|
TC4431EJA |
TC4431EPA |
TC4431EOA |
TC4431CPA |
TC4431COA |
Description |
1.5A high-speed 30v mosfet drivers |
1.5A high-speed 30v mosfet drivers |
1.5A high-speed 30v mosfet drivers |
1.5A high-speed 30v mosfet drivers |
1.5A high-speed 30v mosfet drivers |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
Maker |
TelCom Semiconductor, Inc. (Microchip Technology) |
TelCom Semiconductor, Inc. (Microchip Technology) |
TelCom Semiconductor, Inc. (Microchip Technology) |
TelCom Semiconductor, Inc. (Microchip Technology) |
TelCom Semiconductor, Inc. (Microchip Technology) |
package instruction |
DIP, DIP8,.3 |
DIP, DIP8,.3 |
SO-8 |
DIP, DIP8,.3 |
SO-8 |
Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
Other features |
UNDER VOLTAGE LOCKOUT CIRCUIT |
UNDER VOLTAGE LOCKOUT CIRCUIT |
UNDER VOLTAGE LOCKOUT CIRCUIT |
UNDER VOLTAGE LOCKOUT CIRCUIT |
UNDER VOLTAGE LOCKOUT CIRCUIT |
high side driver |
NO |
NO |
NO |
NO |
NO |
Input properties |
SCHMITT TRIGGER |
SCHMITT TRIGGER |
SCHMITT TRIGGER |
SCHMITT TRIGGER |
SCHMITT TRIGGER |
Interface integrated circuit type |
BUFFER OR INVERTER BASED MOSFET DRIVER |
BUFFER OR INVERTER BASED MOSFET DRIVER |
BUFFER OR INVERTER BASED MOSFET DRIVER |
BUFFER OR INVERTER BASED MOSFET DRIVER |
BUFFER OR INVERTER BASED MOSFET DRIVER |
JESD-30 code |
R-GDIP-T8 |
R-PDIP-T8 |
R-PDSO-G8 |
R-PDIP-T8 |
R-PDSO-G8 |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
8 |
8 |
8 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
70 °C |
70 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
- |
- |
Output characteristics |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
Nominal output peak current |
3 A |
3 A |
3 A |
3 A |
3 A |
Output polarity |
INVERTED |
INVERTED |
INVERTED |
INVERTED |
INVERTED |
Package body material |
CERAMIC, GLASS-SEALED |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
DIP |
DIP |
SOP |
DIP |
SOP |
Encapsulate equivalent code |
DIP8,.3 |
DIP8,.3 |
SOP8,.25 |
DIP8,.3 |
SOP8,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
IN-LINE |
IN-LINE |
SMALL OUTLINE |
IN-LINE |
SMALL OUTLINE |
power supply |
5/30 V |
5/30 V |
5/30 V |
5/30 V |
5/30 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
surface mount |
NO |
NO |
YES |
NO |
YES |
technology |
BICMOS |
BICMOS |
BICMOS |
BICMOS |
BICMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
GULL WING |
Terminal pitch |
2.54 mm |
2.54 mm |
1.27 mm |
2.54 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Disconnect time |
0.1 µs |
0.1 µs |
0.1 µs |
0.1 µs |
0.1 µs |
connection time |
0.11 µs |
0.11 µs |
0.11 µs |
0.11 µs |
0.11 µs |