OM
PL
IA
N
Features
n
Shielded construction
n
Unit height of 4.5 mm
n
Inductance range: 0.36 to 3.2 μH
n
Current up to 23 A
n
RoHS compliant*
F
RE
E
Applications
n
Input/output of DC/DC converters
n
Power supplies for:
*R
oH
S
C
T
• Portable communications equipment
• Camcorders
• LCD TVs
• Car audio systems
LE
AD
Electrical Specifications
Bourns Part No.
SRP1045-R36Y
SRP1045-R80M
SRP1045-1R4M
SRP1045-2R2M
SRP1045-3R2M
SRP1045 Series - Shielded Power Inductors
General Specifications
Test Voltage .......................................1 V
Test Frequency ......................... 100 KHz
Reflow Soldering .. 230 °C; 50 sec. max.
Operating Temperature
................................-55 °C to +150 °C
(Temperature rise included)
Storage Temperature
................................-55 °C to +150 °C
Resistance to Soldering Heat
............................. +260 °C for 10 sec.
Moisture Sensitivity Level .....................1
ESD Classification (HBM).................N/A
1
Circuit design, component, PCB trace
0.36 ± 30 %
0.80 ± 20 %
1.40 ± 20 %
2.20 ± 20 %
3.20 ± 20 %
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Inductance
L (μH)
I rms
(A)
23.0
15.0
13.0
9.5
8.0
I sat
(A)
26.0
17.0
14.0
10.0
8.0
DCR
(mΩ) Max.
1.7
3.9
4.4
10.4
8.7
Inductance vs. DC Superposition Characteristics
4.0
4.0
3R2
Inductance ( H) H)
Inductance (
3.0
3.0
3R2
2R2
2.0
2.0
11.00 ± 0.30
(0.422 ± 0.012)
size and thickness, airflow and other
cooling provisions all affect the part
temperature. Part temperature should be
verified in the end application.
Materials
Core ........................................Ferrite ER
Wire ............................Enameled copper
Terminal ....................................Cu/Ni/Sn
Rated Current .....Ind. drops 25 % at Isat
Temperature Rise .....40 °C at rated Irms
Packaging ....... 600 pcs. per 13-inch reel
Product Dimensions
11.00 ± 0.30
(0.422 ± 0.012)
9.35 ± 0.30
(0.368 ± 0.012)
4.50 ± 0.30
(0.177 ± 0.012)
2R2
4.50 ± 0.30
(0.177 ± 0.012)
1.0
1.0
0
0
5
5
10
9.35 ± 0.30
(0.368 ± 0.012)
15
20
20
DC Current (A)
10
15
2.0
2.0
1R4
DC Current (A)
Inductance ( H) H)
Inductance (
1R4
1R4
R80
R80
4.5
R36
(.177)
1.5
(.060)
2.5
(.099)
2.10
(0.083)
TYP.
1.0
1.0
TYP.
1.00
(0.039)
1.50
TYP.
(0.059)
2.0
TYP.
(0.079)
6.0
TYP.
(0.236)
R36
10
10
20
1R4
0
0
0
0
30
30
40
40
TYP.
1.00
(0.039)
1.50
TYP.
(0.059)
2.10
(0.083)
TYP.
DC Current (A)
20
Electrical Schematic
DC Current (A)
Recommended Layout
3.0
(0.118)
5.8
(.228)
3.0
(0.118)
2.0
TYP.
(0.079)
6.0
TYP.
(0.236)
6.0
(0.236)
3.0
(0.118)
3.0
(0.118)
2.8
(0.110)
2.0
(0.079)
1.4
(0.055)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including
annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data
sheet can and do vary in different applications and
actual device performance may vary over time.
Users should verify actual device performance in their
specific applications.
MM
DIMENSIONS:
(INCHES)
3.0
(0.118)
5.8
(.228)
3.0
(0.118)
10.0
(0.394)
6.0
(0.236)
3.0
(0.118)
3.0
(0.118)
2.8
2.0
(0.079)
1.4
(0.055)
SRP1045 Series - Shielded Power Inductors
Soldering Profile
275
225
175
125
75
25
<1> Maximum of 10 seconds
between +255 °C and +260 °C
<1> 255 °C
220 °C
60 seconds
maximum
Ramp Down
5 °C/second
260 °C peak
275
225
175
125
75
25
<1> 5 seconds maximum
at +245 °C
<1> 245 °C
170 °C
150 °C
120 -150 seconds
Temperature (°C)
190°C
150 °C
120-150 seconds
Temperature (°C)
60
m
10 seconds minimum
10 seco
Ramp Up
4 °C/second maximum
0
50
100
150
Ramp Up
4 °C/second maximum
0
50
100
150
200
250
300
Time (Seconds)
Time (Seco
Packaging Specifications
330.0
(13.00)
DIA.
2.0 ± 0.5
(.079 ± .020)
21.0 ± 0.8
(.827 ± .031)
13.0 ± 0.5
(.512 ± .020)
DIA.
50.0 - 0
(1.969 -0)
13.0 ± 0.5
DIA.
(.512 ± .020)
26.0 + 0
(1.024 +0)
END
4.0
(0.157)
16.0
(0.629)
START
1R4
1R4
1R4
1R4
NO COMPONENT
160
(6.299)
MIN.
NO COMPONENT
COMPONENTS
400
(15.748)
MIN.
USER DIRECTION OF FEED
QTY: 600 PCS. PER REEL
REV. 09/17
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Analogue and Mixed Signal
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