SOT-363, SOT-86 and SOT-89 packages. All devices are
100% RF and DC tested.
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the ECG002 will work for other various applications within
the DC to 6 GHz frequency range such as CATV and
mobile wireless.
RF IN
ECG002B-G
GND
4
RF In
1
RF Out
3
2
GND
ECG002C-G
GND
1
6
RF OUT
GND
2
5
GND
RF IN
3
4
GND
ECG002F-G
Specifications
(1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Output P1dB
Output IP3
(2)
Test Frequency
Gain
Large-signal Gain
(3)
Output P1dB
Output IP3
(2)
Noise Figure
Device Voltage
Device Current
Typical Performance
(1)
Units
MHz
MHz
dB
dBm
dBm
MHz
dB
dB
dBm
dBm
dB
V
mA
Min
DC
Typ
1000
20
+15.5
+29
2000
19
18
+15
+29
3.8
3.9
45
Max
6000
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
500
20.6
-17
-18
+15.8
+28
3.8
Typical
900
20
-17
-18
+15.5
+29
3.7
1900
19.5
-15
-21
+15
+29
3.8
2140
18.7
-15
-21
+14.9
+29
3.8
17
16
+13
3.5
4.3
1. Test conditions unless otherwise noted: 25 ºC, Supply Voltage = +5 V, Rbias = 24
Ω,
50
Ω
System.
2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Large-signal gain is tested with an input power level of -3 dBm.
Ordering Information
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
Device Current
RF Input Power (continuous)
Junction Temperature
Part No.
ECG002B-G
ECG002C-G
ECG002F-G
ECG002B-PCB
ECG002C-PCB
ECG002F-PCB
Description
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 package)
Rating
-40 to +85
°C
-55 to +150
°C
150 mA
+12 dBm
+250
°C
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-86 package)
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-363 package)
700 – 2400 MHz Fully Assembled Eval. Board
700 – 2400 MHz Fully Assembled Eval. Board
700 – 2400 MHz Fully Assembled Eval. Board
Specifications and information are subject to change without notice
Operation of this device above any of these parameters may cause permanent damage.
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 1 of 7 April 2007
ECG002
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
InGaP HBT Gain Block
Typical Device RF Performance
Supply Bias = +5 V, R
bias
= 24
Ω
, I
cc
= 45 mA
MHz
dB
dB
dB
dBm
dBm
dB
100
21
-18
-17
+15.4
+28
3.9
500
20.6
-17
-17
+15.6
+28
3.8
900
20
-17
-18
+15.5
+29
3.8
1900
19.5
-15
-20
+15
+29
3.8
2140
18.7
-15
-21
+15
+29
3.8
2400
18.2
-15
-22
+15
+29
3.9
3500
16.4
-16
-35
+14.5
5800
13.3
-19
-16
+11
1. Test conditions: T = 25º C, Supply Voltage = +5 V, Device Voltage = +3.9 V, Rbias = 24
Ω,
Icc = 45 mA typical, 50
Ω
System.
2. 3OIP measured with two tones at an output power of -1 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
Gain vs. Frequency
22
20
S11, S22 (dB)
S11, S22 vs. Frequency
0
-5
-10
-15
Icc (mA)
-20
-25
-30
-35
-40
3000
0
1
2
3
4
Frequency (GHz)
5
6
S22
60
40
20
0
3.00
120
100
Vde vs. Icc
Gain (dB)
S11
80
+25C
18
16
14
+25C
12
500
1000
-40C
+85C
2500
1500
2000
Frequency (MHz)
3.20
3.40
3.60
3.80
4.00
4.20
4.40
Vde (V)
OIP3 vs. Frequency
32
30
OIP3 (dBm)
Noise Figure vs. Frequency
4.5
4
3.5
3
2.5
P1dB (dBm)
NF (dB)
20
18
16
14
12
P1dB vs. Frequency
28
26
+25C
24
500
1000
1500
-40C
2000
+85C
2500
3000
+25C
2
500
1000
1500
Frequency (MHz)
2000
10
500
1000
-40C
+85C
2500
3000
Frequency (MHz)
1500
2000
Frequency (MHz)
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 2 of 7 April 2007
ECG002
Vcc
Icc = 45 mA
InGaP HBT Gain Block
Recommended Application Circuit
ECG002C-PCB
R4
Bias
Resistor
C4
Bypass
Capacitor
C3
0.018 µF
L1
RF Choke
RF IN
ECG002
C1
Blocking
Capacitor
C2
Blocking
Capacitor
RF OUT
ECG002B-PCB
ECG002F-PCB
Reference
Designator
L1
C1, C2, C4
50
820 nH
.018 µF
Recommended Component Values
Frequency (MHz)
500
900
1900
2200
220 nH
68 nH
27 nH
22 nH
1000 pF
100 pF
68 pF
68 pF
2500
18 nH
56 pF
3500
15 nH
39 pF
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig.
L1
C1, C2
C3
C4
R4
Value / Type
39 nH wirewound inductor
56 pF chip capacitor
0.018
µF
chip capacitor
Do Not Place
24Ω 1% tolerance
Size
0603
0603
0603
0805
Recommended Bias Resistor Values
Supply
R1 value
Size
Voltage
5V
24.4 ohms
0805
6V
46.7 ohms
0805
8V
91 ohms
1210
9V
113 ohms
1210
10 V
136 ohms
2010
12 V
180 ohms
2010
The proper value for R1 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +5 V. A
1% tolerance resistor is recommended.
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 3 of 7 April 2007
ECG002
InGaP HBT Gain Block
ECG002B-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260
°C
reflow temperature) and leaded (maximum 245
°C
reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an
“E002G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“E002” designator followed by an
alphanumeric lot code; it may also have been
marked with a “C” designator followed by a
3-digit numeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260
°C
convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board
to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
Rating
-40 to +85
°C
131
°C/W
Specifications and information are subject to change without notice
WJ Communications, Inc
•
Phone 1-800-WJ1-4401
•
FAX: 408-577-6621
•
e-mail: sales@wj.com
•
Web site: www.wj.com
Page 4 of 7 April 2007
ECG002
InGaP HBT Gain Block
ECG002C-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the pins is annealed matte tin over copper. It is compatible with
both lead-free (maximum 260
°C
reflow temperature) and leaded (maximum 245
°C
reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with a two-
digit numeric lot code (shown as “XX”)
followed with a “K” designator on the top
surface of the package. The obsolete tin-lead
package is marked with a two-digit numeric
lot code followed with a “J” designator; it
may also have been marked with a “J”
designator followed by a two-digit lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260
°C
convection reflow
Standard:
JEDEC Standard J-STD-020
Land Pattern
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board
to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
Rating
-40 to +85
°C
233
°C/W
Specifications and information are subject to change without notice
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