Digital Signal Processors & Controllers - DSP, DSC C6-INTEGRA DSP+ARM PROCESSOR
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Texas Instruments |
Parts packaging code | BGA |
package instruction | LFBGA, BGA361,19X19,32 |
Contacts | 361 |
Reach Compliance Code | compliant |
Factory Lead Time | 1 week |
Other features | ALSO OPERATES AT 1.2 V AND 1.1 V TYP |
JESD-30 code | S-PBGA-B361 |
JESD-609 code | e1 |
length | 16 mm |
Humidity sensitivity level | 3 |
Number of terminals | 361 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Encapsulate equivalent code | BGA361,19X19,32 |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 1.2,1.8/3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.4 mm |
Maximum supply voltage | 1.05 V |
Minimum supply voltage | 0.95 V |
Nominal supply voltage | 1 V |
surface mount | YES |
technology | CMOS |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 16 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR CIRCUIT |