BC338 datasheet, PDF - EEWORLD Datasheet

BC338: DescriptionTO-92 plastic-encapsulate transistors; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

View All

BC338 Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	BC338	-	-	View	Buy Now

BC338 Overview

TO-92 plastic-encapsulate transistors

Recommended Resources

Homemade subwoofer playback system 01

AVK200 home theater amplifier and maintenance 05

Adjustable low power DC-DC converter circuit

Z5163 vertical drilling machine electrical schematic circuit

Basic feedback amplifier circuit

Ceiling fan installed speed control indicator circuit

Research on High Voltage Resonant Transformer: Abstract: The principle, design method and several issues that should be paid attention to in the development of resonant transformers are discussed, and the accuracy and practicality of the calculati...; zbz0529 Analog electronics

What TI DSP Power Knows: Multicore DSP implementations require intelligent power management given the plethora of voltage and current requirements for the core, memory, I/O, and other rails. An important performance benchmark...; Jacktang DSP and ARM Processors

Xilinx FPGA Development Tools: Xilinx FPGA development tools, a good platform for chip function verification...; kangyunsi FPGA/CPLD

The universal tool for impedance measurement: [i=s]This post was last edited by qwqwqw2088 on 2019-3-19 16:01[/i] [size=4][color=#000000][backcolor=white]Who doesn't know Ohm's law? [/backcolor][/color][/size] [size=4][color=#000000][backcolor=wh...; qwqwqw2088 Analogue and Mixed Signal

Common data structures in RT-Thread system: Common data structures Singly linked list, bidirectional linked list, intrusive linked list The reference structure types of three linked lists in the RT-Thread system are as follows: // rtdef.h/*** S...; ID.LODA Embedded System

Advice for beginners of DLP4500 light modulation.: [i=s]This post was last edited by alan000345 on 2018-12-21 10:48[/i] How to control the lightcrafter4500 and what software do you need to download to program and burn into the development board to fin...; alan000345 DSP and ARM Processors

Popular Components