NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX6DQAEC
Rev. 6, 11/2018
MCIMX6QxAxxxxC
MCIMX6QxAxxxxD
MCIMX6QxAxxxxE
MCIMX6DxAxxxxC
MCIMX6DxAxxxxD
MCIMX6DxAxxxxE
i.MX 6Dual/6Quad
Automotive and
Infotainment
Applications
Processors
Package Information
FCPBGA Package
21 x 21 mm, 0.8 mm pitch
Ordering Information
See
Table 1
1
Introduction
1
The i.MX 6Dual/6Quad automotive and infotainment
processors represent the latest achievement in integrated
multimedia applications processors. These processors
are part of a growing family of multimedia-focused
products that offer high-performance processing with a
high degree of functional integration. These processors
target the needs of the growing automotive infotainment,
telematics, HMI, and display-based cluster markets.
The i.MX 6Dual/6Quad processors feature advanced
implementation of the quad Arm
®
Cortex
®
-A9 core,
which operates at speeds up to 1 GHz. They include 2D
and 3D graphics processors, 1080p video processing,
and integrated power management. Each processor
provides a 64-bit DDR3/DDR3L/LPDDR2 memory
interface and a number of other interfaces for connecting
peripherals, such as WLAN, Bluetooth
®
, GPS, hard
drive, displays, and camera sensors.
The i.MX 6Dual/6Quad processors are specifically
useful for applications such as the following:
• Automotive navigation and entertainment
2
3
4
5
6
7
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.3 Signal Naming Convention . . . . . . . . . . . . . . . . . . . 8
Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1 Special Signal Considerations. . . . . . . . . . . . . . . . 19
3.2 Recommended Connections for Unused Analog
Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 20
4.2 Power Supplies Requirements and Restrictions . . 33
4.3 Integrated LDO Voltage Regulator Parameters . . 34
4.4 PLL Electrical Characteristics . . . . . . . . . . . . . . . . 36
4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . 37
4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38
4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 44
4.8 Output Buffer Impedance Parameters. . . . . . . . . . 49
4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 53
4.10 Multi-Mode DDR Controller (MMDC). . . . . . . . . . . 64
4.11 General-Purpose Media Interface (GPMI) Timing. 64
4.12 External Peripheral Interface Parameters . . . . . . . 73
Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 138
5.1 Boot Mode Configuration Pins. . . . . . . . . . . . . . . 138
5.2 Boot Devices Interfaces Allocation . . . . . . . . . . . 139
Package Information and Contact Assignments . . . . . . 141
6.1 Signal Naming Convention . . . . . . . . . . . . . . . . . 141
6.2 21 x 21 mm Package Information . . . . . . . . . . . . 141
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
NXP Reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
Introduction
•
•
•
Graphics rendering for Human Machine Interfaces (HMI)
High-performance speech processing with large databases
Audio playback
The i.MX 6Dual/6Quad processors offers numerous advanced features, such as:
• Multilevel memory system—The multilevel memory system of each processor is based on the L1
instruction and data caches, L2 cache, and internal and external memory. The processors support
many types of external memory devices, including DDR3, DDR3L, LPDDR2, NOR Flash,
PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND™, and managed NAND,
including eMMC up to rev 4.4/4.41.
• Smart speed technology—The processors have power management throughout the device that
enables the rich suite of multimedia features and peripherals to consume minimum power in both
active and various low power modes. Smart speed technology enables the designer to deliver a
feature-rich product, requiring levels of power far lower than industry expectations.
• Dynamic voltage and frequency scaling—The processors improve the power efficiency of devices
by scaling the voltage and frequency to optimize performance.
• Multimedia powerhouse—The multimedia performance of each processor is enhanced by a
multilevel cache system, Neon
®
MPE (Media Processor Engine) co-processor, a multi-standard
hardware video codec, 2 autonomous and independent image processing units (IPU), and a
programmable smart DMA (SDMA) controller.
• Powerful graphics acceleration—Each processor provides three independent, integrated graphics
processing units: an OpenGL
®
ES 2.0 3D graphics accelerator with four shaders (up to 200 MTri/s
and OpenCL support), 2D graphics accelerator, and dedicated OpenVG™ 1.1 accelerator.
• Interface flexibility—Each processor supports connections to a variety of interfaces: LCD
controller for up to four displays (including parallel display, HDMI1.4, MIPI display, and LVDS
display), dual CMOS sensor interface (parallel or through MIPI), high-speed USB on-the-go with
PHY, high-speed USB host with PHY, multiple expansion card ports (high-speed MMC/SDIO host
and other), 10/100/1000 Mbps Gigabit Ethernet controller, and a variety of other popular interfaces
(such as UART, I
2
C, and I
2
S serial audio, SATA-II, and PCIe-II).
• Automotive environment support—Each processor includes interfaces, such as two CAN ports, an
MLB150/50 port, an ESAI audio interface, and an asynchronous sample rate converter for
multichannel/multisource audio.
• Advanced security—The processors deliver hardware-enabled security features that enable secure
e-commerce, digital rights management (DRM), information encryption, secure boot, and secure
software downloads. The security features are discussed in detail in the i.MX 6Dual/6Quad
security reference manual (IMX6DQ6SDLSRM).
• Integrated power management—The processors integrate linear regulators and internally generate
voltage levels for different domains. This significantly simplifies system power management
structure.
i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors, Rev. 6, 11/2018
2
NXP Semiconductors
Introduction
1.1
Ordering Information
Table 1
shows examples of orderable part numbers covered by this data sheet. This table does not include
all possible orderable part numbers. The latest part numbers are available on
nxp.com/imx6series.
If your
desired part number is not listed in the table, or you have questions about available parts, see
nxp.com/imx6series
or contact your NXP representative.
Table 1. Example Orderable Part Numbers
Part Number
MCIMX6Q6AVT10AC
MCIMX6Q6AVT10AD
MCIMX6Q6AVT10AE
MCIMX6Q4AVT10AC
MCIMX6Q4AVT10AD
MCIMX6Q4AVT10AE
MCIMX6Q6AVT08AC
MCIMX6Q6AVT08AD
MCIMX6Q6AVT08AE
MCIMX6Q4AVT08AC
MCIMX6Q4AVT08AD
MCIMX6Q4AVT08AE
MCIMX6D6AVT10AC
MCIMX6D6AVT10AD
MCIMX6D6AVT10AE
MCIMX6D4AVT10AC
MCIMX6D4AVT10AD
Quad/Dual CPU
i.MX 6Quad
i.MX 6Quad
i.MX 6Quad
i.MX 6Quad
i.MX 6Quad
i.MX 6Quad
i.MX 6Quad
i.MX 6Quad
i.MX 6Quad
i.MX 6Quad
i.MX 6Quad
i.MX 6Quad
i.MX 6Dual
i.MX 6Dual
i.MX 6Dual
i.MX 6Dual
i.MX 6Dual
Options
Includes VPU, GPU
Includes VPU, GPU
Includes VPU, GPU
Includes GPU,
no VPU
Includes GPU,
no VPU
Includes GPU,
no VPU
Includes VPU, GPU
Includes VPU, GPU
Includes VPU, GPU
Includes GPU,
no VPU
Includes GPU,
no VPU
Includes GPU,
no VPU
Includes VPU, GPU
Includes VPU, GPU
Includes VPU, GPU
Includes GPU,
no VPU
Includes GPU,
no VPU
Speed
1
Grade
1 GHz
1 GHz
1 GHz
1 GHz
1 GHz
1 GHz
852 MHz
852 MHz
852 MHz
852 MHz
852 MHz
852 MHz
1 GHz
1 GHz
1 GHz
1 GHz
1 GHz
Temperature
Grade
Automotive
Automotive
Automotive
Automotive
Automotive
Automotive
Automotive
Automotive
Automotive
Automotive
Automotive
Automotive
Automotive
Automotive
Automotive
Automotive
Automotive
Package
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors, Rev. 6, 11/2018
NXP Semiconductors
3
Introduction
Table 1. Example Orderable Part Numbers (continued)
Part Number
MCIMX6D4AVT10AE
MCIMX6D6AVT08AC
MCIMX6D6AVT08AD
MCIMX6D6AVT08AE
MCIMX6D4AVT08AC
MCIMX6D4AVT08AD
MCIMX6D4AVT08AE
1
Quad/Dual CPU
i.MX 6Dual
i.MX 6Dual
i.MX 6Dual
i.MX 6Dual
i.MX 6Dual
i.MX 6Dual
i.MX 6Dual
Options
Includes GPU,
no VPU
Includes VPU, GPU
Includes VPU, GPU
Includes VPU, GPU
Includes GPU,
no VPU
Includes GPU,
no VPU
Includes GPU,
no VPU
Speed
1
Grade
1 GHz
852 MHz
852 MHz
852 MHz
852 MHz
852 MHz
852 MHz
Temperature
Grade
Automotive
Automotive
Automotive
Automotive
Automotive
Automotive
Automotive
Package
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
21 mm x 21 mm, 0.8 mm
pitch, FCPBGA (lidded)
If a 24 MHz input clock is used (required for USB), the maximum SoC speed is limited to 996 MHz
.
Figure 1
describes the part number nomenclature to identify the characteristics of the specific part number
you have (for example, cores, frequency, temperature grade, fuse options, silicon revision).
Figure 1
applies to the i.MX 6Dual/6Quad.
The two characteristics that identify which data sheet a specific part applies to are the part number series
field and the temperature grade (junction) field:
• The i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors data sheet
(IMX6DQAEC) covers parts listed with “A (Automotive temp)”
• The i.MX 6Dual/6Quad Applications Processors for Consumer Products data sheet (IMX6DQCEC)
covers parts listed with “D (Commercial temp)” or “E (Extended Commercial temp)”
• The i.MX 6Dual/6Quad Applications Processors for Industrial Products data sheet (IMX6DQIEC)
covers parts listed with “C (Industrial temp)”
The Ensure that you have the right data sheet for your specific part by checking the temperature grade
(junction) field and matching it to the right data sheet. If you have questions, see nxp.com/imx6series or
contact your NXP representative.
i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors, Rev. 6, 11/2018
4
NXP Semiconductors
Introduction
MC
Qualification level
Prototype Samples
Mass Production
Special
IMX6
MC
PC
MC
SC
X
@
+
VV
$$
%
A
Silicon revision
1
Rev 1.2
Rev 1.3
Rev 1.6
A
C
D
E
Part # series
i.MX 6Quad
i.MX 6Dual
Part differentiator
X
Q
D
@
7
6
5
4
Fusing
Default setting
HDCP enabled
%
A
C
Frequency
800 MHz
2
(Industrial grade)
852 MHz (Automotive grade)
1 GHz
3
1.2 GHz
$$
08
08
10
12
RoHS
Industrial with VPU, GPU, no MLB
Automotive with VPU, GPU
Consumer with VPU, GPU
Automotive with GPU, no VPU
Temperature Tj
Extended commercial: -20 to +105
°
C
Industrial: -40 to +105
°
C
Automotive: -40 to +125
°
C
+
E
C
A
Package type
FCPBGA 21x21 0.8mm (lidded)
FCPBGA 21x21 0.8mm (non lidded)
VT
YM
1. See the nxp.com\imx6series Web page for latest information on the available silicon revision.
2. If a 24 MHz input clock is used (required for USB), the maximum SoC speed is limited to 792 MHz.
3. If a 24 MHz input clock is used (required for USB), the maximum SoC speed is limited to 996 MHz.
Figure 1. Part Number Nomenclature—i.MX 6Quad and i.MX 6Dual
1.2
Features
The i.MX 6Dual/6Quad processors are based on Arm Cortex-A9 MPCore platform, which has the
following features:
• Arm Cortex-A9 MPCore 4xCPU processor (with TrustZone
®
)
• The core configuration is symmetric, where each core includes:
— 32 KByte L1 Instruction Cache
— 32 KByte L1 Data Cache
— Private Timer and Watchdog
— Cortex-A9 NEON MPE (Media Processing Engine) Co-processor
The Arm Cortex-A9 MPCore complex includes:
• General Interrupt Controller (GIC) with 128 interrupt support
• Global Timer
• Snoop Control Unit (SCU)
• 1 MB unified I/D L2 cache, shared by two/four cores
• Two Master AXI (64-bit) bus interfaces output of L2 cache
i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors, Rev. 6, 11/2018
NXP Semiconductors
5
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