Mount (TO-263)
d
Junction-to-Ambient
Free Air (TO-220AB)
Junction-to-Case
Notes
a. Package limited.
b. Duty cycle
v
1%.
c. See SOA curve for voltage derating.
d. When mounted on 1” square PCB (FR-4 material).
Document Number: 70871
S-60952—Rev. A, 19-Apr-99
www.vishay.com
S
FaxBack 408-970-5600
R
thJA
R
thJC
Symbol
Limit
40
62.5
0.95
Unit
_C/W
2-1
SUP/SUB75N05-07
Vishay Siliconix
New Product
SPECIFICATIONS (T
J
=25_C UNLESS OTHERWISE NOTED)
Parameter
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
V
(BR)DSS
V
GS(th)
I
GSS
V
DS
= 0 V, I
D
= 250
mA
V
DS
= V
GS
, I
D
= 250
mA
V
DS
= 0 V, V
GS
=
"20
V
V
DS
= 44 V, V
GS
= 0 V
Zero Gate Voltage Drain Current
Z
G
V l
D i C
I
DSS
V
DS
= 44 V, V
GS
= 0 V, T
J
= 125_C
V
DS
= 44 V, V
GS
= 0 V, T
J
= 175_C
On-State Drain Current
a
I
D(on)
V
DS
w
5 V, V
GS
= 10 V
V
GS
= 10 V, I
D
= 30 A
D i S
O S
R i
Drain-Source On-State Resistance
a
r
DS(on)
V
GS
= 4.5 V, I
D
= 20 A
V
GS
= 10 V, I
D
= 30 A, T
J
= 125_C
V
GS
= 10 V, I
D
= 30 A, T
J
= 175_C
Forward Transconductance
a
g
fs
V
DS
= 15 V, I
D
= 30 A
40
120
0.0056
0.0072
0.007
0.009
0.011
0.015
S
W
55
V
1
3
"100
1
50
250
A
mA
A
nA
Symbol
Test Condition
Min
Typ
Max
Unit
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
c
Gate-Source Charge
c
Gate-Drain Charge
c
Turn-On Delay Time
c
Rise Time
c
Turn-Off Delay Time
c
Fall Time
c
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 30 V, R
L
= 0 47
W
V,
0.47
I
D
^
75 A, V
GEN
= 10 V R
G
= 2 5
W
A
V,
2.5
V
DS
= 30 V, V
GS
= 10 V I
D
= 75 A
V
V,
V
GS
= 0 V, V
DS
= 25 V, f = 1 MHz
6830
720
350
135
25
34
13
11
90
25
20
20
ns
160
40
170
nC
C
pF
F
Source-drain Diode Ratings and Characteristics (T
c
= 25_C)
b
Continuous Current
Pulsed Current
Forward Voltage
a
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
I
S
I
SM
V
SD
t
rr
I
RM(REC)
Q
rr
I
F
= 75 A di/dt = 100 A/ms
A,
I
F
= 75 A, V
GS
= 0 V
1.0
45
2
0.09
75
A
240
1.3
80
5
0.4
V
ns
A
mC
Notes
a. Pulse test; pulse width
v
300
ms,
duty cycle
v
2%.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
www.vishay.com
S
FaxBack 408-970-5600
2-2
Document Number: 70871
S-60952—Rev. A, 19-Apr-99
SUP/SUB75N05-07
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
250
V
GS
= 5 thru 10 V
200
I
D
– Drain Current (A)
I
D
– Drain Current (A)
160
200
Vishay Siliconix
Transfer Characteristics
150
120
100
4V
80
T
C
= 125_C
40
25_C
–55_C
0
50
2, 3 V
0
0
2
4
6
8
10
0
1
2
3
4
5
V
DS
– Drain-to-Source Voltage (V)
V
GS
– Gate-to-Source Voltage (V)
Transconductance
210
180
g
fs
– Transconductance (S)
150
125_C
120
90
60
30
0
0
20
40
60
80
100
0
0
T
C
= –55_C
r
DS(on)
– On-Resistance (
W
)
25_C
0.008
0.010
On-Resistance vs. Drain Current
V
GS
= 4.5 V
V
GS
= 10 V
0.006
0.004
0.002
20
40
60
80
100
V
GS
– Gate-to-Source Voltage (V)
I
D
– Drain Current (A)
Capacitance
10000
10
Gate Charge
8000
C – Capacitance (pF)
C
iss
V
GS
– Gate-to-Source Voltage (V)
8
V
GS
= 30 V
I
D
= 75 A
6000
6
4000
4
2000
C
rss
C
oss
2
0
0
10
20
30
40
50
0
0
20
40
60
80
100
120
140
V
DS
– Drain-to-Source Voltage (V)
Document Number: 70871
S-60952—Rev. A, 19-Apr-99
Q
g
– Total Gate Charge (nC)
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S
FaxBack 408-970-5600
2-3
SUP/SUB75N05-07
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Junction Temperature
2.5
V
GS
= 10 V
I
D
= 75 A
r
DS(on)
– On-Resistance (
W)
(Normalized)
2.0
I
S
– Source Current (A)
100
Source-Drain Diode Forward Voltage
T
J
= 150_C
1.5
T
J
= 25_C
10
1.0
0.5
0
–50
1
–25
0
25
50
75
100
125
150
175
0
0.3
0.6
0.9
1.2
T
J
– Junction Temperature (_C)
V
SD
– Source-to-Drain Voltage (V)
Avalanche Current vs. Time
300
80
Drain-Source Breakdown vs.
Junction Temperature
100
70
I
AV
(A) @ T
J
= 25_C
I
Dav
(a)
V
(BR)DSS
(V)
60
10
I
AV
(A) @ T
J
= 150_C
50
1
0.0001
0.001
0.01
t
in
(Sec)
0.1
1
40
–50
–25
0
25
50
75
100
125
150
175
T
J
– Junction Temperature (_C)
www.vishay.com
S
FaxBack 408-970-5600
2-4
Document Number: 70871
S-60952—Rev. A, 19-Apr-99
SUP/SUB75N05-07
New Product
THERMAL RATINGS
Vishay Siliconix
Maximum Drain Current vs.
Case Temperature
80
300
Safe Operating Area
10
ms
Limited
by r
DS(on)
I
D
– Drain Current (A)
60
I
D
– Drain Current (A)
100
100
ms
40
1 ms
10
T
C
= 25_C
Single Pulse
10 ms
100 ms
dc
20
0
0
25
50
75
100
125
150
175
1
0.1
1
10
100
T
C
– Case Temperature (_C)
V
DS
– Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Case
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10
–5
10
–4
10
–3
10
–2
10
–1
1
3
Square Wave Pulse Duration (sec)
Document Number: 70871
S-60952—Rev. A, 19-Apr-99
www.vishay.com
S
FaxBack 408-970-5600
2-5
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