Low-Power Single 2-Input Positive-OR Gate 5-DSBGA -40 to 85
Parameter Name | Attribute value |
Brand Name | Texas Instruments |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Texas Instruments |
Parts packaging code | BGA |
package instruction | VFBGA, BGA5,2X3,20 |
Contacts | 5 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Factory Lead Time | 1 week |
series | AUP/ULP/V |
JESD-30 code | R-XBGA-B5 |
JESD-609 code | e1 |
length | 1.4 mm |
Load capacitance (CL) | 30 pF |
Logic integrated circuit type | OR GATE |
MaximumI(ol) | 0.004 A |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of entries | 2 |
Number of terminals | 5 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Output characteristics | 3-STATE |
Package body material | UNSPECIFIED |
encapsulated code | VFBGA |
Encapsulate equivalent code | BGA5,2X3,20 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
method of packing | TR |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 1.2/3.3 V |
Maximum supply current (ICC) | 0.0009 mA |
Prop。Delay @ Nom-Sup | 26.7 ns |
propagation delay (tpd) | 26.7 ns |
Certification status | Not Qualified |
Schmitt trigger | NO |
Maximum seat height | 0.5 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 0.8 V |
Nominal supply voltage (Vsup) | 1.2 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 0.5 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 0.9 mm |