NAND02GR3B2AZB1 datasheet, PDF

NAND02GR3B2AZB1: DescriptionFlash, 256MX8, PBGA63, 9.50 X 12 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, TFBGA-63; Categorystorage storage; File Size825KB，57 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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NAND02GR3B2AZB1 Overview

Flash, 256MX8, PBGA63, 9.50 X 12 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, TFBGA-63

Parameter Name	Attribute value
Maker	Micron Technology
Parts packaging code	BGA
package instruction	TFBGA,
Contacts	63
Reach Compliance Code	unknown
ECCN code	EAR99
JESD-30 code	R-PBGA-B63
length	12 mm
memory density	2147483648 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of terminals	63
word count	268435456 words
character code	256000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256MX8
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Programming voltage	1.8 V
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	9.5 mm

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