Flash Memory 2M(256Kx8) 3.3V- 100NS IND TEMP
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Atmel (Microchip) |
| Parts packaging code | TSOP1 |
| package instruction | TSOP1, TSSOP32,.8,20 |
| Contacts | 32 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 100 ns |
| startup block | BOTTOM/TOP |
| command user interface | NO |
| Data polling | YES |
| JESD-30 code | R-PDSO-G32 |
| JESD-609 code | e0 |
| length | 18.4 mm |
| memory density | 2097152 bit |
| Memory IC Type | FLASH |
| memory width | 8 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of departments/size | 1K |
| Number of terminals | 32 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 256KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSOP1 |
| Encapsulate equivalent code | TSSOP32,.8,20 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 3.3 V |
| Programming voltage | 3 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Department size | 256 |
| Maximum standby current | 0.00005 A |
| Maximum slew rate | 0.015 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| switch bit | YES |
| type | NOR TYPE |
| width | 8 mm |
| Maximum write cycle time (tWC) | 20 ms |
| AT29LV020-10TI | AT29LV020-12TI | AT29LV020-12TC | |
|---|---|---|---|
| Description | Flash Memory 2M(256Kx8) 3.3V- 100NS IND TEMP | Flash Memory 2M (256K X 8) 3.3V- 120NS COM TEMP | |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Parts packaging code | TSOP1 | TSOP1 | TSOP1 |
| package instruction | TSOP1, TSSOP32,.8,20 | 8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32 | 8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32 |
| Contacts | 32 | 32 | 32 |
| Reach Compliance Code | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 |
| Maximum access time | 100 ns | 120 ns | 120 ns |
| startup block | BOTTOM/TOP | BOTTOM/TOP | BOTTOM/TOP |
| command user interface | NO | NO | NO |
| Data polling | YES | YES | YES |
| JESD-30 code | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
| JESD-609 code | e0 | e0 | e0 |
| length | 18.4 mm | 18.4 mm | 18.4 mm |
| memory density | 2097152 bit | 2097152 bit | 2097152 bit |
| Memory IC Type | FLASH | FLASH | FLASH |
| memory width | 8 | 8 | 8 |
| Humidity sensitivity level | 3 | 3 | 3 |
| Number of functions | 1 | 1 | 1 |
| Number of departments/size | 1K | 1K | 1K |
| Number of terminals | 32 | 32 | 32 |
| word count | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 70 °C |
| Minimum operating temperature | -40 °C | -40 °C | - |
| organize | 256KX8 | 256KX8 | 256KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSOP1 | TSOP1 | TSOP1 |
| Encapsulate equivalent code | TSSOP32,.8,20 | TSSOP32,.8,20 | TSSOP32,.8,20 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 | 240 | 240 |
| power supply | 3.3 V | 3.3 V | 3.3 V |
| Programming voltage | 3 V | 3 V | 3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.2 mm | 1.2 mm | 1.2 mm |
| Department size | 256 | 256 | 256 |
| Maximum standby current | 0.00005 A | 0.00005 A | 0.00004 A |
| Maximum slew rate | 0.015 mA | 0.015 mA | 0.015 mA |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.5 mm | 0.5 mm | 0.5 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | 30 | 30 |
| switch bit | YES | YES | YES |
| type | NOR TYPE | NOR TYPE | NOR TYPE |
| width | 8 mm | 8 mm | 8 mm |
| Maximum write cycle time (tWC) | 20 ms | 20 ms | 20 ms |
| Base Number Matches | - | 1 | 1 |
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